SG78386A1 - Apparatus for mounting solder balls on a wafer - Google Patents
Apparatus for mounting solder balls on a waferInfo
- Publication number
- SG78386A1 SG78386A1 SG1999004184A SG1999004184A SG78386A1 SG 78386 A1 SG78386 A1 SG 78386A1 SG 1999004184 A SG1999004184 A SG 1999004184A SG 1999004184 A SG1999004184 A SG 1999004184A SG 78386 A1 SG78386 A1 SG 78386A1
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- solder balls
- mounting solder
- mounting
- balls
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10262453A JP2000077451A (en) | 1998-09-01 | 1998-09-01 | Device for mounting solder ball on wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG78386A1 true SG78386A1 (en) | 2001-02-20 |
Family
ID=17376005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1999004184A SG78386A1 (en) | 1998-09-01 | 1999-08-25 | Apparatus for mounting solder balls on a wafer |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2000077451A (en) |
KR (1) | KR100554765B1 (en) |
SG (1) | SG78386A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108723990B (en) * | 2017-12-06 | 2018-12-28 | 湖南永创机电设备有限公司 | A kind of method of the flexible linkage mechanism of automatic loading and unloading device, automatic loading and unloading device and loading and unloading glass |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3152078B2 (en) * | 1994-08-30 | 2001-04-03 | 松下電器産業株式会社 | Solder ball transfer device and transfer method |
JP3214316B2 (en) * | 1995-09-29 | 2001-10-02 | 松下電器産業株式会社 | Apparatus and method for mounting conductive ball and method for forming bump |
JP3397051B2 (en) * | 1996-08-20 | 2003-04-14 | 松下電器産業株式会社 | Apparatus and method for mounting conductive ball |
KR100270888B1 (en) * | 1998-04-08 | 2000-12-01 | 윤종용 | Apparatus for manufacturing known good die |
US6284568B1 (en) * | 1998-07-31 | 2001-09-04 | Kabushiki Kaisha Toshiba | Method and system for producing semiconductor device |
SG83210A1 (en) * | 1999-06-03 | 2001-09-18 | Shibuya Kogyo Co Ltd | Ball suction head |
-
1998
- 1998-09-01 JP JP10262453A patent/JP2000077451A/en active Pending
-
1999
- 1999-08-25 SG SG1999004184A patent/SG78386A1/en unknown
- 1999-08-30 KR KR1019990036195A patent/KR100554765B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100554765B1 (en) | 2006-02-22 |
JP2000077451A (en) | 2000-03-14 |
KR20000022783A (en) | 2000-04-25 |
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