SI2291064T1 - Electronic unit with cooling fins - Google Patents
Electronic unit with cooling finsInfo
- Publication number
- SI2291064T1 SI2291064T1 SI201031321A SI201031321A SI2291064T1 SI 2291064 T1 SI2291064 T1 SI 2291064T1 SI 201031321 A SI201031321 A SI 201031321A SI 201031321 A SI201031321 A SI 201031321A SI 2291064 T1 SI2291064 T1 SI 2291064T1
- Authority
- SI
- Slovenia
- Prior art keywords
- electronic unit
- cooling fins
- fins
- cooling
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009038806A DE102009038806A1 (en) | 2009-08-25 | 2009-08-25 | Electronic unit with cooling fins |
EP10008710.5A EP2291064B1 (en) | 2009-08-25 | 2010-08-20 | Electronic unit with cooling fins |
Publications (1)
Publication Number | Publication Date |
---|---|
SI2291064T1 true SI2291064T1 (en) | 2016-12-30 |
Family
ID=43332615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SI201031321A SI2291064T1 (en) | 2009-08-25 | 2010-08-20 | Electronic unit with cooling fins |
Country Status (6)
Country | Link |
---|---|
US (1) | US8320127B2 (en) |
EP (1) | EP2291064B1 (en) |
DE (1) | DE102009038806A1 (en) |
DK (1) | DK2291064T3 (en) |
ES (1) | ES2600511T3 (en) |
SI (1) | SI2291064T1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110108250A1 (en) * | 2009-11-09 | 2011-05-12 | Alex Horng | Heat Dissipating device |
CN102882397A (en) * | 2012-06-25 | 2013-01-16 | 山亿新能源股份有限公司 | Naturally heat radiation structure of inverter die-casting box |
EP2978292A4 (en) * | 2013-03-19 | 2016-11-16 | Fuji Electric Co Ltd | Cooling structure for magnetic component, and power converter provided with same |
JP5971403B2 (en) * | 2013-03-19 | 2016-08-17 | 富士電機株式会社 | Cooling device and power conversion device provided with the same |
JP6256295B2 (en) * | 2014-10-28 | 2018-01-10 | 株式会社デンソー | Heat exchanger |
CN206909011U (en) | 2017-04-19 | 2018-01-19 | 西门子公司 | Radiator and frequency converter |
JP7081203B2 (en) * | 2018-02-26 | 2022-06-07 | トヨタ自動車株式会社 | Radiation fin structure and cooling structure of electronic board using this |
DE102021214756A1 (en) * | 2021-12-21 | 2023-06-22 | Magna powertrain gmbh & co kg | cooler |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68920513T2 (en) * | 1988-08-31 | 1995-05-04 | Hitachi Ltd | Inverter device. |
JP3159071B2 (en) * | 1996-08-01 | 2001-04-23 | 株式会社日立製作所 | Electric device having radiating fins |
US6041287A (en) * | 1996-11-07 | 2000-03-21 | Reliance Electric Industrial Company | System architecture for on-line machine diagnostics |
JPH10150284A (en) * | 1996-11-20 | 1998-06-02 | Yaskawa Electric Corp | Control unit |
US5909358A (en) * | 1997-11-26 | 1999-06-01 | Todd Engineering Sales, Inc. | Snap-lock heat sink clip |
DE19913450A1 (en) * | 1999-03-25 | 2000-09-28 | Mannesmann Sachs Ag | Power electronics for controlling electrical power machine performance/power section with capacitors connecting splint rings and screw joints while the lid connects to the housing with connections to the cooling device |
US6359779B1 (en) * | 1999-04-05 | 2002-03-19 | Western Digital Ventures, Inc. | Integrated computer module with airflow accelerator |
US6296048B1 (en) * | 2000-09-08 | 2001-10-02 | Powerwave Technologies, Inc. | Heat sink assembly |
US7038910B1 (en) * | 2002-01-07 | 2006-05-02 | Wave7 Optics, Inc. | System and method for removing heat from a subscriber optical interface |
US6891725B2 (en) * | 2002-09-23 | 2005-05-10 | Siemens Energy & Automation, Inc. | System and method for improved motor controller |
ES2377018T3 (en) * | 2004-06-24 | 2012-03-21 | Sma Solar Technology Ag | Inverter with a housing with electrical and / or electronic components presenting heat sinks |
DE102004030457A1 (en) | 2004-06-24 | 2006-01-12 | Sma Technologie Ag | Inverter for currents, e.g. for converting direct/alternating current voltages, has a casing with a cooling unit for cooling the electric/electronic components in the inverter |
FR2881018B1 (en) * | 2005-01-19 | 2007-04-06 | Intelligent Electronic Systems | METHOD FOR COOLING A STATIC POWER CONVERSION DEVICE AND CORRESPONDING DEVICE |
US7472742B2 (en) * | 2005-12-01 | 2009-01-06 | General Electric Company | Heat sink assembly |
US7817421B2 (en) * | 2006-09-13 | 2010-10-19 | Kabushiki Kaisha Yaskawa Denki | Motor controller |
JP2008140802A (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | Heat sink |
EP1996004B1 (en) * | 2007-05-25 | 2014-07-09 | SMA Solar Technology AG | Inverter casing |
JP5381561B2 (en) * | 2008-11-28 | 2014-01-08 | 富士電機株式会社 | Semiconductor cooling device |
-
2009
- 2009-08-25 DE DE102009038806A patent/DE102009038806A1/en not_active Ceased
-
2010
- 2010-08-20 DK DK10008710.5T patent/DK2291064T3/en active
- 2010-08-20 US US12/859,946 patent/US8320127B2/en active Active
- 2010-08-20 EP EP10008710.5A patent/EP2291064B1/en active Active
- 2010-08-20 ES ES10008710.5T patent/ES2600511T3/en active Active
- 2010-08-20 SI SI201031321A patent/SI2291064T1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US8320127B2 (en) | 2012-11-27 |
ES2600511T3 (en) | 2017-02-09 |
DK2291064T3 (en) | 2016-12-05 |
EP2291064B1 (en) | 2016-08-17 |
EP2291064A2 (en) | 2011-03-02 |
US20110051370A1 (en) | 2011-03-03 |
DE102009038806A1 (en) | 2011-03-03 |
EP2291064A3 (en) | 2014-01-01 |
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