SG70892G - Semiconductor die-attach technique and composition therefor - Google Patents

Semiconductor die-attach technique and composition therefor

Info

Publication number
SG70892G
SG70892G SG708/92A SG70892A SG70892G SG 70892 G SG70892 G SG 70892G SG 708/92 A SG708/92 A SG 708/92A SG 70892 A SG70892 A SG 70892A SG 70892 G SG70892 G SG 70892G
Authority
SG
Singapore
Prior art keywords
semiconductor die
composition therefor
attach technique
attach
technique
Prior art date
Application number
SG708/92A
Other languages
English (en)
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG70892G publication Critical patent/SG70892G/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
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    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Powder Metallurgy (AREA)
SG708/92A 1982-11-24 1992-07-07 Semiconductor die-attach technique and composition therefor SG70892G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/444,267 US4487638A (en) 1982-11-24 1982-11-24 Semiconductor die-attach technique and composition therefor

Publications (1)

Publication Number Publication Date
SG70892G true SG70892G (en) 1992-09-04

Family

ID=23764181

Family Applications (1)

Application Number Title Priority Date Filing Date
SG708/92A SG70892G (en) 1982-11-24 1992-07-07 Semiconductor die-attach technique and composition therefor

Country Status (8)

Country Link
US (1) US4487638A (fr)
EP (1) EP0110307B1 (fr)
JP (1) JPS60500046A (fr)
CA (2) CA1200625A (fr)
DE (1) DE3380430D1 (fr)
HK (1) HK81492A (fr)
SG (1) SG70892G (fr)
WO (1) WO1984002097A1 (fr)

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US4563224A (en) * 1981-10-05 1986-01-07 Raychem Corporation Soldering flux containing a temperature sensitive chemically reactive colorant
US4809901A (en) * 1981-10-05 1989-03-07 Raychem Corporation Soldering methods and devices
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
EP0142783B1 (fr) * 1983-11-11 1990-04-18 Kabushiki Kaisha Toshiba Procédé pour la fabrication d'un circuit intégré hybride
US4929516A (en) * 1985-03-14 1990-05-29 Olin Corporation Semiconductor die attach system
US4645545A (en) * 1985-04-09 1987-02-24 Louis Middlestadt Shape retaining bodies of solder containing flux and their method of manufacture and use
EP0205686A1 (fr) * 1985-06-13 1986-12-30 Kidd, Inc. Pâte électroconductrice pour le montage d'un dé semi-conducteur
US4694572A (en) * 1986-06-13 1987-09-22 Tektronix, Inc. Printed polymer circuit board method
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
US4872047A (en) * 1986-11-07 1989-10-03 Olin Corporation Semiconductor die attach system
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JPS60500046A (ja) 1985-01-17
US4487638A (en) 1984-12-11
HK81492A (en) 1992-10-30
WO1984002097A1 (fr) 1984-06-07
CA1218764A (fr) 1987-03-03
DE3380430D1 (en) 1989-09-21
EP0110307B1 (fr) 1989-08-16
EP0110307A2 (fr) 1984-06-13
EP0110307A3 (en) 1985-12-04
CA1200625A (fr) 1986-02-11

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