SG78386A1 - Apparatus for mounting solder balls on a wafer - Google Patents

Apparatus for mounting solder balls on a wafer

Info

Publication number
SG78386A1
SG78386A1 SG1999004184A SG1999004184A SG78386A1 SG 78386 A1 SG78386 A1 SG 78386A1 SG 1999004184 A SG1999004184 A SG 1999004184A SG 1999004184 A SG1999004184 A SG 1999004184A SG 78386 A1 SG78386 A1 SG 78386A1
Authority
SG
Singapore
Prior art keywords
wafer
solder balls
mounting solder
mounting
balls
Prior art date
Application number
SG1999004184A
Inventor
Shigeharu Kobayashi
Original Assignee
Shibuya Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co Ltd filed Critical Shibuya Kogyo Co Ltd
Publication of SG78386A1 publication Critical patent/SG78386A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
SG1999004184A 1998-09-01 1999-08-25 Apparatus for mounting solder balls on a wafer SG78386A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10262453A JP2000077451A (en) 1998-09-01 1998-09-01 Device for mounting solder ball on wafer

Publications (1)

Publication Number Publication Date
SG78386A1 true SG78386A1 (en) 2001-02-20

Family

ID=17376005

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1999004184A SG78386A1 (en) 1998-09-01 1999-08-25 Apparatus for mounting solder balls on a wafer

Country Status (3)

Country Link
JP (1) JP2000077451A (en)
KR (1) KR100554765B1 (en)
SG (1) SG78386A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108723990B (en) * 2017-12-06 2018-12-28 湖南永创机电设备有限公司 A kind of method of the flexible linkage mechanism of automatic loading and unloading device, automatic loading and unloading device and loading and unloading glass

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3152078B2 (en) * 1994-08-30 2001-04-03 松下電器産業株式会社 Solder ball transfer device and transfer method
JP3214316B2 (en) * 1995-09-29 2001-10-02 松下電器産業株式会社 Apparatus and method for mounting conductive ball and method for forming bump
JP3397051B2 (en) * 1996-08-20 2003-04-14 松下電器産業株式会社 Apparatus and method for mounting conductive ball
KR100270888B1 (en) * 1998-04-08 2000-12-01 윤종용 Apparatus for manufacturing known good die
US6284568B1 (en) * 1998-07-31 2001-09-04 Kabushiki Kaisha Toshiba Method and system for producing semiconductor device
SG83210A1 (en) * 1999-06-03 2001-09-18 Shibuya Kogyo Co Ltd Ball suction head

Also Published As

Publication number Publication date
JP2000077451A (en) 2000-03-14
KR20000022783A (en) 2000-04-25
KR100554765B1 (en) 2006-02-22

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