SU117331A1 - Solvent of residual boron fluxes during soldering - Google Patents
Solvent of residual boron fluxes during solderingInfo
- Publication number
- SU117331A1 SU117331A1 SU601922A SU601922A SU117331A1 SU 117331 A1 SU117331 A1 SU 117331A1 SU 601922 A SU601922 A SU 601922A SU 601922 A SU601922 A SU 601922A SU 117331 A1 SU117331 A1 SU 117331A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solvent
- during soldering
- residual boron
- fluxes during
- solution
- Prior art date
Links
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
Остатки борнокислых флюсов на местах пайки деталей из нержавеющих сталей, жаропрочных и медных сплавов в насто щее врем удал ютс последовательной промывкой деталей сначала в гор чей воде (70-90°) в течение 15-20 мин., а затем в холодной проточной воде в течение 30 мин. Детали же из конструкционной стали подвергаютс последовательной промывке: сначала в 2-3%-ном растворе натриевого ИЛИ калиевого хромпика в течение 20-30 мин. при температуре 70-90, а затем в 1%-ном растворе натриевого или калиевого хромпика в течение 10-15 мин. при комнатной температуре. Этот способ удалени остатков борнокислых флюсов с мест пайки слож;ен по его технологин и длителен по времени.The residues of boric acid fluxes at the places of soldering of parts from stainless steels, heat-resistant and copper alloys are currently removed by sequential washing of parts first in hot water (70-90 °) for 15-20 minutes, and then in cold running water for 30 minutes Parts made of structural steel are subjected to sequential washing: first in a 2-3% solution of sodium OR potassium chromic for 20-30 minutes. at a temperature of 70-90, and then in a 1% solution of sodium or potassium chromic for 10-15 minutes. at room temperature. This method of removing residual boric acid fluxes from soldering sites is complicated by its technologist and is time consuming.
Предлагаемый способ значительно ускор ет процесс удалени остатков борнокислых флюсов с мест пайки и уменьшает трудоемкостьЭто достигаетс путем применени в качестве растворител слабого водного раствора кислого, сернокислого кали или другого щелочного металла .The proposed method significantly speeds up the process of removing residual bore acid fluxes from the soldering sites and reduces the labor intensity. This is achieved by using a weak aqueous solution of an acidic solution of potassium sulphate or another alkali metal as a solvent.
Раствор КИСЛОГО, сернокислого кали , раствор борнокислые флюсы , в то же врем не вызывает растворени основного металла и припо . Этот раствор действует как на холоде, так и при нагреве до 70°. Нагрев раствора выше 85° вызывает частичное растворение припо и основного металла. Длительность растворени остатков борнокислых флюсов с мест пайки колеблетс от 6 мин. до 1 часа в зависимости oi обрабатываемых деталей.A solution of acidic potassium sulfate, a solution of boric acid fluxes, at the same time does not cause the dissolution of the base metal and solder. This solution acts both in the cold and when heated to 70 °. Heating the solution above 85 ° causes partial dissolution of the solder and base metal. The duration of dissolution of boric acid flux residues from soldering sites varies from 6 minutes. up to 1 hour depending on the machined parts.
Растворитель остатков борнокислых флюсов при пайке, отличаюЩИ и с тем, что дл снижени трудоемкости по удалению остатковSolvent of boric acid flux residues during soldering, which is also distinguished by the fact that in order to reduce the laboriousness of removing residues
Предмет из обретени № 117331 флюса примен ют водный раствор кислого, другого щелочного металла. сернокислого кали или The item from acquisition No. 117331 of the flux uses an aqueous solution of an acidic, other alkali metal. potassium sulphate or
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU601922A SU117331A1 (en) | 1958-06-12 | 1958-06-12 | Solvent of residual boron fluxes during soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU601922A SU117331A1 (en) | 1958-06-12 | 1958-06-12 | Solvent of residual boron fluxes during soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
SU117331A1 true SU117331A1 (en) | 1958-11-30 |
Family
ID=48389489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU601922A SU117331A1 (en) | 1958-06-12 | 1958-06-12 | Solvent of residual boron fluxes during soldering |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU117331A1 (en) |
-
1958
- 1958-06-12 SU SU601922A patent/SU117331A1/en active
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