JPS56118210A - Conductor - Google Patents
ConductorInfo
- Publication number
- JPS56118210A JPS56118210A JP1920880A JP1920880A JPS56118210A JP S56118210 A JPS56118210 A JP S56118210A JP 1920880 A JP1920880 A JP 1920880A JP 1920880 A JP1920880 A JP 1920880A JP S56118210 A JPS56118210 A JP S56118210A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1920880A JPS56118210A (en) | 1980-02-20 | 1980-02-20 | Conductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1920880A JPS56118210A (en) | 1980-02-20 | 1980-02-20 | Conductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56118210A true JPS56118210A (en) | 1981-09-17 |
Family
ID=11992942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1920880A Pending JPS56118210A (en) | 1980-02-20 | 1980-02-20 | Conductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56118210A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG79972A1 (en) * | 1998-05-08 | 2001-04-17 | Mcnc | Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
-
1980
- 1980-02-20 JP JP1920880A patent/JPS56118210A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG79972A1 (en) * | 1998-05-08 | 2001-04-17 | Mcnc | Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
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