SU1243164A1 - Device for cooling radio-electronic equipment - Google Patents

Abstract

The invention relates to the field of designing electronic equipment. The purpose of the invention is to increase the efficiency of cooling, automatic regulation by providing individual cooling, due to the fact that. Each radiator 3 is installed plate (P) 7 of a material having a shape memory effect. The free end of the P 7 through a system of levers is connected to a movable valve 9 placed in the exhaust channel 6 filled with refrigerant. The angle of inclination P 7 is determined by the temperature of the integrated circuit 4. For example, when the temperature of the integrated circuit 4 approaches the critical operating temperature P 7 occupies a position parallel to the plane of the radiator. The surface of the valve 9 is parallel to the flow of the refrigerant. 1 hp f-ly, 3 ill. i (L -s N5 4: SO od 4 tsig.z

Description

one

The invention relates to the design of heat sinks, in particular heat sinks for integrated circuits (ICs),

The aim of the invention is to increase the cooling efficiency, automatic regulation by providing individual cooling of each electronic circuit.

Changing the configuration of the plate when it is heated from the IC entails controlling the flow rate of the coolant used for cooling in the refrigerant channel. Thus, the device automatically ensures the optimal cooling mode of the IC, depending on the amount of heat that has passed last.

Fig, 1 shows a device

general view; in figure 2. - section A-A, on

 on fng.Z section bb in fig L

The device is a block 5 made of an insulating material 1 placed in the housing 2. On the outer surface of the block there are landing pads - radiators 3 arranged in accordance with the coordinate grid on which the radioelectronic circuit 4 is placed. Inside the block there is a channel system

5 and 6 to pass to the refrigerant radiators. The system consists of a parallel row of channels located along the rows of radiators. The main channels 5 are connected by branch 6, each passing under a respective radiator. The bypass channel 6 is in direct contact with the bottom surface of the radiator 3. One of the main channels is made inlet, the others inlet. On each of radiators 3, plates 7 of a material with a shape memory effect are installed on the outer surface. One end of each plate is hard

it is fixed on the radiator, and the other is connected to the movable barrier 9 through the system of pyagag 8. It is installed in the exhaust duct

6 such that its axis of rotation is perpendicular to the longitudinal axis of the channel 6.

At the optimum operating temperature of the re-radio electronic circuit, the device operates as follows.

The temperature range of the transformation of the plate 7 from the material with the shape memory effect is chosen such

f

Thus, so that its lower value equals the optimum operating temperature of the electronic circuit 4, At this temperature, the plate 7 is -5 s in a thermoelastic state (Fig. 1, left). The free end of the plates 7 through the system of levers, connected to the seed rod 9, rotates it around the axis of rotation 10 to the position.

 О corresponding to the minimum coolant flow through the bypass channel 6.

With further increase in temperature, the IC heats up and the radiator transfers heat to the plate,

 5, depending on the magnitude of the supplied heat flux, the configuration of the plate changes and as the temperature of the IC approaches the critical operating temperature, the plate occupies

20 is located on the right (FIG. 1).

I act through a system of levers, the flap is turned around the axis of rotation in such a way that its J, -delaying corresponds to the maximum flow rate of the heat transfer medium in the tap-off 6..

thirty

In the temperature range from the optimal working to the critical plate, it occupies intermediate positions, and the positions in the exhaust duct that regulate the flow of the coolant change accordingly.

35-Formula Invention

Claims (2)

1. A device for cooling electronic equipment containing a housing with a DIO unit isolate, radiators are installed on the outer surface of the KOTopoj o for cooling the electronic circuits and inside the unit a system of channels for the passage of the refrigerant along the rows of radiators with the provision of contact of the refrigerant with the inner surface of the radiator; inside the channels there are movable dampers, which differ from 50 in order to increase the cooling efficiency of the automatic control By providing individual cooling for each radio electronic circuit, it is equipped with 55 position controllers of movable dampers, each of which is located on the radiator and is kinematically connected with a corresponding damper, the axis of rotation perpendicular to the longitudinal axis of the channel. 2. The device according to claim 1, about t l and - that the regulator The positions of the movable flaps are made in the form of a plate of a material with a shape memory effect, and the kinematic connection is made in the form of a system of levers. FIG. f Aa noSepny o Fi..g