MY136669A - Adhesive tape for laser dicing - Google Patents

Adhesive tape for laser dicing

Info

Publication number
MY136669A
MY136669A MYPI20021475A MYPI20021475A MY136669A MY 136669 A MY136669 A MY 136669A MY PI20021475 A MYPI20021475 A MY PI20021475A MY PI20021475 A MYPI20021475 A MY PI20021475A MY 136669 A MY136669 A MY 136669A
Authority
MY
Malaysia
Prior art keywords
adhesive tape
laser dicing
laser
jet
water
Prior art date
Application number
MYPI20021475A
Inventor
Maruyama Hiromitsu
Yano Shozo
Morita Toru
Tamagawa Yuri
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY136669A publication Critical patent/MY136669A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)

Abstract

AN ADHESIVE TAPE FOR LASER DICING, IN WHICH A LASER IS GUIDE BY A WATER JET, WHEREIN A SUBSTRATE OF THE TAPE ALLOWS PERMEATION OF JET WATER STREAM OF THE WATER JET.
MYPI20021475A 2001-04-23 2002-04-22 Adhesive tape for laser dicing MY136669A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001124919 2001-04-23

Publications (1)

Publication Number Publication Date
MY136669A true MY136669A (en) 2008-11-28

Family

ID=18974222

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20021475A MY136669A (en) 2001-04-23 2002-04-22 Adhesive tape for laser dicing

Country Status (5)

Country Link
KR (1) KR100644459B1 (en)
CN (1) CN1248293C (en)
MY (1) MY136669A (en)
SG (1) SG96278A1 (en)
TW (1) TW524726B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101428370B (en) * 2005-06-27 2013-05-29 三菱电机株式会社 Laser beam machining method
JP2011018806A (en) * 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd Film for semiconductor, and method of manufacturing semiconductor device
JP2011018804A (en) * 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd Film for semiconductor, and method of manufacturing semiconductor device
JP6160747B2 (en) * 2015-07-03 2017-07-12 大日本印刷株式会社 Vapor deposition mask manufacturing method, vapor deposition mask preparation, organic semiconductor element manufacturing method, and vapor deposition mask

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5714029A (en) * 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
JP2000031115A (en) * 1998-06-29 2000-01-28 Lucent Technol Inc Method for forming chip from wafer

Also Published As

Publication number Publication date
SG96278A1 (en) 2003-05-23
CN1248293C (en) 2006-03-29
CN1385881A (en) 2002-12-18
KR20020082762A (en) 2002-10-31
KR100644459B1 (en) 2006-11-10
TW524726B (en) 2003-03-21

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