JP4165917B2 - Planer board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a planer board configured to cool a semiconductor element that controls a motor that rotates a cutting blade.
[0002]
[Prior art]
In the conventional apparatus, as described in, for example, Japanese Utility Model Publication No. 62-32787, a semiconductor element is attached to a field core of a motor, and the field core is shared as a heat radiating member of the semiconductor element. In addition, a radiator dedicated to the semiconductor element is provided, and the radiator is arranged on the motor cooling air inlet side or in the air passage.
[0003]
[Problems to be solved by the invention]
In the former case, not only the motor field core itself is a heat generating member and the cooling effect is low, but also the heat generation of the motor field core and the semiconductor element is proportional to the current flowing to the motor, so a large amount of current flowed to the semiconductor element. In some cases, a large amount of heat radiation is required, but since the motor also becomes high temperature at the same time, the cooling effect of the semiconductor element is further reduced.
[0004]
In the case where the latter heat sink for the semiconductor element is provided exclusively, as the power consumption of the semiconductor element increases, an expensive heat dissipating member is required, so that the production cost of the entire apparatus has increased significantly. . In addition, if the cooling air is used as chip discharge air, a special heat sink with many pleats on the air path and very high air friction resistance is used. The dust that entered the time caused damage to the radiator and the semiconductor elements attached to it.
[0005]
An object of the present invention is to solve the above-described problems of the prior art and efficiently cool a semiconductor element with an inexpensive configuration.
[0006]
[Means for Solving the Problems]
The above object is achieved in a cutting blade that is rotationally driven by a motor controlled by a semiconductor element and a cutting board that uses the cooling air of the motor as discharge air for cutting waste, from the cooling air intake port of the motor to the discharge port for cutting waste. This is achieved by using a heat conductive member for all or a part of the members forming the air passage between them, and fixing the heat generating portion of the semiconductor element to the opposite side of the air flow side of the heat conductive member. The
[0007]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of a planer board according to the present invention will be described with reference to FIGS. 1 is a perspective view of a planer board, FIG. 2 is a rear view of FIG. 1, and FIG. 3 is a cross-sectional view taken along line AA of FIG.
[0008]
In the figure, a head 3 supported by four columns 2 is provided on a base 1. A table 13 that moves up and down with the column 2 as a guide is provided between the base 1 and the head 3, and this table 13 is screwed on the expansion portion 1 a of the base 1 via the rotation direction switching means 15 by turning the handle 20. It moves up and down by the screwing relation of the feed screw 16 having the screwing part 16a screwed with the strip hole.
[0009]
The head 3 is provided with a motor 4, and the motor 4 is provided with a fan 8 that generates cooling air 5 of the motor 4 and exhaust air 7 of chips 6. The cooling air 5 enters from a suction port B of a motor housing 9 that forms a wind path using a heat conducting member as a material. The cooling air 5 is guided to the motor 4 by the motor housing 9, and the exhaust air 7 that cools the motor 4. Is guided by a planer housing 10 which forms an air passage using a heat conducting member as a material, and is discharged together with the chips 6 from the discharge port C. Note that the motor housing 9 and the planer housing 10 that use materials as the heat conducting members mainly use aluminum, sheet metal, or the like.
[0010]
A planing cylinder 12 having a cutting blade 11 that is rotationally driven by a motor 4 via a belt 14 inside the planing cylinder housing 10 is provided on the lower side of the planing cylinder housing 10 so as to expose the cutting knife 11.
[0011]
A heat generating portion 17a of a bidirectional thyristor 17 serving as a semiconductor element is fixed in close contact with the opposite side of the air passage of the motor housing 9. In the present embodiment, the heat generating portion 17a of the bidirectional thyristor 17 is attached to the motor housing 9, but it may be tightly fixed to the planer housing 10 that forms the air passage. The bidirectional thyristor 17 is controlled by the control circuit 18 and controls the rotation speed of the motor 4.
[0012]
In the above configuration, the handle 20 is turned so that the distance between the table 13 and the head 3 is the same as the height of the workpiece 19. Next, the control circuit 18 turns on the bidirectional thyristor 17 to rotate the motor 4. Next, the workpiece 19 is inserted from the planer cylinder 12 side. The fan 8 rotates simultaneously with the rotation of the motor 4, cooling air 5 enters from the suction port B of the motor housing 9, and is discharged from the discharge port C using the motor housing 9 and the planer housing 10 as a guide. Since the cooling air 5 of the motor 4 flows inside the motor housing 9, the motor housing 9 is cooled, and the heat generating portion 17 a of the bidirectional thyristor 17 provided in the motor housing 9 is also cooled at the same time. Further, even if the heat generating portion 17a of the bidirectional thyristor 17 is closely fixed to the planer housing 10, the bidirectional thyristor 17 is provided on the opposite side of the air passage, so that the flow of the discharge air 7 of the chips 6 is obstructed. The bidirectional thyristor 17 can be cooled.
[0013]
【The invention's effect】
According to the present invention, in a planer board that uses the cooling air of the motor controlled by the semiconductor element as the chip discharge air, a part or all of the members forming the air path are used as the heat conductive members. Since the semiconductor element is installed on the opposite side of the air path of the conductive member, the air volume of the cooling air of the motor and the exhaust air of the chips is not reduced, and heat radiation conventionally provided separately from the semiconductor element And the semiconductor element attached to the radiator can be prevented from being damaged by dust. In addition, since a dedicated heatsink for the semiconductor element is not required, the cost of the entire device can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a cutting board showing an embodiment of the present invention.
2 is a rear view of FIG. 1. FIG.
FIG. 3 is a cross-sectional view taken along line AA in FIG.
[Explanation of symbols]
3 is a head, 4 is a motor, 8 is a fan, 9 is a motor housing, 10 is a planer housing, and 17 is a bidirectional thyristor.

Claims (1)

A cutting blade that is rotationally driven by a motor controlled by a semiconductor element, and an air passage between the cooling air suction port of the motor and the cutting dust discharge port in a cutting board that uses the cooling air of the motor as discharge air of cutting waste. A planer board , wherein a heat conductive member is used for all or a part of the members forming the heat conductive member, and the heat generating portion of the semiconductor element is closely fixed to the side opposite to the air passage side of the heat conductive member.

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