SG79972A1 - Methods of electroplating solder bumps of uniform height on integrated circuit substrates - Google Patents
Methods of electroplating solder bumps of uniform height on integrated circuit substratesInfo
- Publication number
- SG79972A1 SG79972A1 SG9801027A SG1998001027A SG79972A1 SG 79972 A1 SG79972 A1 SG 79972A1 SG 9801027 A SG9801027 A SG 9801027A SG 1998001027 A SG1998001027 A SG 1998001027A SG 79972 A1 SG79972 A1 SG 79972A1
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- integrated circuit
- solder bumps
- uniform height
- circuit substrates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG9801027A SG79972A1 (en) | 1998-05-08 | 1998-05-08 | Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG9801027A SG79972A1 (en) | 1998-05-08 | 1998-05-08 | Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG79972A1 true SG79972A1 (en) | 2001-04-17 |
Family
ID=20429996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG9801027A SG79972A1 (en) | 1998-05-08 | 1998-05-08 | Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
Country Status (1)
| Country | Link |
|---|---|
| SG (1) | SG79972A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3625837A (en) * | 1969-09-18 | 1971-12-07 | Singer Co | Electroplating solder-bump connectors on microcircuits |
| JPS56118210A (en) * | 1980-02-20 | 1981-09-17 | Hitachi Ltd | Conductor |
-
1998
- 1998-05-08 SG SG9801027A patent/SG79972A1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3625837A (en) * | 1969-09-18 | 1971-12-07 | Singer Co | Electroplating solder-bump connectors on microcircuits |
| JPS56118210A (en) * | 1980-02-20 | 1981-09-17 | Hitachi Ltd | Conductor |
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