JPH10150284A - Control unit - Google Patents
Control unitInfo
- Publication number
- JPH10150284A JPH10150284A JP32614896A JP32614896A JPH10150284A JP H10150284 A JPH10150284 A JP H10150284A JP 32614896 A JP32614896 A JP 32614896A JP 32614896 A JP32614896 A JP 32614896A JP H10150284 A JPH10150284 A JP H10150284A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- cooling
- control unit
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体素子を取付
けたヒートシンクを有する制御ユニットに関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control unit having a heat sink on which a semiconductor element is mounted.
【０００２】[0002]
【従来の技術】従来の制御ユニットの構成は、図５ない
し図７に示すように構成してある。図において、２０は
コ字状に形成したケースで、このケース２０の底板２０
ａにヒートシンク２１が取付けてある。前記ヒートシン
ク２１の裏面に断面を山形にした冷却フィン２２が設け
られ、表面にトランジスタのように発熱量が大きい半導
体素子２３および整流ダイオードのように発熱量の小さ
い半導体素子２４が取付けられている。２５は前記ヒー
トシンク２１の冷却フィン２２を覆う覆板で、前記ケー
ス２０の底板２０ａとの間に風洞２６を形成している。
２７は前記風洞２６の一方端に設けた冷却フアンであ
る。前記冷却フアンによる冷気は、風洞２６の端部の吸
入口２８から吸入し、前記ヒートシンク２１の冷却フィ
ン２２間を流通して風洞２６の端部に設けた排気口２９
から外部に排出するように構成してある。2. Description of the Related Art A conventional control unit has a structure as shown in FIGS. In the figure, reference numeral 20 denotes a case formed in a U-shape.
The heat sink 21 is attached to a. A cooling fin 22 having a mountain-shaped cross section is provided on the back surface of the heat sink 21, and a semiconductor element 23 having a large calorific value like a transistor and a semiconductor element 24 with a small calorific value like a rectifier diode are mounted on the surface. A cover plate 25 covers the cooling fins 22 of the heat sink 21, and forms an air tunnel 26 with the bottom plate 20 a of the case 20.
27 is a cooling fan provided at one end of the wind tunnel 26. Cool air generated by the cooling fan is sucked through an inlet 28 at an end of the wind tunnel 26, flows between the cooling fins 22 of the heat sink 21, and is provided at an exhaust port 29 provided at the end of the wind tunnel 26.
It is configured to be discharged from the outside.
【０００３】[0003]
【発明が解決しようとする課題】ところが、従来の制御
ユニットは、発熱量の大きい半導体素子２３と発熱量の
比較的小さい半導体素子４とを１つのヒートシンク２１
に取付けている。このため、前記発熱量の大きい半導体
素子２３の発熱量を基準に、冷却フィンの長手方向の長
さが一定の長さを有する冷却フィン２２を有するヒート
シンク２１を選定しているため、ヒートシンク２１の長
さが長くなり、ヒートシンクが大形化する欠点があっ
た。また、冷却フアンによる冷却風が発熱量の比較的小
さい半導体素子２４を取付けた部分のヒートシンククの
冷却フィンの表面を流通して温められる。この温められ
た冷却風と冷却フィンに接触していない温められていな
い冷却風とが混ざり合うことなく層状になって、発熱量
の大きい半導体素子２３を取付けた部分のヒートシンク
の冷却フィンに温められた冷却風が接しながら流通する
ため、発熱量の大きい半導体素子を取付けた部分のヒー
トシンクの冷却フィンの冷却が十分に行われず、発熱量
の大きい半導体素子は十分に冷却されない。このため、
発熱量の大きい半導体素子の定格出力を確保することが
できなかった。本発明は、ヒートシンクを大形化するこ
となく、ヒートシンクを確実に冷却してトランジスタの
定格出力を確保することを目的とする。However, in the conventional control unit, the semiconductor element 23 generating a large amount of heat and the semiconductor element 4 generating a relatively small amount of heat are combined into one heat sink 21.
It is attached to. For this reason, the heat sink 21 having the cooling fin 22 having a fixed length in the longitudinal direction of the cooling fin is selected based on the heat generation amount of the semiconductor element 23 having the large heat generation amount. There is a disadvantage that the length becomes long and the heat sink becomes large. Further, the cooling air generated by the cooling fan is heated by flowing through the surface of the cooling fin of the heat sink at the portion where the semiconductor element 24 having a relatively small amount of heat generation is mounted. The heated cooling air and the unheated cooling air not in contact with the cooling fins are layered without being mixed, and are heated by the cooling fins of the heat sink at the portion where the semiconductor element 23 having a large heat value is attached. Since the cooling air flows while contacting the cooling air, the cooling fins of the heat sink at the portion where the semiconductor element generating a large amount of heat is attached are not sufficiently cooled, and the semiconductor element generating a large amount of heat is not sufficiently cooled. For this reason,
The rated output of the semiconductor element generating a large amount of heat could not be secured. SUMMARY OF THE INVENTION An object of the present invention is to reliably cool a heat sink without increasing the size of the heat sink, thereby ensuring the rated output of the transistor.
【０００４】[0004]
【課題を解決するための手段】上記問題点を解決するた
めに、本発明は、種々の発熱量をもつ半導体素子が取付
けられたヒートシンクをケースの底板に取付け、前記ヒ
ートシンクの冷却フィンに冷却フアンによる冷却風を流
通させて冷却する制御ユニットにおいて、発熱量の大き
い半導体素子を取付けた第１のヒートシンクと、発熱量
の比較的小さい半導体素子を取付けた第２のヒートシン
クと、風洞を形成する覆板と、冷却風を導く整流板とを
有し、前記第１のヒートシンクは空間を介して第２のヒ
ートシンクの風下に配設され、前記覆板は両ヒートシン
クを覆ってケースに取付けられるとともに前記ケースの
底板との間に風洞を形成し、前記整流板は斜辺部を有す
る部材からなり前記第１のヒートシンクの側面と第２の
ヒートシンクの側面に跨がって配置され、風上側の一方
端の内側面を前記第２のヒートシンクの幅方向の側面に
取付け、かつ、風下側の他方端の内側面を前記第１のヒ
ートシンクの幅方向の側面に取付けている。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method of mounting a heat sink on which semiconductor elements having various heat values are mounted to a bottom plate of a case, and a cooling fan to a cooling fin of the heat sink. A first heat sink to which a semiconductor element having a large amount of heat is attached, a second heat sink to which a semiconductor element having a relatively small amount of heat is attached, and a cover forming a wind tunnel. A first heat sink is disposed downstream of a second heat sink via a space, and the cover plate is attached to a case to cover both heat sinks, A wind tunnel is formed between the case and a bottom plate of the case, and the current plate is formed of a member having a hypotenuse portion, and a side surface of the first heat sink and a side of the second heat sink. , The inner surface at one end on the windward side is attached to the side surface in the width direction of the second heat sink, and the inner surface at the other end on the leeward side is set in the width direction of the first heat sink. Installed on the side.
【０００５】[0005]
【発明の実施の形態】以下、本発明を図に示す実施例に
基づいて説明する。図１は、本発明の実施例を示す制御
ユニットの斜視図、図２は、本発明の実施例を示す制御
ユニットの縦断面側面図、図３は、図２のＡ−Ａ線に沿
う断面図、図４は、図３のＢ−Ｂ線に沿う断面図であ
る。図において、１はコ字状に形成したケースで、底板
１ａにロ字状の切り欠き穴１ｃ、１ｄが設けられ、上面
にカバー１ｂが取付けられている。２は第１のヒートシ
ンクで、裏面に断面を山形にした冷却フィン３が複数個
設けられ、表面を前記ケース１の底板１ａに取付けてあ
る。前記底板１ａの切り欠き穴１ｃに位置する第１のヒ
ートシンク２の表面にはトランジスタ等の発熱量の大き
い半導体素子４を複数個、例えば６個取付けてある。５
は第２のヒートシンクで、裏面に断面を山形にした冷却
フィン６を複数個有し、表面を前記ケース１の底板１ａ
に取付けてある。前記底板１ａの切り欠き穴１ｄに位置
する前記第２のヒートシンク５の表面には整流ダイオー
ド等の発熱量の小さい半導体素子７を複数個、例えば６
個取付けてある。前記発熱量の大きい半導体素子４を取
付けた第１のヒートシンク２は、発熱量の比較的小さい
半導体素子７を取付けた第２のヒートシンク５の風下に
空間をおいて配置してある。８はコ字状に形成し、前記
ケース１の底板１ａに取付けた覆板で、前記ヒートシン
ク２の冷却フィン３および第２のヒートシンク５の冷却
フィン６を囲い、前記ケース１の底板１ａとの間に風洞
９を形成するように構成してある。１０は前記風洞９の
一方側に設け、前記ケース１の底板１ａに取付けられた
冷却フアン、１１は風洞９に設けた吸気口である。１２
は風洞９に設けた排気口である。１３は前記風洞９内に
設けた整流板で、斜辺部を有する部材からなり前記第１
のヒートシンク２の側面と第２のヒートシンク５の側面
に跨がって配置され、風上側の一方端の内側面を第２の
ヒートシンク５の幅方向の側面に取付け、風下側の他方
端の内側面を前記第１のヒートシンク２の幅方向の側面
に取付けてある。１４は抵抗等の電気部品を取付け電気
部品相互をプリント配線したプリント基板で、前記ケー
ス１に取付けてある。１５は覆板８の底面に取付けた案
内板で、板面を前記冷却フィン６および冷却フィン３の
高さ方向の先端に当接させてある。つぎに、制御ユニッ
トの冷却作用について説明をする。冷却フアン１０を始
動すると、風洞９の一端の吸気口１１から吸入した冷却
風が第２のヒートシンク５の冷却フィン６間を流通す
る。前記冷却フィン６の間を冷却風が流通すると、第２
のヒートシンク５に発熱量の比較的小さい半導体素子７
からの熱で高温になった冷却フィン６との間で熱交換を
行い、前記冷却フィン６を介して発熱量の比較的小さい
半導体素子を冷却する。前記冷却フィン６間を流通して
温められた冷却風の熱は、整流板１３と案内板１５およ
び底板１ａで囲われた空間に流入して温められていない
冷却風に拡散されて冷却風の温度が低下する。この温度
が低下した冷却風を第１のヒートシンク２の冷却フィン
３の間を流通させて前記第１のヒートシンク２に取付け
た発熱量の大きい半導体素子４により高温となった冷却
フィン３との間で熱交換を行い、前記冷却フィン３を介
して発熱量の大きい半導体素子４を冷却して排気口１２
より冷却風を外部に排出する。このように、第１のヒー
トシンク２と第２のヒートシンク５との間に整流板１３
と案内板１５とケース１の底板１ａとにより区画された
空間を設け、この空間の断面積を第２のヒートシンク５
の冷却フィン６を流通する流通路の断面積より広くして
いる。このため、第２のヒートシンク５の冷却フィン６
で温められた冷却風と温められていない冷却風とがこの
空間に流れこむと温められた冷却風と温められていない
冷却風とが混合されて冷却風の温度を下げる。この温度
が下がった冷却風が第１のヒートシンク２の冷却フィン
３間を流通するので、第１のヒートシンク２を確実に冷
却することができる。前記案内板１５を、第２のヒート
シンク５の冷却フィン６の先端および第１のヒートシン
ク２の冷却フィン３の先端に当接させたので、冷却風が
前記冷却フィン３、６のフィン間を確実に流通して冷却
フィンを冷却することができる。図１では案内板１５を
設けたが、案内板を設けず覆板８を冷却フィン６の先端
に当接させてケース１の底板１ａに取付けてもよい。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in the drawings. FIG. 1 is a perspective view of a control unit showing an embodiment of the present invention, FIG. 2 is a longitudinal sectional side view of the control unit showing an embodiment of the present invention, and FIG. 3 is a cross section taken along line AA of FIG. FIG. 4 is a cross-sectional view taken along the line BB of FIG. In the figure, reference numeral 1 denotes a case formed in a U-shape, in which a bottom plate 1a is provided with notches 1c and 1d in the shape of a square, and a cover 1b is mounted on the upper surface. A first heat sink 2 is provided with a plurality of cooling fins 3 having a mountain-shaped cross section on the back surface, and the front surface is attached to the bottom plate 1 a of the case 1. On the surface of the first heat sink 2 located in the cutout hole 1c of the bottom plate 1a, a plurality of, for example, six, semiconductor elements 4 having a large heat value such as transistors are mounted. 5
Is a second heat sink having a plurality of cooling fins 6 having a mountain-shaped cross section on the back surface, and the bottom surface 1a of the case 1
It is attached to. On the surface of the second heat sink 5 located in the cutout hole 1d of the bottom plate 1a, a plurality of semiconductor elements 7, such as rectifier diodes, which generate a small amount of heat, for example, 6
It is attached individually. The first heat sink 2 to which the semiconductor element 4 having a large calorific value is attached is arranged with a space downwind of the second heat sink 5 to which the semiconductor element 7 with a comparatively small calorific value is attached. A cover plate 8 is formed in a U-shape and attached to the bottom plate 1a of the case 1. The cover plate 8 surrounds the cooling fins 3 of the heat sink 2 and the cooling fins 6 of the second heat sink 5, and is connected to the bottom plate 1a of the case 1. It is configured to form a wind tunnel 9 therebetween. A cooling fan 10 is provided on one side of the wind tunnel 9 and is attached to the bottom plate 1a of the case 1. An air inlet 11 is provided in the wind tunnel 9. 12
Is an exhaust port provided in the wind tunnel 9. Reference numeral 13 denotes a rectifying plate provided in the wind tunnel 9 and is made of a member having a hypotenuse.
The heat sink 2 is disposed so as to straddle the side surface of the heat sink 2 and the side surface of the second heat sink 5. The inner surface at one end on the windward side is attached to the side surface in the width direction of the second heat sink 5. The side surface is attached to the side surface of the first heat sink 2 in the width direction. Reference numeral 14 denotes a printed circuit board on which electric components such as resistors are mounted and the electric components are printed and wired with each other. Reference numeral 15 denotes a guide plate attached to the bottom surface of the cover plate 8, and the plate surface is brought into contact with the tips of the cooling fins 6 and 3 in the height direction. Next, the cooling operation of the control unit will be described. When the cooling fan 10 is started, the cooling air sucked from the intake port 11 at one end of the wind tunnel 9 flows between the cooling fins 6 of the second heat sink 5. When cooling air flows between the cooling fins 6, the second
Semiconductor element 7 having a relatively small heat value
The heat is exchanged with the cooling fins 6 that have become high in temperature due to the heat from them, and the semiconductor element having a relatively small heat value is cooled through the cooling fins 6. The heat of the cooling air that has been warmed by flowing between the cooling fins 6 flows into the space surrounded by the current plate 13, the guide plate 15, and the bottom plate 1 a, is diffused into the unheated cooling air, and The temperature drops. The cooling air having the lowered temperature is allowed to flow between the cooling fins 3 of the first heat sink 2, and between the cooling fin 3 and the cooling fin 3, which is heated by the semiconductor element 4 having a large calorific value attached to the first heat sink 2. Heat is exchanged by the cooling fins 3 to cool the semiconductor element 4 having a large heat value through the cooling fins 3.
More cooling air is discharged outside. Thus, the rectifying plate 13 is provided between the first heat sink 2 and the second heat sink 5.
And a space defined by the guide plate 15 and the bottom plate 1 a of the case 1.
Is larger than the cross-sectional area of the flow passage through which the cooling fin 6 flows. For this reason, the cooling fins 6 of the second heat sink 5
When the cooling air heated in step (1) and the uncooled cooling air flow into this space, the heated cooling air and the unwarmed cooling air are mixed to lower the temperature of the cooling air. Since the cooling air having the lowered temperature flows between the cooling fins 3 of the first heat sink 2, the first heat sink 2 can be reliably cooled. Since the guide plate 15 is brought into contact with the tips of the cooling fins 6 of the second heat sink 5 and the tips of the cooling fins 3 of the first heat sink 2, the cooling air reliably flows between the fins of the cooling fins 3, 6. To cool the cooling fins. Although the guide plate 15 is provided in FIG. 1, the cover plate 8 may be attached to the bottom plate 1 a of the case 1 by abutting the tip of the cooling fin 6 without providing the guide plate.
【０００６】[0006]
【発明の効果】以上述べたように、本発明によればつぎ
のような効果がある。 発熱量の大きい半導体素子と発熱量の小さい半導体
素子の発熱量に応じてヒートシンクを選定するので、ヒ
ートシンクを小形にできる。 ヒートシンクを分割し、分割したヒートシンクの間
に空間を設け、この空間の断面積をヒートシンクの冷却
フィンの流通路の断面積より大きくして、冷却フィン間
を流通した温められた冷却風を温められていない冷却風
と混合して冷却風の温度を下げるので、冷却効率を向上
でき、半導体素子の定格出力を確保できる。 案内板を第１および第２のヒートシンクの冷却フィ
ンの先端に当接させたので、冷却風が前記冷却フィンの
フィン間を確実に流通して冷却フィンを効率よく冷却す
ることができる。As described above, the present invention has the following effects. Since the heat sink is selected according to the heat value of the semiconductor element having a large heat value and the heat value of the semiconductor element having a small heat value, the heat sink can be downsized. The heat sink is divided, a space is provided between the divided heat sinks, the cross-sectional area of this space is made larger than the cross-sectional area of the cooling fin flow passage of the heat sink, and the warmed cooling air flowing between the cooling fins can be warmed. Since the temperature of the cooling air is reduced by mixing with the cooling air that has not been cooled, the cooling efficiency can be improved, and the rated output of the semiconductor element can be secured. Since the guide plate is in contact with the tips of the cooling fins of the first and second heat sinks, the cooling air can reliably flow between the cooling fins, and the cooling fins can be efficiently cooled.
【図１】本発明の実施例を示す制御ユニットの斜視図で
ある。FIG. 1 is a perspective view of a control unit showing an embodiment of the present invention.
【図２】本発明の実施例を示す制御ユニットの縦断面側
面図である。FIG. 2 is a longitudinal sectional side view of a control unit showing an embodiment of the present invention.
【図３】図２のＡ−Ａ線に沿う断面図である。FIG. 3 is a sectional view taken along line AA of FIG. 2;
【図４】図２のＢ−Ｂ線に沿う断面図である。FIG. 4 is a sectional view taken along line BB of FIG. 2;
【図５】従来の制御ユニットの縦断面側面図である。FIG. 5 is a longitudinal sectional side view of a conventional control unit.
【図６】図５のＣ−Ｃ線に沿う断面図である。FIG. 6 is a sectional view taken along line CC of FIG. 5;
【図７】図５のＤ−Ｄ線に沿う断面図である。FIG. 7 is a sectional view taken along line DD of FIG. 5;
１ ケース、 １ａ 底板、 １ｂ カバー、 １ｃ
切り欠き穴、１ｄ 切り欠き穴、 ２ 第１のヒートシ
ンク、 ３ 冷却フィン、４ 半導体素子、 ５ 第２
のヒートシンク、 ６ 冷却フィン、７ 半導体素子、
８ 覆板、 ９ 風洞、 １０ 冷却フアン、１１
吸気口、 １２ 排気口、 １３ 整流板、 １４
プリント基板、１５ 案内板1 case, 1a bottom plate, 1b cover, 1c
Notch hole, 1d notch hole, 2 first heat sink, 3 cooling fin, 4 semiconductor element, 5 second
Heat sink, 6 cooling fins, 7 semiconductor elements,
8 cover plate, 9 wind tunnel, 10 cooling fan, 11
Inlet, 12 Exhaust, 13 Rectifier plate, 14
Printed circuit board, 15 guide board
Claims (2)
られたヒートシンクをケースの底板に取付け、前記ヒー
トシンクの冷却フィンに冷却フアンによる冷却風を流通
させて冷却する制御ユニットにおいて、発熱量の大きい
半導体素子を取付けた第１のヒートシンクと、発熱量の
比較的小さい半導体素子を取付けた第２のヒートシンク
と、風洞を形成する覆板と、冷却風を導く整流板とを有
し、前記第１のヒートシンクは空間を介して第２のヒー
トシンクの風下に配設され、前記覆板は前記両ヒートシ
ンクを覆ってケースに取付けられるとともに前記ケース
の底板との間に風洞を形成し、前記整流板は斜辺部を有
する部材からなり前記第１のヒートシンクの側面と第２
のヒートシンクの側面に跨がって配置され、風上側の一
方端の内側面を前記第２のヒートシンクの幅方向の側面
に取付け、かつ、風下側の他方端の内側面を前記第１の
ヒートシンクの幅方向の側面に取付けていることを特徴
とする制御ユニット。1. A control unit which mounts a heat sink on which a semiconductor element having various heat values is mounted to a bottom plate of a case, and cools the cooling fins of the heat sink by flowing cooling air from a cooling fan to generate a large amount of heat. A first heat sink on which a semiconductor element is mounted, a second heat sink on which a semiconductor element having a relatively small heat value is mounted, a cover plate forming an air tunnel, and a rectifying plate for guiding cooling air; Is disposed downstream of the second heat sink via a space, the cover plate covers the heat sinks, is attached to the case, and forms a wind tunnel between the heat sink and the bottom plate of the case. A side surface of the first heat sink and a second side formed of a member having a hypotenuse portion;
, The inner surface at one end on the leeward side is attached to the widthwise side surface of the second heat sink, and the inner surface at the other end on the leeward side is the first heat sink. A control unit, which is mounted on a side surface in the width direction of the control unit.
冷却フィンの高さ方向の先端部に当接する案内板を取付
けたことを特徴とする請求項１記載の制御ユニット。2. The control unit according to claim 1, wherein a guide plate is mounted on a bottom surface of the cover plate so as to abut on a height direction end of the cooling fins of the heat sinks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32614896A JPH10150284A (en) | 1996-11-20 | 1996-11-20 | Control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32614896A JPH10150284A (en) | 1996-11-20 | 1996-11-20 | Control unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10150284A true JPH10150284A (en) | 1998-06-02 |
Family
ID=18184594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32614896A Pending JPH10150284A (en) | 1996-11-20 | 1996-11-20 | Control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10150284A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1176706A2 (en) * | 2000-07-26 | 2002-01-30 | Lenze GmbH & Co. KG | Frequency converter with a housing consisting in an upper part and a lower part |
| DE102004030457A1 (en) * | 2004-06-24 | 2006-01-12 | Sma Technologie Ag | Inverter for currents, e.g. for converting direct/alternating current voltages, has a casing with a cooling unit for cooling the electric/electronic components in the inverter |
| DE19734270B4 (en) * | 1997-08-07 | 2006-02-23 | Siemens Ag | Air-cooled converter module |
| JP2008258469A (en) * | 2007-04-06 | 2008-10-23 | Matsushita Electric Ind Co Ltd | Electronic equipment |
| WO2009028434A1 (en) * | 2007-08-30 | 2009-03-05 | Onkyo Corporation | Heat dissipating structure of electronic device and member attaching structure |
| US7816631B2 (en) | 2004-06-24 | 2010-10-19 | Sma Solar Technology Ag | Inverter with a housing having a cooling unit |
| JP2011097824A (en) * | 2010-12-10 | 2011-05-12 | Hitachi Industrial Equipment Systems Co Ltd | Power converter |
| JP2012120330A (en) * | 2010-12-01 | 2012-06-21 | Fuji Electric Co Ltd | Dc/dc converter device |
| JP2012210115A (en) * | 2011-03-30 | 2012-10-25 | Yaskawa Electric Corp | Electric power conversion apparatus |
| EP2291064A3 (en) * | 2009-08-25 | 2014-01-01 | Gerhard Leutwein | Electronic unit with cooling fins |
| US8743541B2 (en) | 2011-03-08 | 2014-06-03 | Kabushiki Kaisha Toshiba | Display device and electronic device |
| DE102014105114A1 (en) * | 2014-04-10 | 2015-10-15 | Semikron Elektronik Gmbh & Co. Kg | Converter arrangement with capacitor device |
| JP2016184657A (en) * | 2015-03-26 | 2016-10-20 | 三菱電機株式会社 | Heat dissipation structure of electronic apparatus casing |
| JP2017041494A (en) * | 2015-08-18 | 2017-02-23 | 富士電機株式会社 | Electronic/electric device |
-
1996
- 1996-11-20 JP JP32614896A patent/JPH10150284A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19734270B4 (en) * | 1997-08-07 | 2006-02-23 | Siemens Ag | Air-cooled converter module |
| EP1176706A3 (en) * | 2000-07-26 | 2004-01-14 | Lenze Drive Systems GmbH | Frequency converter with a housing consisting in an upper part and a lower part |
| EP1176706A2 (en) * | 2000-07-26 | 2002-01-30 | Lenze GmbH & Co. KG | Frequency converter with a housing consisting in an upper part and a lower part |
| DE102004030457A1 (en) * | 2004-06-24 | 2006-01-12 | Sma Technologie Ag | Inverter for currents, e.g. for converting direct/alternating current voltages, has a casing with a cooling unit for cooling the electric/electronic components in the inverter |
| US7816631B2 (en) | 2004-06-24 | 2010-10-19 | Sma Solar Technology Ag | Inverter with a housing having a cooling unit |
| JP2008258469A (en) * | 2007-04-06 | 2008-10-23 | Matsushita Electric Ind Co Ltd | Electronic equipment |
| JP4670828B2 (en) * | 2007-04-06 | 2011-04-13 | パナソニック株式会社 | Electronics |
| WO2009028434A1 (en) * | 2007-08-30 | 2009-03-05 | Onkyo Corporation | Heat dissipating structure of electronic device and member attaching structure |
| JP4457414B2 (en) * | 2007-08-30 | 2010-04-28 | オンキヨー株式会社 | Heat dissipation structure of electronic equipment |
| JPWO2009028434A1 (en) * | 2007-08-30 | 2010-12-02 | オンキヨー株式会社 | Heat dissipation structure of electronic equipment |
| EP2291064A3 (en) * | 2009-08-25 | 2014-01-01 | Gerhard Leutwein | Electronic unit with cooling fins |
| JP2012120330A (en) * | 2010-12-01 | 2012-06-21 | Fuji Electric Co Ltd | Dc/dc converter device |
| JP2011097824A (en) * | 2010-12-10 | 2011-05-12 | Hitachi Industrial Equipment Systems Co Ltd | Power converter |
| US8743541B2 (en) | 2011-03-08 | 2014-06-03 | Kabushiki Kaisha Toshiba | Display device and electronic device |
| JP2012210115A (en) * | 2011-03-30 | 2012-10-25 | Yaskawa Electric Corp | Electric power conversion apparatus |
| US8773851B2 (en) | 2011-03-30 | 2014-07-08 | Kabushiki Kaisha Yaskawa Denki | Power converting apparatus |
| DE102014105114A1 (en) * | 2014-04-10 | 2015-10-15 | Semikron Elektronik Gmbh & Co. Kg | Converter arrangement with capacitor device |
| US9980414B2 (en) | 2014-04-10 | 2018-05-22 | Semikron Elektronik Gmbh & Co., Kg | Converter arrangement with a capacitor arrangement |
| DE102014105114B4 (en) | 2014-04-10 | 2022-12-29 | Semikron Elektronik Gmbh & Co. Kg | Converter arrangement with capacitor device |
| JP2016184657A (en) * | 2015-03-26 | 2016-10-20 | 三菱電機株式会社 | Heat dissipation structure of electronic apparatus casing |
| JP2017041494A (en) * | 2015-08-18 | 2017-02-23 | 富士電機株式会社 | Electronic/electric device |
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