SU1323277A1 - Tinning apparatus - Google Patents

Abstract

The invention relates to the field of soldering and is intended for the tinning of the leads of the microcircuits in preparation for soldering. The purpose of the invention is to improve the performance of the device. The device contains a reservoir 1 with liquid solder 2, holders 3 of the microcircuit 4. In the reservoir 1 there are baths 10 for tinning. The device is equipped with a mechanism for immersing the leads in the solder by lifting the baths 10. The conveyor 7 can be moved in a horizontal plane and in a vertical plane. In the latter case, it is possible tinning simultaneously on both sides of the findings. The device can be made with a flexible tape in which the petals form a groove for filling it with solder. The flexible tape is moved at the same speed as the holders 3. Improving the performance of tinning is achieved by the fact that at the time of tinning there is no need to stop the holder with the microcircuit, and their continuous movement ensures an accelerated cycle, which depends only on the speed of movement. The performance of the device depends only on the length of the working zone of the tin. 3 hp f-ly, 9 ill. CL co to co Fig 1

Description

The invention relates to soldering devices and can be used in preparation for the soldering of the outputs of radio radio elements, including microcircuits,

The purpose of the invention is to improve the performance of the device.

FIG. shows the proposed device, the cut; figure 2 is the same, top view; fig. 3 - the same, first embodiment; figure 4 - section aa on fig.Z; Fig. 5 is a device, second embodiment, top view; nafig.6 - section bb in fig.Z; figure 7 is flexible tape, top view; Fig.8 is a section b-ka ka 7; FIG. 9 is a view of FIG. 7.

The device for tinning (Figures 1 and 2) contains a reservoir 1 (main bath) with molten solder 2 (heating elements not shown). Holders 3 of microcircuits 4 with leads 5 are installed on conveyor 6 (in this variant, conveyor 6 is stepping). The holders 3, made in the form of a housing with guides and a spring, are mounted on the conveyor 6 with the possibility of rotation 90 and 180 (the rotation mechanism is not shown). Reservoir 1 contains an additional conveyor 7 made in the form of a chain. In the openings of the sleeves 8 of the conveyor 7, the rods 9 are movably mounted. Baths 10 are placed on the rods 9 for tinning (additional baths). The rods 9 are clamped to the cam 11 by the springs 12. The conveyor 7 is tensioned with asterisks 13 on the axes 14. To prevent its deflection, serves the guide 15. The drive of the conveyor 7 is made in the form of grips 16 mounted on the conveyor 17, having obvodu conveyor 6, interacting 1x with baths 10. Thus, equalization of movement speeds of conveyor 6 with holders 3 and conveyor 7 with baths 10 is achieved. Cam profile 11 is configured to lift baths 10 in a zone of tinning above the solder level before immersion in the solder of baths 10 exits 5 microcircuits 4 and with the possibility of lowering the baths under the action of springs 12 below the level of solder in the reservoir 1 as they exit from the tinning zone. The cam profile can also provide a section for lowering the baths 10 when the holder is rotated 180 ° and is raised.

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for dipping in solder the leads of the second side of the microcircuit (for tinning the second side a separate bath can be provided, and between the baths with solder there is a bath with flux for dipping the leads of the second side into it). Outside the tinning zone, the baths 10 are placed below the level, soldered 2. The arrows indicate the direction of movement of the conveyors 6 and 7. In Fig. 2, the device is conventionally shown without solder. The cam 11 can be made movable, with the possibility of adjusting its height by setting the height of the baths lifting 10. Cam 11 is designed to control the movement of the baths 10 perpendicular to the direction of movement of the conveyor 7 in the horizontal plane. Figures 3 and 4 show an embodiment of a pooling device containing two tanks 1, HeHHix, which can be moved relative to each other (not shown) to set up the device on an irradiated type of microcircuits. Each tank is equipped with a conveyor 7, the movement of which is carried out in a vertical plane. The baths 10 are slotted with the possibility of being held there by capillary forces when lifting from the reservoir 1. The width of the slit can be 0.5-1.5 mm. The baths are installed on the conveyor 7 in such a way that, in the zone of tinning of the conclusions, they form a common single slot 18. The holder 3 is made in the form of a multi-socket cassette. The conveyor 7 is driven by the wheels 19 from the conveyor 6 (for example, a rack and pinion), the conveyor 6 is placed between the tanks 1, the Cam 11 is intended to be fed into the bathing zone of the baths 0 before immersing the leads 5 of the microcircuit 4.

Figures 5 and 6 show an embodiment of a tin-plating device comprising two reservoirs 1 configured to extend them to attack the device on a serviceable type of microcircuit. Between the tanks 1 is placed the holder of the microcircuit 4 on the conveyor 6. The holder 3 is made in the form of a multi-socket cassette. In each tank 1, a flexible tape 20 forming a slotted cavity in rectilinear sections is movably closed. In the zone of tinning in the tanks 1, windows are made overlapping the slots of the flexible tape 20, which serve as baths for the tinning. The inner surface of the slit tape made wettable solder. The width of the slit cavity is equal to the width of the slit in the slit baths, i.e. 0.5-1.5 mm. The belt drive is shown as pulleys 21, 22 and 23, Pulley 22 is driven by wheels 24 from conveyor 6. For guiding belt 20 in tank 1, the latter is equipped with guides 25 and 26. At sections of the bend of belt 20, the body n guides are formed with tape 20 gaps of 0.050, 2 mm, which are sufficient for the second side of the chip to move the tape, but not sufficient to protrude the bath 10, it is necessary to solder them solder, since the profile of cam 11 (possibly rial 27 of tank 1 and direction lowering the bath 10 below the level of 25 and 26 made with surfaces, in the tank 1). Mic soaked solder holder. For improved, 20 roskhemy turn on 180.

Neither movement of the tape 20 on it can be perforated holes, and on the pulleys 22 and 23 - protrusions (not shown) corresponding to these holes. Tape 20 interacts with solder 2 in reservoir 1 in a straight section opposite to the tinning zone. The arrows indicate the direction of movement of the holder 3 and flax. With the further movement of the conveyors 6 and 7, the cam 11 lifts the bath 10 before the microcircuit terminals are immersed in it. After holding the terminals in the solder, the bath 10 is lowered, and the holder enters the discharge position. In this embodiment, the cycle time depends only

on load time - micro upload

You are 20. The device can be supplied with a 30 circuit, which can be equal to 1 s.

but the cleaning mechanism of solder, vyol-At the same time, the capacity of the device as a partition, the installation is equal to 3,600 chips per hour. tape in the slot cavity in the zone The difference in the operation of the device, while interacting with solder 2 in the reservoir of FIG. 3 and 4, consists in

voire 1 (not shown). Tape. 20 snab-35 g ° holder 3 provides

wife curved petals 28, form a continuous flow of chips 4. When w, they slit cavity. The width of the petrol conveyor 7, driven by the conveyor 6, on which the holder 3 is mounted, can also be 1-3 mm, the gap depth is 5-6 mm. The tape is shown with perforated holes 29 (Fig. 9).

The device works as follows.

In the embodiment shown in FIG. and 2, the conveyor 6 is made step by step in connection with TBMj that it needs to be stopped for loading and unloading the chips. The loading position is shown.

45 temporarily servicing the findings of both sides of the chip. The placement of the baths 10 can be coordinated with the placement of the microcircuits in the holder 3, however, when a common slot is formed, this is not necessary.

on the left, and on the right on the conveyor 6. At the loading position in der-50telno. After holding the terminals, the chip 3 is inserted into the receiver 3. The bath 10 is retracted to the initial position of the conveyor by one step relative to the conveyor 7. Porter 6, the holder 3 is rotated. The conveyor is moved by 90 ° further to set the leads in a vertical direction. provides immersion in the solder plane (the mechanism of rotation of 55sleak baths 10.

holder 3 is not shown). The baths 10 on the conveyor 7 synchronously with the conveyor 6 are moved in the reservoir 1. In the zone of the tinning, the formula of the invention is carried out

1, A tinning device containing a molten solder bath.

The cam 11 when moving the conveyor 7 lifts the baths 10 above the level of solder in the tank before being immersed in the solder in the bath 10 of the terminals 5 to the required depth. When the bath 10 is lifted, the spring 9 is compressed, bringing the bath back to its original position when the profile - cam 11 is lowered. The conclusions are kept in the solder for no more than 2 s. During this time, the conveyor 6 can work several moves, but the bath 10 is stationary relative to the terminals 5 immersed in its solder. For tinning

Upon further movement of the conveyors 6 and 7 by the cam 11, the bath 10 is lifted before the microcircuit terminals are immersed in it. After holding the terminals in the solder, the bath 10 is lowered, and the holder enters the discharge position. In this embodiment, the cycle time depends only

continuous feed of chips 4. When

This conveyor 7, driven from the conveyor 6, on which the holder 3 is mounted, also moves continuously and at the same speed as the conveyor 6. In the working zone of the bath 10, the cam 11 is fed to the solder to the desired depth. At the same time serve the findings of both sides of the chip. The placement of the baths 10 can be coordinated with the placement of the microcircuits in the holder 3, however, when a common slot is formed, this is not necessary.

tel. After holding the leads in the bath 10, they are retracted relative to the conveyor 7. A further movement of the conveyor y ensures immersion in the solder of the spent bath 10.

Claims (4)

Invention Formula 1, A tinning device containing a molten solder bath. 5132 a conveyor with part holders and a drive for its movement, characterized in that, in order to increase productivity, it is equipped with an additional conveyor with additional baths sequentially fixed on it, while the additional baths are installed with possibility of interaction with the main bath. 2. The device according to and, 1, characterized in that, in order to form a single rectilinear slit in the zone of the tinning, the additional baths are made slit and mounted on 776 a conveyor without clearance relative to one another, 3. The device according to PP, 1 and 2, o t is different in that the additional baths are made in the form of a closed flexible tape with a slotted cavity for soldering, at the same time at least part of the tape is placed in the main bath, 4. The device according to claims 1 and 2, T - characterized by the fact that the additional baths are installed with the possibility of reciprocating relative to the conveyor. G2 // figl 5 years ; 2 fus7 in cpas.3 Compiled E.Tyutchenkova Editor M.Dylyn Tehred I.Popovich Proofreader M.Demchik Order 2907/15 Circulation 975 Subscription VNIIPI USSR State Committee for inventions and discoveries 113035, Moscow, Zh-35, Raushsk nab., 4/5 Production and printing company, Uzhgorod, st. Project, 4