WO2006070121A1 - Two-state system for thermal regulation of an electronic device - Google Patents

Two-state system for thermal regulation of an electronic device Download PDF

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Publication number
WO2006070121A1
WO2006070121A1 PCT/FR2005/003251 FR2005003251W WO2006070121A1 WO 2006070121 A1 WO2006070121 A1 WO 2006070121A1 FR 2005003251 W FR2005003251 W FR 2005003251W WO 2006070121 A1 WO2006070121 A1 WO 2006070121A1
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WO
WIPO (PCT)
Prior art keywords
radiator
support
electronic device
electronic
component
Prior art date
Application number
PCT/FR2005/003251
Other languages
French (fr)
Inventor
Sonia Schindler
Etienne Merlet
Jean-Eric Besold
Nicolas Suard
Original Assignee
Sagem Defense Securite
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem Defense Securite filed Critical Sagem Defense Securite
Publication of WO2006070121A1 publication Critical patent/WO2006070121A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to the thermal regulation of electronic devices.
  • Such a device can be of two types: active (such as a fan, which generates a stream of air intended to evacuate at least part of the thermal energy generated by the device), or passive (such as a radiator , which increases the surface in contact with the ambient air to facilitate heat dissipation).
  • active such as a fan, which generates a stream of air intended to evacuate at least part of the thermal energy generated by the device
  • passive such as a radiator , which increases the surface in contact with the ambient air to facilitate heat dissipation
  • Examples of electronic devices provided with cooling devices are in particular provided by documents WO-93/17536 and US-6,801,431.
  • any cooling device is to maintain the temperature of the electronic device at a value below a predetermined high critical value (generally provided by the device manufacturer) beyond which the operation of the device may be impaired.
  • a critical low value also predetermined, below which the operation of the device can also be altered.
  • the fan when energized, provides cooling of the electronic device to prevent its internal temperature from reaching or exceeding the value high critical, while, when it is off, it allows the device to heat itself so that its temperature does not reach or goes below the critical low value.
  • the main disadvantage of the fan is that it requires a power supply and a control circuit of its start or stop depending on the temperature. This results in increased energy consumption and the need to fine tune the control circuit according to the critical temperatures.
  • the wear of the internal parts of the fan including its bearings and bearings, it must be replaced regularly to avoid the risk of failure of its control electronics are added to the risk of failure mechanical.
  • radiator if its passivity is an asset in terms of energy savings, its main disadvantage is to ensure a permanent heat dissipation, including when it would be necessary, however, to ensure proper operation of the device, to allow the latter to warm up to compensate for an excessive drop in temperature.
  • the invention aims in particular to solve the aforementioned drawbacks by proposing a solution for achieving effective thermal dissipation of the electronic device at high temperature, while allowing a warming of the device at low temperature.
  • the invention proposes a system comprising an electronic device generating thermal energy and a radiator, which system can adopt an active configuration in which the radiator is in contact with the electronic device, and an inactive configuration in which the radiator is spaced from the electronic device, the system further comprising a thermal actuator adapted to control the transition from the active configuration to the inactive configuration when the value of the temperature in the vicinity of the device becomes lower than a first predetermined threshold value, and from the inactive configuration to the active configuration when the value of the temperature in the vicinity of the device becomes greater than to a second predetermined threshold value, which system being arranged according to the invention, is characterized in that the actuator comprises a shape memory alloy element, for example a nickel-titanium alloy (NiTi), or a nickel-titanium-copper alloy (NiTiCu
  • This element may be of the double-acting type, in which case, irrespective of the configuration of the electronic device, it exerts on it a force, or of the simple effect type, in which case the reaction opposed to the force exerted on the electronic device by the shape memory alloy element may result from gravity (specifically, the weight of the device or radiator), or the presence of a return spring coupled to the shape memory alloy element.
  • An interface made of a phase change thermal contact material may be interposed between the radiator and the electronic device to increase the thermal conduction between these elements when the system is in its active configuration.
  • the system can be realized in several ways.
  • the electronic device comprises, for example, a support bearing, on the radiator side, an electronic component generating thermal energy, the radiator being mounted on the support at the right of the component, being movable relative to the support between an active position.
  • the electronic device comprises a support bearing, on the radiator side, an electronic-thermal energy generating component, the support being mounted on the radiator with the electronic component in line with the latter, being mobile with respect to the radiator between an active position (corresponding to the active configuration of the system) in which the electronic component is pressed against the radiator, and an inactive position (corresponding to the inactive configuration of the system) in which the electronic component is removed from the radiator.
  • the electronic device comprises a support carrying, on the opposite side to the radiator, an electronic component generating thermal energy, the radiator being mounted on the support to the component right, being movable relative to the support between an active position (corresponding to the active configuration of the system) in which it is pressed against the support, and an inactive position (corresponding to the inactive configuration of the system) in which it is separated from said support.
  • the electronic device comprises a support carrying, on the opposite side to the radiator, an electronic component generating thermal energy, the support being mounted on the radiator with the electronic component to the right thereof, being mobile relative to the radiator between an active position (corresponding to the active configuration of the system) in which the support is pressed against the radiator, and an inactive position (corresponding to the inactive configuration of the system) in which the support is removed from the radiator.
  • the support preferably comprises thermal drainage wells arranged in line with the electronic component, for example in the form of metal inserts passing through the support.
  • the electronic device is an electronic box containing at least one electronic component generating thermal energy.
  • the radiator is for example mounted directly on the housing being movable relative thereto between an active position in which it is in position. contact with the electronic unit, and an inactive position in which it is spaced from said housing.
  • the housing is mounted on a frame on which the radiator is also mounted, in line with the housing, being movable relative to the chassis between an active position in which it is in contact with the electronic unit, and an inactive position in which is spaced from said housing.
  • FIG. 1 is a schematic sectional view illustrating a system according to the invention, according to a first embodiment, in an active configuration
  • FIG. 1 is a schematic sectional view of the system of Figure 1, in an inactive configuration
  • FIG. 3 is a view similar to FIG. 1, according to a second embodiment
  • FIG. 4 is a view similar to FIG. 2, according to a second embodiment
  • FIG. 5 is a view similar to FIGS.
  • FIG. 6 is a view similar to FIGS.
  • FIG. 7 is a diagram illustrating the empty elongation of a shape memory alloy spring used in the production of an actuator for a system according to the invention.
  • a system 1 comprising an electronic device 2 which, in the case
  • FIGS. 1 to 4 is an electronic card comprising a support or substrate 3 in the form of a plate made of insulating material, bearing electronic components 4.
  • the system 1 also comprises a radiator 5, provided to promote the evacuation of the energy generated by the electronic device 2 in operation.
  • radiator is meant a passive element, that is to say not powered by electrical energy, made of a thermally conductive material, such as an aluminum alloy, and having a large surface area in view of its volume.
  • the radiator 5 has a plurality of fins 6, which promote the heat exchange between the radiator 5 and the ambient air.
  • the system 1 can adopt two distinct configurations, namely:
  • active a first configuration, called active (FIGS. 1, 3, 5), in which the radiator 5 is in contact with the electronic device 2 to facilitate the dissipation of the thermal energy released by it, and
  • inactive in which the radiator 5 is separated from the electronic device 2 to, on the contrary, promote the clean heating of the device 2 (i.e., in the cases illustrated in the figures
  • the system 1 further comprises a thermal actuator 7 placed in the vicinity of the device 2 arranged to control the passage of the system 1 from the active configuration to its inactive configuration when the value of the temperature of this actuator 7 (equal to the ambient temperature in the vicinity of the electronic device 2) becomes smaller than a first predetermined threshold value T1, and from its inactive configuration to its active configuration when the value of the temperature of the actuator 7 becomes greater than a second predetermined threshold value T2.
  • a thermal actuator 7 placed in the vicinity of the device 2 arranged to control the passage of the system 1 from the active configuration to its inactive configuration when the value of the temperature of this actuator 7 (equal to the ambient temperature in the vicinity of the electronic device 2) becomes smaller than a first predetermined threshold value T1, and from its inactive configuration to its active configuration when the value of the temperature of the actuator 7 becomes greater than a second predetermined threshold value T2.
  • a first embodiment is described with reference to FIGS. 1 and 2.
  • the component 4 is in the form of a parallelepipedal element having an internal electronics that will not be described, fixed on an upper face 8 of the support 3 and itself having a face 9 substantially plane plane by which emerges most of the thermal energy it produces in operation.
  • the radiator 5 has meanwhile a substantially parallelepiped body 10 having a substantially flat bottom face 11, and an upper face 12 whose. fins 6 protrude.
  • the radiator 5 is mounted on the support 3 on the component side 4, to the right thereof, its lower face 11 facing the upper face 9 of the component 4.
  • the radiator 5 is fixed on the support 3 by means of screws 13 which pass through the body 10 of the radiator 5 and the support 3, and which, on the side of a lower face 14 thereof, are caught in nuts 15.
  • each screw 13 has an upper portion 13a protruding from the body 10 of the radiator 5 opposite the support 3, to a screw head 16, and an intermediate portion 13b which extends between the radiator 5 and the support 3.
  • the radiator 5 is mounted movably relative to the support 3 between an active position (corresponding to the active configuration of the system 1), represented in FIG. 1, in which its lower face 11 is in contact with the upper face 9 of the component 4, had an inactive position (corresponding to the inactive configuration of the system 1), shown in Figure 2, wherein the radiator 5 is spaced from the component 4, a gap 17 appearing between the lower face 11 of the radiator 5 and the upper face 9 of the component 4.
  • the actuator 7 mentioned above controls the passage of the active position of the radiator 5 to its inactive position, and vice versa, depending on its temperature.
  • actuators 7 are provided here, grouped around each screw 13.
  • Each actuator comprises a shape memory alloy element (AMF) 18, in the form of a compression spring mounted on the upper portion 13a of the screw 13, and interposed by being compressed between the screw head 16 (via a first washer 19) and the radiator 5 (via a second washer 20).
  • AMF shape memory alloy element
  • the spring 18 is for example made of a nickel-titanium alloy (NiTi), or a nickel-titanium-copper alloy (NiTiCu); it is here of the "simple effect" type, that is to say that it only works in compression.
  • the profile of the vacuum elongation of the spring 18 as a function of its temperature is given by the diagram of FIG. 7: it is a hysteresis profile, the spring 18 presenting a minimum empty length L1 when the temperature of the spring 18 is less than a first predetermined threshold value T1 (for example of the order of 20 0 C), associated with a low stiffness, and a maximum empty length L2 when the temperature of the spring 18 is greater than a second value predetermined threshold T2 (for example of the order of 80 0 C), associated with a high stiffness.
  • a first predetermined threshold value T1 for example of the order of 20 0 C
  • T2 for example of the order of 80 0 C
  • the actuator 7 further comprises a return spring 21 ordinary, that is to say a constant length and constant stiffness, operating in compression, mounted on the intermediate portion 13b of the screw 13 and interposed by being compressed between the body 10 of the radiator 5 and the support 3.
  • a return spring 21 ordinary that is to say a constant length and constant stiffness, operating in compression
  • the return spring 21 is chosen so that, when the temperature of the spring 18 AMF (corresponding, as indicated above, the ambient temperature in the vicinity of the component 4) exceeds the second threshold value T2, the force exerted by the return spring 21 on the radiator 5 is less than that exerted by the spring 18 AMF which pushes the radiator 5 in its active position where, pressed against the component 4, it promotes the dissipation of the thermal energy released by it.
  • the force exerted by the AMF spring 18 on the radiator is less than that exerted by the return spring 21, which then pushes the radiator 5 . its inactive position against the spring 18 AMF position where, once the balance of forces reached, the radiator 5 allows the component to heat up under the effect of its own thermal energy. It is not necessary for a person skilled in the art to make himself the spring 18 in AMF. Specialized companies offer springs of this type on the market.
  • component 4 is mounted on the support 3 on the radiator 5 side, it may be located on the side of the support opposite the radiator, the structure of the system being otherwise unchanged.
  • FIGS. 3 and 4 A second embodiment will now be described with reference to FIGS. 3 and 4.
  • This embodiment is similar to the first described above (the common elements have the same references), but the reciprocal mounting of the support 3 and the radiator 5 is achieved in reverse: it is indeed the support 3 which is mounted on the radiator 5 (which is on the side of the lower face 14 of the support 3, that is to say the side opposite the component 4, which is fixed on the upper face 8 of the support 3 to the right of the radiator 5 ), being movable relative to the radiator 5 between:
  • the radiator 5 has bosses 22 whose ends 23 jointly form a face upper 11 'of the radiator 5, with which the lower face 14 of the support 3 comes into contact in the active position.
  • thermal drainage wells can be made in it, in the form of metal inserts 23 included in the support 3 to the right of the component 4, inserts 23 which extend in the thickness of the support 3, from one face to the other of the latter.
  • the actuators 7 have the same structure as that described in the first embodiment, with the difference that the spring 18 AMF is interposed by being compressed between the screw head 16 and the upper face 8 of the support 3, while the return spring 21 is interposed between the radiator 5 and the lower face 14 of the support 3.
  • the force exerted by the return spring 21 on the support 3 is less than that exerted by the spring 18 AMF which pushes the support 3 in its active position where, pressed against the radiator 5, it allows the dissipation of the thermal energy released by the component 4, where appropriate via the inserts 23.
  • the force exerted by the AMF spring 18 on the support 3 is less than that exerted by the return spring 21, which then pushes the support 3 in its inoperative position I * 1 against the spring 18 SMA, position where the support 3, away from the heater 5, allowing the component 4 to heat up under the effect its own thermal energy.
  • component 4 is mounted on the support 3 on the side opposite the radiator 5, it can be located on the side thereof, the structure of the system being otherwise unchanged.
  • the operating mode of the system 1 is globally identical to the first embodiment. Numeric references are retained for common elements.
  • the electronic device 2 is an electronic box containing at least one electronic component generating thermal energy, mounted on a frame 3 '.
  • the radiator 5 is also mounted on the chassis 3 'between an inactive position (FIG. 6) in which it is spaced from the housing 2 to allow its own heating, and an active position ( Figure 5) in which it is in contact with the housing 2 to allow the dissipation of thermal energy emanating therefrom.
  • the chassis 3 'on which the housing 2 is mounted is optional: the radiator 5 can indeed be mounted directly on the housing 2.
  • the return spring 21 is optional. It is possible to suppress it provided that a balance of forces applied to the electronic device 2 is restored.
  • This equilibrium can, according to a first variant embodiment, be ensured by the gravity, the weight of the support or the radiator acting as an opposing restoring force, in active (or inactive) configuration, all depending on the embodiment. retained), the force exerted on the support or the radiator by the AMF element.
  • the couple comes out in
  • AMF / ordinary return spring is replaced by a single spring AMF, double-acting type, that is to say, can work in compression or traction, depending on its temperature.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention concerns a system (1) comprising an electronic device (2) generating thermal energy and a radiator (5) and capable of adopting two active and inactive configurations with the radiator (5) in contact with or spaced apart from the electronic device (2), a thermal actuator (7) controlling the shift from the active configuration to the inactive configuration when the temperature in the vicinity of the device (2) drops below a first predetermined threshold and from its inactive configuration to its active configuration when the temperature in the vicinity of the device (2) rises above an second predetermined threshold; the actuator (7) comprises an element (18) made of shape-memory alloy in the form of a spring, for example an nickel-titanium, nickel-titanium-copper alloy.

Description

SYSTEME A DEUX ETATS POUR LA REGULATION THERMIQUE D'UN TWO-STATE SYSTEM FOR THERMAL REGULATION OF A
DISPOSITIF ELECTRONIQUEELECTRONIC DEVICE
L' invention a trait à la régulation thermique des dispositifs électroniques.The invention relates to the thermal regulation of electronic devices.
Il est connu de munir un dispositif électronique d'un dispositif de refroidissement. Un tel dispositif peut être de deux types-: actif (tels qu'un ventilateur, qui génère un courant d'air destiné à évacuer au moins en partie l'énergie thermique générée par le dispositif), ou passif (tel qu'un radiateur, qui augmente la surface en contact avec l'air ambiant pour faciliter la dissipation thermique) .It is known to provide an electronic device with a cooling device. Such a device can be of two types: active (such as a fan, which generates a stream of air intended to evacuate at least part of the thermal energy generated by the device), or passive (such as a radiator , which increases the surface in contact with the ambient air to facilitate heat dissipation).
Des exemples de dispositifs électroniques munis de dispositifs de refroidissement sont notamment fournis par les documents WO-93/17536 et US-6 801 431.Examples of electronic devices provided with cooling devices are in particular provided by documents WO-93/17536 and US-6,801,431.
Le but de tout dispositif de refroidissement est de maintenir la température du dispositif électronique à une valeur inférieure à une valeur haute critique prédéterminée (en général fournie par le constructeur du dispositif) au-delà de laquelle le fonctionnement du dispositif peut être altéré.The purpose of any cooling device is to maintain the temperature of the electronic device at a value below a predetermined high critical value (generally provided by the device manufacturer) beyond which the operation of the device may be impaired.
Toutefois, il peut s'avérer nécessaire, dans certaines conditions de température, de maintenir la température du dispositif électronique à une valeur supérieure à une valeur basse critique, également prédéterminée, en dessous de laquelle le fonctionnement du dispositif peut également être altéré.However, it may be necessary, under certain temperature conditions, to keep the temperature of the electronic device higher than a critical low value, also predetermined, below which the operation of the device can also be altered.
Le ventilateur, lorsqu'il est sous tension, assure le refroidissement du dispositif électronique pour éviter que sa température interne n'atteigne ou ne dépasse la valeur critique haute, tandis que, lorsqu'il est hors tension, il permet l'échauffement propre du dispositif afin que sa température n'atteigne ou ne passe sous la valeur critique basse. Mais l'inconvénient principal du ventilateur est qu'il nécessite une alimentation en énergie ainsi qu'un circuit de commande de sa mise en route ou de son arrêt en fonction de la température. Il en résulte une consommation d'énergie accrue et la nécessité de paramétrer finement le circuit de commande en fonction des températures critiques. En outre, compte tenu de l'usure des pièces internes au ventilateur, notamment de ses roulements et paliers, il doit être remplacé régulièrement afin d'éviter qu'aux risques de défaillance de son électronique de commande viennent s'ajouter des risques de défaillance mécanique.The fan, when energized, provides cooling of the electronic device to prevent its internal temperature from reaching or exceeding the value high critical, while, when it is off, it allows the device to heat itself so that its temperature does not reach or goes below the critical low value. But the main disadvantage of the fan is that it requires a power supply and a control circuit of its start or stop depending on the temperature. This results in increased energy consumption and the need to fine tune the control circuit according to the critical temperatures. In addition, given the wear of the internal parts of the fan, including its bearings and bearings, it must be replaced regularly to avoid the risk of failure of its control electronics are added to the risk of failure mechanical.
Quant au radiateur, si sa passivité est un atout en termes d'économies d'énergie, son principal inconvénient est d'assurer une dissipation thermique permanente, y compris lorsqu'il s'avérerait cependant nécessaire, pour assurer un fonctionnement correct du dispositif, de laisser ce dernier s'échauffer afin de compenser une baisse trop forte de la température.As for the radiator, if its passivity is an asset in terms of energy savings, its main disadvantage is to ensure a permanent heat dissipation, including when it would be necessary, however, to ensure proper operation of the device, to allow the latter to warm up to compensate for an excessive drop in temperature.
L'invention vise notamment à résoudre les inconvénients précités en proposant une solution permettant de réaliser une dissipation thermique efficace du dispositif électronique à haute température, tout en permettant un réchauffement du dispositif à basse température. A cet effet, l'invention propose un système comportant un dispositif électronique générateur d'énergie thermique ainsi qu'un radiateur, lequel système peut adopter une configuration active dans laquelle le radiateur est en contact avec le dispositif électronique, et une configuration inactive dans laquelle le radiateur est écarté du dispositif électronique, le système comportant en outre un actionneur thermique apte à commander le passage de la configuration active à la configuration inactive lorsque la valeur de la température au voisinage du dispositif devient inférieure à une première valeur seuil prédéterminée, et de la configuration inactive à la configuration active lorsque la valeur de la température au voisinage du dispositif devient supérieure à une seconde valeur seuil prédéterminée, lequel système, étant agencé conformément à l'invention, se caractérise en ce que l'actionneur comporte un élément en alliage à mémoire de forme, par exemple en un alliage nickel-titane (NiTi) , ou un alliage nickel-titane-cuivre (NiTiCu) .The invention aims in particular to solve the aforementioned drawbacks by proposing a solution for achieving effective thermal dissipation of the electronic device at high temperature, while allowing a warming of the device at low temperature. For this purpose, the invention proposes a system comprising an electronic device generating thermal energy and a radiator, which system can adopt an active configuration in which the radiator is in contact with the electronic device, and an inactive configuration in which the radiator is spaced from the electronic device, the system further comprising a thermal actuator adapted to control the transition from the active configuration to the inactive configuration when the value of the temperature in the vicinity of the device becomes lower than a first predetermined threshold value, and from the inactive configuration to the active configuration when the value of the temperature in the vicinity of the device becomes greater than to a second predetermined threshold value, which system being arranged according to the invention, is characterized in that the actuator comprises a shape memory alloy element, for example a nickel-titanium alloy (NiTi), or a nickel-titanium-copper alloy (NiTiCu).
De la sorte, il est possible d'assurer à la fois une dissipation thermique du dispositif électronique lorsque la température est élevée, et son réchauffement propre lorsque la température est basse. Ainsi7 il est possible de maintenir le dispositif électronique dans sa plage prescrite de fonctionnement en température.In this way, it is possible to ensure both a heat dissipation of the electronic device when the temperature is high, and its own heating when the temperature is low. And 7 it is possible to maintain the electronic device in its desired range of temperature operation.
Cet élément peut être du type double effet, auquel cas, quelle que soit la configuration du dispositif électronique, il exerce sur celui-ci un effort, ou du type simple effet, auquel cas la réaction opposée à l'effort exercé sur le dispositif électronique par l'élément en alliage à mémoire de forme peut résulter de la gravité (concrètement, le poids du dispositif ou du radiateur) , ou de la présence d'un ressort de rappel couplé à l'élément en alliage à mémoire de forme.This element may be of the double-acting type, in which case, irrespective of the configuration of the electronic device, it exerts on it a force, or of the simple effect type, in which case the reaction opposed to the force exerted on the electronic device by the shape memory alloy element may result from gravity (specifically, the weight of the device or radiator), or the presence of a return spring coupled to the shape memory alloy element.
Une interface réalisée dans un matériau de contact thermique à changement de phase peut être interposée entre le radiateur et le dispositif électronique, afin d' augmenter la conduction thermique entre ces éléments lorsque le système est dans sa configuration active.An interface made of a phase change thermal contact material may be interposed between the radiator and the electronic device to increase the thermal conduction between these elements when the system is in its active configuration.
Le système peut être réalisé de plusieurs manières.The system can be realized in several ways.
Le dispositif électronique comporte par exemple un support portant, du côté du radiateur, un composant électronique générateur d'énergie thermique, le radiateur étant monté sur le support au droit du composant, en étant mobile par rapport au support entre une position activeThe electronic device comprises, for example, a support bearing, on the radiator side, an electronic component generating thermal energy, the radiator being mounted on the support at the right of the component, being movable relative to the support between an active position.
(correspondant à la configuration active du système) dans laquelle il est plaqué contre le composant électronique, et une position inactive (correspondant à la configuration inactive du système) dans laquelle il est écarté dudit composant.(corresponding to the active configuration of the system) in which it is pressed against the electronic component, and an inactive position (corresponding to the inactive configuration of the system) in which it is removed from said component.
En variante, le dispositif électronique comporte un support portant, du côté du radiateur, un composant électronique- générateur d'énergie thermique, le support étant monté sur le radiateur avec le composant électronique au droit de celui-ci, en étant mobile par rapport au radiateur entre une position active (correspondant à la configuration active du système) dans laquelle le composant électronique est plaqué contre le radiateur, et une position inactive (correspondant à la configuration inactive du système) dans laquelle le composant électronique est écarté du radiateur. Suivant une autre variante, le dispositif électronique comporte un support portant, du côté opposé au radiateur, un composant électronique générateur d'énergie thermique, le radiateur étant monté sur le support au droit du composant, en étant mobile par rapport au support entre une position active (correspondant à la configuration active du système) dans laquelle il est plaqué contre le support, et une position inactive (correspondant à la configuration inactive du système) dans laquelle il est écarté dudit support.In a variant, the electronic device comprises a support bearing, on the radiator side, an electronic-thermal energy generating component, the support being mounted on the radiator with the electronic component in line with the latter, being mobile with respect to the radiator between an active position (corresponding to the active configuration of the system) in which the electronic component is pressed against the radiator, and an inactive position (corresponding to the inactive configuration of the system) in which the electronic component is removed from the radiator. According to another variant, the electronic device comprises a support carrying, on the opposite side to the radiator, an electronic component generating thermal energy, the radiator being mounted on the support to the component right, being movable relative to the support between an active position (corresponding to the active configuration of the system) in which it is pressed against the support, and an inactive position (corresponding to the inactive configuration of the system) in which it is separated from said support.
Suivant encore une autre variante, le dispositif électronique comporte un support portant, du côté opposé au radiateur, un composant électronique générateur d'énergie thermique, le support étant monté sur le radiateur avec le composant électronique au droit de celui-ci, en étant mobile par rapport au radiateur entre une position active (correspondant à la configuration active du système) dans laquelle le support est plaqué contre le radiateur, et une position inactive (correspondant à la configuration inactive du système) dans laquelle le support est écarté du radiateur. Dans ces deux dernier cas, le support comporte de préférence des puits de drainage thermique disposés au droit du composant électronique, par exemple sous forme d'inserts métalliques traversant le support.According to yet another variant, the electronic device comprises a support carrying, on the opposite side to the radiator, an electronic component generating thermal energy, the support being mounted on the radiator with the electronic component to the right thereof, being mobile relative to the radiator between an active position (corresponding to the active configuration of the system) in which the support is pressed against the radiator, and an inactive position (corresponding to the inactive configuration of the system) in which the support is removed from the radiator. In the latter two cases, the support preferably comprises thermal drainage wells arranged in line with the electronic component, for example in the form of metal inserts passing through the support.
Suivant un autre mode de réalisation, le dispositif électronique est un boîtier électronique renfermant au moins un composant électronique générateur d' énergie thermique.According to another embodiment, the electronic device is an electronic box containing at least one electronic component generating thermal energy.
Dans ce cas, le radiateur est par exemple monté directement sur le boîtier en étant mobile par rapport à celui-ci entre une position active dans laquelle il est en contact avec le boîtier électronique, et une position inactive dans laquelle il est écarté dudit boîtier.In this case, the radiator is for example mounted directly on the housing being movable relative thereto between an active position in which it is in position. contact with the electronic unit, and an inactive position in which it is spaced from said housing.
En variante, le boîtier est monté sur un châssis sur lequel le radiateur est aussi monté, au droit du boîtier, en étant mobile par rapport au châssis entre une position active dans laquelle il est en contact avec le boîtier électronique, et une position inactive dans laquelle il est écarté dudit boîtier.Alternatively, the housing is mounted on a frame on which the radiator is also mounted, in line with the housing, being movable relative to the chassis between an active position in which it is in contact with the electronic unit, and an inactive position in which is spaced from said housing.
D'autres objets et avantages de l'invention apparaîtront à la lumière de la description faite ci-après- en référence aux dessins annexés dans lesquels :Other objects and advantages of the invention will emerge in the light of the description given hereinafter with reference to the appended drawings in which:
- la figure 1 est une vue schématique en coupe illustrant un système conforme à l'invention, suivant un premier mode de réalisation, dans une configuration active ;- Figure 1 is a schematic sectional view illustrating a system according to the invention, according to a first embodiment, in an active configuration;
- la figure 2 est une vue schématique en coupe du système de la figure 1, dans une configuration inactive ;- Figure 2 is a schematic sectional view of the system of Figure 1, in an inactive configuration;
- la figure 3 est une vue similaire à la figure 1, suivant un deuxième mode de réalisation ;FIG. 3 is a view similar to FIG. 1, according to a second embodiment;
- la figure 4 est une vue similaire à la figure 2, suivant un deuxième mode de réalisation ;FIG. 4 is a view similar to FIG. 2, according to a second embodiment;
- la figure 5 est une vue similaire aux figures 1 etFIG. 5 is a view similar to FIGS.
3, suivant un troisième mode de réalisation ; - la figure 6 est une vue similaire aux figures 2. et3, according to a third embodiment; FIG. 6 is a view similar to FIGS.
4, suivant un troisième mode de réalisation ;4, according to a third embodiment;
- la figure 7 est un diagramme illustrant l'élongation à vide d'un ressort en alliage à mémoire de forme entrant dans la réalisation d'un actionneur pour un système conforme à l'invention. Sur les figures est représenté un système 1 comportant un dispositif électronique 2 qui, dans le casFIG. 7 is a diagram illustrating the empty elongation of a shape memory alloy spring used in the production of an actuator for a system according to the invention. In the figures is represented a system 1 comprising an electronic device 2 which, in the case
, des figures 1 à 4, est une carte électronique comprenant un support ou substrat 3 sous forme d'une plaque en matériau isolant, portant des composants électroniques 4., FIGS. 1 to 4, is an electronic card comprising a support or substrate 3 in the form of a plate made of insulating material, bearing electronic components 4.
L'un de ces composants est représenté sur les figures 1 à 4. Il s'agit d'un composant électronique de puissance, qui en fonctionnement est générateur d'énergie thermique.One of these components is shown in Figures 1 to 4. It is an electronic power component, which in operation is generating thermal energy.
Comme cela est également représenté sur les figures, le système 1 comporte également un radiateur 5, prévu pour favoriser l'évacuation de l'énergie générée par le dispositif électronique 2 en fonctionnement.As also shown in the figures, the system 1 also comprises a radiator 5, provided to promote the evacuation of the energy generated by the electronic device 2 in operation.
Par « radiateur », on entend un élément passif, c'est-à-dire non alimenté en énergie électrique, réalisé dans un matériau thermiquement conducteur, tel qu'un alliage d'aluminium, et présentant une surface importante compte tenu de son volume. Dans les exemples représentés, le radiateur 5 présente une pluralité d'ailettes 6, qui favorisent l'échange thermique entre le radiateur 5 et l'air ambiant.By "radiator" is meant a passive element, that is to say not powered by electrical energy, made of a thermally conductive material, such as an aluminum alloy, and having a large surface area in view of its volume. . In the examples shown, the radiator 5 has a plurality of fins 6, which promote the heat exchange between the radiator 5 and the ambient air.
Comme cela est visible sur les figurea, le système 1" peut adopter deux configurations distinctes, à savoir :As can be seen in the figures, the system 1 "can adopt two distinct configurations, namely:
- une première configuration, dite active (figures 1, 3, 5), dans laquelle le radiateur 5 est en contact avec le dispositif électronique 2 pour faciliter la dissipation de l'énergie thermique dégagée par celui- ci, eta first configuration, called active (FIGS. 1, 3, 5), in which the radiator 5 is in contact with the electronic device 2 to facilitate the dissipation of the thermal energy released by it, and
— une seconde configuration, dite inactive (figures 2, 4, 6), dans laquelle le radiateur 5 est écarté du dispositif électronique 2 pour, au contraire, favoriser le réchauffement propre du dispositif 2 (c'est-à-dire, dans les cas illustrés sur les figuresA second configuration, called inactive (FIGS. 2, 4, 6), in which the radiator 5 is separated from the electronic device 2 to, on the contrary, promote the clean heating of the device 2 (i.e., in the cases illustrated in the figures
I à 4, l'augmentation de la température interne du composant 4, générée par sa propre énergie thermique) . Le système 1 comporte en outre un actionneur thermique 7 placé au voisinage du dispositif 2 agencé pour commander le passage du système 1 de la configuration active à sa configuration inactive lorsque la valeur de la température de cet actionneur 7 (égale à la température ambiante au voisinage du dispositif électronique 2) devient inférieure à une première valeur seuil Tl prédéterminée, et de sa configuration inactive à sa configuration active lorsque la valeur de la température de l' actionneur 7 devient supérieure à une seconde valeur seuil T2 prédéterminée.I to 4, the increase in the internal temperature of component 4, generated by its own thermal energy). The system 1 further comprises a thermal actuator 7 placed in the vicinity of the device 2 arranged to control the passage of the system 1 from the active configuration to its inactive configuration when the value of the temperature of this actuator 7 (equal to the ambient temperature in the vicinity of the electronic device 2) becomes smaller than a first predetermined threshold value T1, and from its inactive configuration to its active configuration when the value of the temperature of the actuator 7 becomes greater than a second predetermined threshold value T2.
II est à noter que les termes « actif » et « passif » font référence non au caractère actif ou passif deIt should be noted that the terms "assets" and "liabilities" refer not to the active or passive nature of
1' actionneur - lequel est en fait passif, c'est-à-dire qu'il n'est pas alimenté en énergie - mais référence au caractère favorisé (dans la position active) ou non (dans la position inactive) de la dissipation thermique. Plusieurs modes de réalisation sont proposés pour aboutir à la fonctionnalité évoquée ci-dessus.1 'actuator - which is actually passive, that is to say it is not powered - but reference to the favored character (in the active position) or not (in the inactive position) of the dissipation thermal. Several embodiments are proposed to achieve the functionality mentioned above.
On décrit un premier mode de réalisation, en référence aux figures 1 et 2.A first embodiment is described with reference to FIGS. 1 and 2.
Comme cela est visible sur les figures 1 et 2, le composant 4 se présente sous la forme d'un élément parallélépipédique ayant une électronique interne qui ne sera pas décrite, fixé sur une face supérieure 8 du support 3 et ayant lui-même une face supérieure 9 sensiblement plane par laquelle se dégage l'essentiel de l'énergie thermique qu'il produit en fonctionnement. Le radiateur 5 présente quant à lui un corps 10 sensiblement parallélépipédique ayant une face inférieure 11 sensiblement plane, et une face supérieure 12 dont les . ailettes 6 font saillie. Le radiateur 5 est monté sur le support 3 du côté du composant 4, au droit, de celui-ci, sa face inférieure 11 tournée vers la face supérieure 9 du composant 4. Le radiateur 5 est fixé sur le support 3 au moyen de vis 13 qui traversent le corps 10 du radiateur 5 et le support 3, et qui viennent, du côté d'une face inférieure 14 de celui-ci, se prendre dans des écrous 15.As can be seen in FIGS. 1 and 2, the component 4 is in the form of a parallelepipedal element having an internal electronics that will not be described, fixed on an upper face 8 of the support 3 and itself having a face 9 substantially plane plane by which emerges most of the thermal energy it produces in operation. The radiator 5 has meanwhile a substantially parallelepiped body 10 having a substantially flat bottom face 11, and an upper face 12 whose. fins 6 protrude. The radiator 5 is mounted on the support 3 on the component side 4, to the right thereof, its lower face 11 facing the upper face 9 of the component 4. The radiator 5 is fixed on the support 3 by means of screws 13 which pass through the body 10 of the radiator 5 and the support 3, and which, on the side of a lower face 14 thereof, are caught in nuts 15.
Comme cela est visible sur la figure 1, chaque vis 13 présente une portion supérieure 13a qui dépasse du corps 10 du radiateur 5 à l'opposé du support 3, jusqu'à une tête de vis 16, et une portion intermédiaire 13b qui s'étend entre le radiateur 5 et le support 3.As can be seen in FIG. 1, each screw 13 has an upper portion 13a protruding from the body 10 of the radiator 5 opposite the support 3, to a screw head 16, and an intermediate portion 13b which extends between the radiator 5 and the support 3.
Le radiateur 5 est monté mobile par rapport au support 3 entre une position active (correspondant à la configuration active du système 1), représentée sur la figure 1, dans laquelle sa face inférieure 11 est en contact avec la face supérieure 9 du composant 4, eu une position inactive (correspondant à la configuration inactive du système 1) , représentée sur la figure 2, dans laquelle le radiateur 5 est écarté du composant 4, un interstice 17 apparaissant entre la face inférieure 11 du radiateur 5 et la face supérieure 9 du composant 4.The radiator 5 is mounted movably relative to the support 3 between an active position (corresponding to the active configuration of the system 1), represented in FIG. 1, in which its lower face 11 is in contact with the upper face 9 of the component 4, had an inactive position (corresponding to the inactive configuration of the system 1), shown in Figure 2, wherein the radiator 5 is spaced from the component 4, a gap 17 appearing between the lower face 11 of the radiator 5 and the upper face 9 of the component 4.
L' actionneur 7 évoqué ci-dessus commande le passage de la position active du radiateur 5 à sa position inactive, et réciproquement, en fonction de sa température. En pratique, plusieurs actionneurs 7 sont ici prévus, groupés autour de chaque vis 13. Chaque actionneur comporte un élément 18 en alliage à mémoire de forme (AMF), sous la forme d'un ressort de compression monté sur la portion supérieure 13a de la vis 13, et interposé en étant comprimé entre la tête de vis 16 (via une première rondelle 19) et le radiateur 5 (via une seconde rondelle 20) .The actuator 7 mentioned above controls the passage of the active position of the radiator 5 to its inactive position, and vice versa, depending on its temperature. In practice, several actuators 7 are provided here, grouped around each screw 13. Each actuator comprises a shape memory alloy element (AMF) 18, in the form of a compression spring mounted on the upper portion 13a of the screw 13, and interposed by being compressed between the screw head 16 (via a first washer 19) and the radiator 5 (via a second washer 20).
Le ressort 18 est par exemple réalisé dans un alliage nickel-titane (NiTi), ou dans un alliage nickel-titane- cuivre (NiTiCu) ; il est ici du type « simple effet », c'est-à-dire qu'il ne travaille qu'en compression.The spring 18 is for example made of a nickel-titanium alloy (NiTi), or a nickel-titanium-copper alloy (NiTiCu); it is here of the "simple effect" type, that is to say that it only works in compression.
Le profil de l'élongation à vide du ressort 18 en fonction de sa température est donné par le diagramme de la figure 7 : il s'agit d'un profil à hystérésis, le ressort 18 présentant une longueur à vide minimale Ll lorsque la température du ressort 18 est inférieure à une première valeur seuil Tl prédéterminée (par exemple de l'ordre de 200C), associée à une faible raideur, et une longueur à vide maximale L2 lorsque la température du ressort 18 est supérieure à une seconde valeur seuil T2 prédéterminée (par exemple de l'ordre de 800C), associée à une raideur élevée.The profile of the vacuum elongation of the spring 18 as a function of its temperature is given by the diagram of FIG. 7: it is a hysteresis profile, the spring 18 presenting a minimum empty length L1 when the temperature of the spring 18 is less than a first predetermined threshold value T1 (for example of the order of 20 0 C), associated with a low stiffness, and a maximum empty length L2 when the temperature of the spring 18 is greater than a second value predetermined threshold T2 (for example of the order of 80 0 C), associated with a high stiffness.
L'actionneur 7 comporte par ailleurs un ressort de rappel 21 ordinaire, c'est-à-dire à longueur à vide et raideur constantes, fonctionnant en compression, monté sur la portion intermédiaire 13b de la vis 13 et interposé en étant comprimé entre le corps 10 du radiateur 5 et le support 3.The actuator 7 further comprises a return spring 21 ordinary, that is to say a constant length and constant stiffness, operating in compression, mounted on the intermediate portion 13b of the screw 13 and interposed by being compressed between the body 10 of the radiator 5 and the support 3.
Le ressort de rappel 21 est choisi pour que, lorsque la température du ressort 18 en AMF (correspondant, comme cela est indiqué ci-dessus, à la température ambiante au voisinage du composant 4) dépasse la seconde valeur seuil T2, la force exercée par le ressort de rappel 21 sur le radiateur 5 est inférieure à celle exercée par le ressort 18 en AMF qui pousse le radiateur 5 dans sa position active où, plaqué contre le composant 4, il favorise la dissipation de l'énergie thermique dégagée par celui-ci.The return spring 21 is chosen so that, when the temperature of the spring 18 AMF (corresponding, as indicated above, the ambient temperature in the vicinity of the component 4) exceeds the second threshold value T2, the force exerted by the return spring 21 on the radiator 5 is less than that exerted by the spring 18 AMF which pushes the radiator 5 in its active position where, pressed against the component 4, it promotes the dissipation of the thermal energy released by it.
Par contre, lorsque la température du ressort 18 en AMF passe sous la première valeur seuil Tl, la force exercée par le ressort 18 en AMF sur le radiateur est inférieure à celle exercée par le ressort de rappel 21, qui pousse alors le radiateur 5 dans . sa position inactive à l'encontre du ressort 18 en AMF, position où, une fois l'équilibre des forces atteint, le radiateur 5 laisse le composant s'échauffer sous l'effet de sa propre énergie thermique. II n'est pas nécessaire à l'homme du métier de réaliser lui-même le ressort 18 en AMF. Des sociétés spécialisées proposent sur le marché des ressorts de ce type. Citons à titre d'exemple, pour la complétude de la présente description et non à titre publicitaire, la société AMT, basée en Belgique, auprès de laquelle l'homme du métier pourra se fournir, après avoir défini son cahier" des charges en fonction des seuils de température retenus pour la modification de l'état du ressort 18 en AMF.On the other hand, when the temperature of the AMF spring 18 passes below the first threshold value T1, the force exerted by the AMF spring 18 on the radiator is less than that exerted by the return spring 21, which then pushes the radiator 5 . its inactive position against the spring 18 AMF position where, once the balance of forces reached, the radiator 5 allows the component to heat up under the effect of its own thermal energy. It is not necessary for a person skilled in the art to make himself the spring 18 in AMF. Specialized companies offer springs of this type on the market. As an example, for the completeness of the present description and not for advertising purposes, the company AMT, based in Belgium, from which the skilled person will be able to provide, after having defined his book "charges based temperature thresholds selected for changing the state of the spring 18 AMF.
Bien que dans le mode de réalisation qui vient d' être décrit le composant 4 soit monté sur le support 3 du côté du radiateur 5, il peut être situé du côté du support opposé au radiateur, la structure du système étant pour le reste inchangée.Although in the embodiment which has just been described component 4 is mounted on the support 3 on the radiator 5 side, it may be located on the side of the support opposite the radiator, the structure of the system being otherwise unchanged.
On décrit à présent un deuxième mode de réalisation, en référence aux figures 3 et 4. Ce mode de réalisation est similaire au premier décrit ci-dessus (les éléments communs portent les mêmes références) , mais le montage réciproque du support 3 et du radiateur 5 est réalisé à l'inverse : c'est en effet le support 3 qui est monté sur le radiateur 5 (lequel se trouve du côté de la face inférieure 14 du support 3, c'est-à-dire du côté opposé au composant 4, lequel est fixé sur la face supérieure 8 du support 3 au droit du radiateur 5) , en étant mobile par rapport au radiateur 5 entre :A second embodiment will now be described with reference to FIGS. 3 and 4. This embodiment is similar to the first described above (the common elements have the same references), but the reciprocal mounting of the support 3 and the radiator 5 is achieved in reverse: it is indeed the support 3 which is mounted on the radiator 5 (which is on the side of the lower face 14 of the support 3, that is to say the side opposite the component 4, which is fixed on the upper face 8 of the support 3 to the right of the radiator 5 ), being movable relative to the radiator 5 between:
— une position active dans laquelle le support 3 est en contact, du côté de sa face inférieure 14, avec le radiateur 5 dont les ailettes 6 sont tournées du côté opposé à la face inférieure 14, de sorte à faciliter la dissipation de l'énergie thermique générée par le composant 4, etAn active position in which the support 3 is in contact, on the side of its lower face 14, with the radiator 5 whose fins 6 are turned on the opposite side to the lower face 14, so as to facilitate the dissipation of the energy generated by component 4, and
- une position inactive dans laquelle le support 3 est écarté du radiateur 5 pour favoriser l' échauffement propre du composant 4. Comme cela est visible sur les figures 3 et 4, le radiateur 5 présente des bossages 22 dont des extrémités 23 forment conjointement une face supérieure 11' du radiateur 5, avec laquelle la face inférieure 14 du support 3 vient en contact en position active. Par ailleurs, afin de favoriser la conduction thermique au travers du support 3, des puits de drainage thermique peuvent être réalisés dans celui-ci, sous la forme d' inserts 23 métalliques inclus dans le support 3 au droit du composant 4, inserts 23 qui s'étendent dans l'épaisseur du support 3, d'une face à l'autre de celui- ci. Les actionneurs 7 présentent la même structure que celle décrite dans le premier mode de réalisation, à la différence près que le ressort 18 en AMF est interposé en étant comprimé entre la tête de vis 16 et la face supérieure 8 du support 3, tandis que le ressort de rappel 21 est interposé entre le radiateur 5 et la face inférieure 14 du support 3.an inactive position in which the support 3 is separated from the radiator 5 to promote the proper heating of the component 4. As can be seen in FIGS. 3 and 4, the radiator 5 has bosses 22 whose ends 23 jointly form a face upper 11 'of the radiator 5, with which the lower face 14 of the support 3 comes into contact in the active position. Moreover, in order to promote thermal conduction through the support 3, thermal drainage wells can be made in it, in the form of metal inserts 23 included in the support 3 to the right of the component 4, inserts 23 which extend in the thickness of the support 3, from one face to the other of the latter. The actuators 7 have the same structure as that described in the first embodiment, with the difference that the spring 18 AMF is interposed by being compressed between the screw head 16 and the upper face 8 of the support 3, while the return spring 21 is interposed between the radiator 5 and the lower face 14 of the support 3.
Ainsi, lorsque la température du ressort 18 en AMF dépasse la seconde valeur seuil T2, la force exercée par le ressort de rappel 21 sur le support 3 est inférieure à celle exercée par le ressort 18 en AMF qui pousse le support 3 dans sa position active où, plaqué contre le radiateur 5, il permet la dissipation de l'énergie thermique dégagée par le composant 4, le cas échéant via les inserts 23.Thus, when the temperature of the spring 18 AMF exceeds the second threshold value T2, the force exerted by the return spring 21 on the support 3 is less than that exerted by the spring 18 AMF which pushes the support 3 in its active position where, pressed against the radiator 5, it allows the dissipation of the thermal energy released by the component 4, where appropriate via the inserts 23.
Par contre, lorsque la température du ressort 18 en AMF passe sous la première valeur seuil Tl, la force exercée par le ressort 18 en AMF sur le support 3 est inférieure à celle exercée par le ressort de rappel 21, qui pousse alors le support 3 dans sa position inactive à I*1encontre du ressort 18 en AMF, position où le support 3, à l'écart du radiateur 5, permet au composant 4 de s'échauffer sous l'effet de sa propre énergie thermique.On the other hand, when the temperature of the AMF spring 18 passes below the first threshold value T1, the force exerted by the AMF spring 18 on the support 3 is less than that exerted by the return spring 21, which then pushes the support 3 in its inoperative position I * 1 against the spring 18 SMA, position where the support 3, away from the heater 5, allowing the component 4 to heat up under the effect its own thermal energy.
Bien que dans le mode de réalisation qui vient d' être décrit le composant 4 soit monté sur le support 3 du côté opposé au radiateur 5, il peut être situé du côté de celui-ci, la structure du système étant pour le reste inchangée.Although in the embodiment which has just been described component 4 is mounted on the support 3 on the side opposite the radiator 5, it can be located on the side thereof, the structure of the system being otherwise unchanged.
On décrit à présent un troisième mode de réalisation, en référence aux figures 5 et 6. Dans ce mode de réalisation, le mode de fonctionnement du système 1 est globalement identique au premier mode de réalisation. Les références numériques sont conservées pour les éléments communs. Ici, le dispositif électronique 2 est un boîtier électronique renfermant au moins un composant électronique générateur d'énergie thermique, monté sur un châssis 3' .A third embodiment will now be described with reference to FIGS. 5 and 6. In this embodiment, the operating mode of the system 1 is globally identical to the first embodiment. Numeric references are retained for common elements. Here, the electronic device 2 is an electronic box containing at least one electronic component generating thermal energy, mounted on a frame 3 '.
Comme cela est visible sur les figures 5 et β, le radiateur 5 est également monté sur le châssis 3' entre une position inactive (figure 6) dans laquelle il est écarté du boîtier 2 pour permettre l' échauffement propre de celui-ci, et une position active (figure 5) dans laquelle il est en contact avec le boîtier 2 pour permettre la dissipation de l'énergie thermique émanant de celui-ci.As can be seen in FIGS. 5 and 6, the radiator 5 is also mounted on the chassis 3 'between an inactive position (FIG. 6) in which it is spaced from the housing 2 to allow its own heating, and an active position (Figure 5) in which it is in contact with the housing 2 to allow the dissipation of thermal energy emanating therefrom.
Le châssis 3' sur lequel est monté le boîtier 2 est facultatif : le radiateur 5 peut en effet être monté directement sur le boîtier 2.The chassis 3 'on which the housing 2 is mounted is optional: the radiator 5 can indeed be mounted directly on the housing 2.
Dans l'un quelconque des modes de réalisation qui viennent d'être décrit, le ressort de rappel 21 est optionnel. Il est possible de le supprimer à condition de retrouver un équilibre des forces appliquées au dispositif électronique 2.In any of the embodiments that have just been described, the return spring 21 is optional. It is possible to suppress it provided that a balance of forces applied to the electronic device 2 is restored.
Cet équilibre peut, suivant une première variante de réalisation, être assuré par la gravité, le poids du support ou du radiateur jouant le rôle d'une force de rappel s'opposant, en configuration active (ou inactive, tout dépendant du mode de réalisation retenu) , à la force exercée sur le support ou sur le radiateur par l'élément en AMF. Suivant une seconde variante, le couple ressort enThis equilibrium can, according to a first variant embodiment, be ensured by the gravity, the weight of the support or the radiator acting as an opposing restoring force, in active (or inactive) configuration, all depending on the embodiment. retained), the force exerted on the support or the radiator by the AMF element. According to a second variant, the couple comes out in
AMF/ ressort de rappel ordinaire est remplacé par un unique ressort en AMF, du type double effet, c'est-à-dire pouvant travailler en compression ou en traction, tout dépendant de sa température.AMF / ordinary return spring is replaced by a single spring AMF, double-acting type, that is to say, can work in compression or traction, depending on its temperature.
Dans ce cas, le ressort en AMF est accroché, suivant le mode de réalisation retenu :In this case, the AMF spring is hooked, according to the chosen embodiment:
- à la tête de vis 16 d'une part et au radiateur 5 d'autre part, ou - à la tête de vis 16 d'une part et au support 3 (ou 3') d'autre part, ouat the screw head 16 on the one hand and the radiator 5 on the other hand, or - at the screw head 16 on the one hand and on the support 3 (or 3 ') on the other hand, or
- au support 3 (ou 3') d'une part et au radiateur 5 d'autre part, ou encore- the support 3 (or 3 ') on the one hand and the radiator 5 on the other hand, or
- au boîtier 2 d'une part et au radiateur 5 d'autre part.- The housing 2 on the one hand and the radiator 5 on the other.
Pour réaliser un ressort en AMF du type double effet, l'homme du métier pourra se procurer un ressort en AMF auprès de la société indiquée ci-dessus. Une éducation du ressort est toutefois nécessaire pour parvenir aux fonctionnalités qui viennent d'être décrites. Cette éducation peut être réalisée par les spécialistes des AMF en fonction du cahier des charges défini par l'homme du métier compte tenu des critères de température retenus.To achieve a spring of AMF type double effect, the skilled person can get a spring AMF from the company indicated above. An education of spring is however necessary to achieve the features just described. This education can be carried out by AMF specialists according to the specifications defined by the person skilled in the art taking into account the temperature criteria selected.
Ainsi, quel que soit le mode de réalisation retenu parmi ceux qui viennent d'être décrit, ou parmi d'autres non décrits auxquels s'appliquerait l'invention, il est possible d'étendre la gamme des températures de fonctionnement normal (c'est-à-dire sans surchauffe, ou au contraire sans dysfonctionnement dû au froid) d'un composant électronique générateur d'énergie thermique, et ce de manière simple et fiable au moyen d'un actionneur passif, c'est-à-dire dont l'énergie d' actionnement est fournie par son élasticité propre et par les variations de la température du ressort 18 en AMF.Thus, whatever the embodiment chosen among those which have just been described, or among others not described to which the invention would apply, it is possible to extend the range of normal operating temperatures. that is to say without overheating, or on the contrary without a malfunction due to the cold) of an electronic component generating thermal energy, in a simple and reliable way by means of an actuator passive, that is to say whose operating energy is provided by its own elasticity and by the temperature variations of the spring 18 in AMF.
Il en résulte de substantielles économies d'énergie par rapport à un système de refroidissement actif, notamment du type à ventilateur, dont les inconvénients ont déjà été présentés en introduction.This results in substantial energy savings compared to an active cooling system, especially the fan type, the disadvantages have already been presented in the introduction.
Par ailleurs, quel que soit le mode de réalisation retenu, il est également envisageable d' interposer entre le radiateur et le composant (ou le support) un tampon (non représenté) dans un matériau dé contact thermique à changement de phase, qui réalise une interface facilitant entre eux la conduction thermique.Moreover, whatever the embodiment chosen, it is also conceivable to interpose between the radiator and the component (or the support) a buffer (not shown) in a phase change thermal contact material, which performs a interface facilitating between them the thermal conduction.
Pour réaliser une telle interface, l'homme du métier pourra notamment se référer au document US-2002/096614. To achieve such an interface, the skilled person may in particular refer to the document US-2002/096614.

Claims

REVENDICATIONS
1. Système (1) comportant un dispositif électronique (2) générateur d'énergie thermique ainsi qu'un radiateur (5), cet système (1) pouvant adopter une configuration active dans laquelle le radiateur (5) est en contact avec le dispositif électronique (2) , et une configuration inactive dans laquelle le radiateur (5) est écarté du dispositif électronique (2) , le système comportant en outre un actionneur thermique (7) apte à commander le passage du système de sa configuration active à sa configuration inactive lorsque la valeur de la température au voisinage du dispositif (2) devient inférieure à une première valeur seuil prédéterminée, et de sa configuration inactive à sa configuration active lorsque la valeur de la température au voisinage du dispositif (2) devient supérieure à une seconde valeur seuil prédéterminée, ce système étant caractérisé en ce que l' actionneur (7) comporte un élément (18) en alliage à mémoire de forme sous la forme dfun ressort.1. System (1) comprising an electronic device (2) generating thermal energy and a radiator (5), this system (1) being able to adopt an active configuration in which the radiator (5) is in contact with the device electronics (2), and an inactive configuration in which the radiator (5) is spaced from the electronic device (2), the system further comprising a thermal actuator (7) adapted to control the passage of the system from its active configuration to its configuration inactive when the value of the temperature in the vicinity of the device (2) becomes lower than a first predetermined threshold value, and from its inactive configuration to its active configuration when the value of the temperature in the vicinity of the device (2) becomes greater than one second predetermined threshold value, said system being characterized in that the actuator (7) comprises an element (18) in shape-memory alloy in the form of a re f ssort.
2. Système (1) selon la revendication 1, dans lequel ledit élément (18) en alliage à mémoire de forme est du type double effet. The system (1) of claim 1, wherein said shape memory alloy member (18) is of the double-acting type.
3. Système (1) selon la revendication 1, dans lequel ledit élément (18) en alliage à mémoire de forme est du type simple effet.The system (1) of claim 1, wherein said shape memory alloy member (18) is of the single-acting type.
4. Système (1) selon la revendication 3, dans lequel l' actionneur (7) comporte en outre un ressort de rappel (21) couplé à l'élément (18) en alliage à mémoire de forme. 4. System (1) according to claim 3, wherein the actuator (7) further comprises a return spring (21) coupled to the element (18) shape memory alloy.
5. Système (1) selon l'une des revendications 1 à5. System (1) according to one of claims 1 to
4, dans lequel ledit élément (18) en alliage à mémoire de forme est réalisé dans un alliage nickel-titane, comprenant éventuellement du cuivre. 4, wherein said shape memory alloy element (18) is made of a nickel-titanium alloy, optionally comprising copper.
6. Système (1) selon l'une des revendications 1 à6. System (1) according to one of claims 1 to
5, qui comporte en outre une interface réalisée dans un matériau de contact thermique à changement de phase, interposée entre le radiateur et le dispositif électronique. 5, which further comprises an interface made of a phase change thermal contact material interposed between the radiator and the electronic device.
7. Système (1) selon l'une des revendications 1 à7. System (1) according to one of claims 1 to
6, dans lequel le dispositif électronique (2) comporte un support (3) portant, du côté du radiateur (3) , un composant électronique (4) générateur d'énergie thermique, et dans lequel le radiateur (5) est monté sur le support (3) au droit du composant (4), en étant mobile par rapport au support (3) entre une position active dans laquelle il est en contact avec le composant électronique (4), et une position inactive dans laquelle il est écarté dudit composant (4) . 6, wherein the electronic device (2) comprises a support (3) carrying, on the radiator (3) side, an electronic component (4) generating thermal energy, and wherein the radiator (5) is mounted on the support (3) to the right of the component (4), being movable relative to the support (3) between an active position in which it is in contact with the electronic component (4), and an inactive position in which it is removed from said component (4).
8. Système selon l'une des revendications 1 à 6, dans laquelle le dispositif électronique compυrue un support portant, du côté du radiateur, un composant électronique générateur d'énergie thermique, et dans lequel le support est monté sur le radiateur avec le composant électronique au droit de celui-ci, en étant mobile par rapport au radiateur entre une position active dans laquelle le composant électronique est en contact avec le radiateur, et une position inactive dans laquelle le composant électronique est écarté du radiateur. 8. System according to one of claims 1 to 6, wherein the electronic device comprises a support carrying, on the radiator side, an electronic component generating thermal energy, and wherein the support is mounted on the radiator with the component. electronic to the right thereof, being movable relative to the radiator between an active position in which the electronic component is in contact with the radiator, and an inactive position in which the electronic component is removed from the radiator.
9. Système (1) selon l'une des revendications 1 à 6, dans lequel le dispositif électronique comporte un support portant, du côté opposé au radiateur, un composant électronique générateur d'énergie thermique, et dans lequel le radiateur est monté sur le support au droit du composant, en étant mobile par rapport au support entre une position active dans laquelle il est en contact avec le support, et une position inactive dans laquelle il est écarté dudit support.9. System (1) according to one of claims 1 to 6, wherein the electronic device comprises a support carrying, on the opposite side to the radiator, an electronic component generating thermal energy, and wherein the radiator is mounted on the support in the right of the component, being movable relative to the support between an active position in which it is in contact with the support, and an inactive position in which it is spaced apart from said support.
10. Système (1) selon l'une des revendications 1 à 6, dans lequel le dispositif électronique comporte un support (3) portant, du côté opposé au radiateur (5) , un composant électronique (4) générateur d'énergie thermique, et dans lequel le support (3) est monté sur le radiateur (5) avec le composant électronique (4) au droit de celui- ci, en étant mobile par rapport au radiateur (5) entre une position active dans laquelle le support (3) est en contact avec le radiateur (5) , et une position inactive dans laquelle le support (3) est écarté du radiateur (5) .10. System (1) according to one of claims 1 to 6, wherein the electronic device comprises a support (3) carrying, on the side opposite the radiator (5), an electronic component (4) generating thermal energy, and wherein the support (3) is mounted on the radiator (5) with the electronic component (4) at the right thereof, being movable relative to the radiator (5) between an active position in which the carrier (3) ) is in contact with the radiator (5), and an inactive position in which the support (3) is spaced from the radiator (5).
11. Système selon la revendication 9 ou 10, dans lequel le support (3) comporte des puits de drainage thermique (23) disposés au droit du composant électronique (4) .11. System according to claim 9 or 10, wherein the support (3) comprises thermal drainage wells (23) arranged in line with the electronic component (4).
12. Système selon l'une des revendications 1 à 6, dans lequel le dispositif électronique (2) est un boîtier électronique renfermant au moins un composant électronique générateur d'énergie thermique.12. System according to one of claims 1 to 6, wherein the electronic device (2) is an electronic box containing at least one electronic component generating thermal energy.
13. Système selon la revendication 13, dans lequel le radiateur (5) est monté sur le boîtier (2) en étant mobile par rapport à celui-ci entre une position active dans laquelle il est en contact avec le boîtier électronique (2) , et une position inactive dans laquelle il est écarté dudit boîtier (2) . 13. The system of claim 13, wherein the radiator (5) is mounted on the housing (2) being movable relative thereto between an active position in which it is in contact with the electronic housing (2), and an inactive position in which it is spaced from said housing (2).
14. Système selon la revendication 12, dans lequel le boîtier (2) est monté sur un châssis (3') sur lequel le radiateur est monté au droit du boîtier (2) , en étant mobile par rapport au châssis (3' ) entre une position active dans laquelle il est en contact avec le boîtier électronique (2) , et une position inactive dans laquelle il est écarté dudit boîtier (4') . 14. The system of claim 12, wherein the housing (2) is mounted on a frame (3 ') on which the radiator is mounted to the right of the housing (2), being movable relative to the frame (3') between an active position in which it is in contact with the electronic box (2), and an inactive position in which it is spaced from said box (4 ').
PCT/FR2005/003251 2004-12-23 2005-12-22 Two-state system for thermal regulation of an electronic device WO2006070121A1 (en)

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FR0413860A FR2880192B1 (en) 2004-12-23 2004-12-23 TWO-STATE SYSTEM FOR THE THERMAL REGULATION OF AN ELECTRONIC DEVICE
FR0413860 2004-12-23

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