SU1289661A1 - Apparatus for producing spherical metallographic specimen - Google Patents

Abstract

The invention relates to the abrasive processing of materials and can be used in the electronics industry when monitoring the electrical parameters of semiconductor structures. The purpose of the invention is to increase the productivity and quality of processing. The device contains fixed on the massive base 1 electric motor 2, spindle 3 in two angular contact bearings 4 and item 1-n, w table 5 (CA). The ball grinder 6 is placed on the end of the spindle 3, made in the form of a funnel 7. PS 5 consists of a slide 8, a lock 9 position of the slide, a holder (D) 10 of the sample with a vacuum sucker 1I, a mechanism for pressing the sample to the grinder 6 in the form of an electromagnetic coil an electromechanical relay and a lever fixing the initial position of the holder 10. D 10 is connected to the bracket 15 (K) via the hinge 17. The K 15 is connected to the slider 8 through the hinge and contains a lock of the specified angle of rotation. 2 Il. & Ate 7g 0 JS 2 8 th oo with O)

Description

1128

The invention relates to the abrasive processing of materials and can be used in the electronics industry in controlling the electrophysical parameters of semiconductor structures.

The purpose of the invention is to increase the productivity and quality of processing by shifting the place of pressing the sample to the grinder in its adjacent zones.

In Fig.1 schematically shows the proposed device, general view; figure 2 is the same, top view.

The device contains a motor 2 fixed on a massive base I, a spindle 3 in two radio-thrust bearings 4 and an object table 5. The ball grinder 6 is placed on the face part of a spindle-3, w. Made in the form of a funnel 7. Object stage 5 It consists of a slider 8, a latch 9, a position of the slider, a sample holder 10 with a vacuum suction cup 11, a sample pressing mechanism to a grinder 6 in view, an electromagnet, a thread coil 12 and an electromechanical relay 13 with a lever 14 fixing the initial position of the holder 10, Holder 10 st behind n with the bracket 15 through the hinge 6. The bracket 15 is connected to the slider 8 through the hinge 17 and contains the latch 18 of a given angle of rotation. On the device panel 19, there is a switch for turning on the grid voltage, adjusting the grinding time and the speed of rotation of the ball, the buttons for turning the ball and grinding the grinding, warning lights for the network and the cryptographic mode (not shown).

The device works as follows.

Before processing a batch of samples, turning the crochet stitch 15 in the hinge 17, provide the angle of rotation of the sample plane relative to the direction of movement of the slide 8, the value of which corresponds to the required degree of displacement of the grinding point along the height of the grinder after moving the slide 8 for making the next cut, and secured with a clamp 18 . Install the sanding 6 on the funnel 7 and turn it on. The sample is placed on a vacuum suction device 1i, the vacuum is turned on and the holder 10 is turned by a swivel 16 at

,

.-

25

966

five

0

 -

45 50 55 30

35

40

2

water in contact with the lever 14. while the sample plane is fixed at a distance of 0.5-2 mm from the grinder 6 due to the force of the electromagnetic coil 12,

A diamond paste is applied to the grinder 6 with a tampon, blocking all the grinding strokes along the height of the grinder 6, Remove the excess paste and binder liquid with a clean swab, which creates a thin, uniform abrasive layer) willow on the grinder 6 (such as abrasive technology compared to the drop method provides higher grinding speeds and quality of grinding when measuring fake structures using a large diameter ball). Pressing the button switches on grinding mode, relay 13 triggers, lever 4 releases The holder 10, and the sample electromagnetic coil 12 is pressed against the grinder 6,

The pressing force is controlled by the current in the coil 12. When the grinding time is set, the relay 13 is activated and the lever 14 deflects the holder 10 together with the suction cup 11 and the sample from the grinder 6 to the initial position. Fixing the specimen in the initial position, automatically pressing it to the: grinder and deviation after processing in the gap from 0.5 to: 2 mm reduces the probability of dissolving, nor the specimens forming microtree to deform the grinder 6, which additionally results and processing quality

The specimen distance from the grinder is less than 0.5 mm. This is due to the likelihood of premature approach of the sample due to the play of the chassis of the device and contact with the abrasive sample. The distance of more than 2 mm is nonrachonic, since under these conditions the rotational speed of the holder 10 after its release by the clamp 14 manages to reach such values at which the probability of cracking of the sample increases when it comes in contact with the polisher 6,

Loosen the lock 9 sec. The rim of the slider 8 will mix the holder 10 to make the next cut on the sample at a point that meets the requirements of the technical conditions.

312

fix the slider 8 with retainer 9 and turn on the grinding mode. The operation is repeated until the required number of thin sections is made, for example, five, at predetermined points. At the next movement of the slide 8, due to the specially created and fixed rotation of the sample plane from the direction of this movement (by turning the bracket 15 in the hinge 17), the place of pressing the sample to the grinder 6 is shifted along the axis of rotation of the latter to the area with the unused abrasive BM.

.

The optimal variant of the device is the use of a 150 mm diameter grinding machine for producing 3-5 spherical thin sections on one sample while monitoring the electrophysical parameters of thin and ultrathin semiconductor films with increased accuracy and productivity. For example, with a rotation speed of a grinder of 900 rpm, using an AFM paste, the grinding time of silicon structures to a depth of 5 µm does not exceed 15 s,

In this case, the angle of rotation of the sample by the crogapteine 15 is adjusted so that the edges of the adjacent spent grinding zones on the grinder are 50 to 100% of their width from each other.

Claims (1)

Invention Formula A device for manufacturing a spherical cut, comprising a drive with ball grinding, a swivel sample holder mounted on a slider mounted for reciprocating movement, and a mechanism for pressing the sample to the grinder, in order to improve the performance and quality of the grinding The device is equipped with a sample holder and a clamping mechanism mounted on a slider with the possibility of rotation and fixation about an axis perpendicular to the axis of rotation. oroty of the sample holder, which is located parallel to the yush direction, and for moving the slider. Editor L.Povkhan Compiled by A. Kozlov Tehred V. Kadar Order 7852/14 Circulation 738 Subscription VNIIPI USSR State Committee for inventions and discoveries 113035, Moscow, Zh-35, Raushsk nab., 4/5 Production and printing company, Uzhgorod, st. Project, 4 phi5.2 Proofreader, L, Pilipenko