SG96278A1 - Adhesive tape for laser dicing - Google Patents
Adhesive tape for laser dicingInfo
- Publication number
- SG96278A1 SG96278A1 SG200202361A SG200202361A SG96278A1 SG 96278 A1 SG96278 A1 SG 96278A1 SG 200202361 A SG200202361 A SG 200202361A SG 200202361 A SG200202361 A SG 200202361A SG 96278 A1 SG96278 A1 SG 96278A1
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive tape
- laser dicing
- dicing
- laser
- tape
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001124919 | 2001-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG96278A1 true SG96278A1 (en) | 2003-05-23 |
Family
ID=18974222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200202361A SG96278A1 (en) | 2001-04-23 | 2002-04-22 | Adhesive tape for laser dicing |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR100644459B1 (en) |
| CN (1) | CN1248293C (en) |
| MY (1) | MY136669A (en) |
| SG (1) | SG96278A1 (en) |
| TW (1) | TW524726B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151992B (en) * | 2005-06-27 | 2012-11-21 | 三菱电机株式会社 | Laser machining method and laser machining head |
| JP2011018806A (en) * | 2009-07-09 | 2011-01-27 | Sumitomo Bakelite Co Ltd | Film for semiconductor, and method of manufacturing semiconductor device |
| JP2011018804A (en) * | 2009-07-09 | 2011-01-27 | Sumitomo Bakelite Co Ltd | Film for semiconductor, and method of manufacturing semiconductor device |
| JP6160747B2 (en) * | 2015-07-03 | 2017-07-12 | 大日本印刷株式会社 | Vapor deposition mask manufacturing method, vapor deposition mask preparation, organic semiconductor element manufacturing method, and vapor deposition mask |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5637395A (en) * | 1984-03-12 | 1997-06-10 | Nitto Electric Industrial Co., Ltd. | Thin adhesive sheet for working semiconductor wafers |
| JP2000031115A (en) * | 1998-06-29 | 2000-01-28 | Lucent Technol Inc | Method for forming chip from wafer |
-
2002
- 2002-04-19 TW TW091108039A patent/TW524726B/en not_active IP Right Cessation
- 2002-04-22 KR KR1020020021908A patent/KR100644459B1/en active IP Right Grant
- 2002-04-22 MY MYPI20021475A patent/MY136669A/en unknown
- 2002-04-22 SG SG200202361A patent/SG96278A1/en unknown
- 2002-04-23 CN CNB021246726A patent/CN1248293C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5637395A (en) * | 1984-03-12 | 1997-06-10 | Nitto Electric Industrial Co., Ltd. | Thin adhesive sheet for working semiconductor wafers |
| JP2000031115A (en) * | 1998-06-29 | 2000-01-28 | Lucent Technol Inc | Method for forming chip from wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1385881A (en) | 2002-12-18 |
| CN1248293C (en) | 2006-03-29 |
| KR100644459B1 (en) | 2006-11-10 |
| MY136669A (en) | 2008-11-28 |
| TW524726B (en) | 2003-03-21 |
| KR20020082762A (en) | 2002-10-31 |
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