SU1219284A1 - Method of soldering workpieces with irregular wide caps - Google Patents

Description

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The invention relates to the field of soldering, in particular to methods of soldering parts with uneven wide-gap overlapping joints, and can be used in the manufacture of heat exchangers or other areas of mechanical engineering.

The purpose of the invention is to improve the quality of the joints due to a more dense filling of the gaps with solder, reducing the capacity of the soldering structure to be reduced by eliminating the rigid fixation of the ends of the deforming gasket.

The method is carried out as follows.

When assembling parts, a solder and a bimetal gasket are placed in the gap. On laying the risks are preliminarily performed with a depth not less than the thickness of the metal layer on which they are applied. The assembled parts heat up the brazing temperature.

During the soldering process, the gasket placed in the gap between the parts is deformed due to the difference in the thermal expansion coefficient of the metal layers, the division of the non-capillary gap into separate sections of small extent in which the liquid solder is held during the soldering process, and the product is cooled until the solder solidifies.

FIG. 1 shows the assembly of parts for soldering; in fig. 2 - the joint and the distribution pattern of the gasket in the joint seam.

Between the pasted parts 1, two metered blanks of solder 2 made of copper foil 0.08 mm thick are placed, and a bimetallic gasket 3j active layer which is made of 75GND steel and a passive ZBN with thickness O, 1 mm is placed between the plates. Assembled in this way for soldering honeycomb part of the frame

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the heat exchanger is placed between the cheeks 4 and firmly clamped in a snap-in (not shown), after which brazing is performed in the furnace with control-. my atmosphere.

During the high-temperature soldering process, the bimetallic gasket 3 is deformed before the beginning of melting solder 2j to form a macrocavity, which cobbles divide the non-capillary wide gap into separate sections of small extent (Fig. 2). In which the solder is held during the soldering process and cooled down; stasis j2 vani solder.

With such an arrangement, the gasket is capable of holding the liquid solder in a non-capillary gap of great length, preventing it from flowing down under the effect of gravity. FIG. 3 shows a pattern of applying scratches on the surface of the gasket. They are applied from the side of the active layer to the depth of the passive layer, causing j, the place of the bend, for distributing the gasket in the gap with a certain interval of bends. The distance between the transverse risks is 10-15 mm, and the longitudinal ones are 3-5 mm.

Brazing is carried out in a container with a flowing neutral reducing atmosphere of argon and decomposition products of potassium fluoroborate with heating in an electric furnace.

Soldering mode is as follows: heat up

35 П20-1140 С - with a speed of 250-300 degrees / h; Capacity at 1120-1140 C for 10 min; cooling together with the container in flowing argon to 50 G;; argon consumption in the process of soldering and cooling is 10–12 l / min.

The invention allows to obtain high-quality solder joints of parts with uneven, wide gaps that are in the process of soldering.

 in any spatial position.

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Claims (2)

1. METHOD OF SOLDERING PARTS WITH UNEQUARIENT.WIDE GAP, in which a solder and a transverse risk pad made of a material wetted by solder are placed between the soldered parts and heated to a temperature of the soldering, characterized in that, in order to improve the quality of the soldered joints and reduce labor intensity, the gasket is made of bimetal, and the depth of the marks is not less than the thickness of the metal layer on which they are applied. 2. The method of pop. 1, characterized in that the gasket is performed with longitudinal risks on the surface. (L N5 Q0 wU 1,121