SG65050A1 - Apparatus and method for surface inspection - Google Patents

Apparatus and method for surface inspection

Info

Publication number
SG65050A1
SG65050A1 SG1998000265A SG1998000265A SG65050A1 SG 65050 A1 SG65050 A1 SG 65050A1 SG 1998000265 A SG1998000265 A SG 1998000265A SG 1998000265 A SG1998000265 A SG 1998000265A SG 65050 A1 SG65050 A1 SG 65050A1
Authority
SG
Singapore
Prior art keywords
surface inspection
inspection
Prior art date
Application number
SG1998000265A
Other languages
English (en)
Inventor
Masahiro Nakajo
Ken Tatsuta
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG65050A1 publication Critical patent/SG65050A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG1998000265A 1997-02-18 1998-02-06 Apparatus and method for surface inspection SG65050A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03350697A JP3264634B2 (ja) 1997-02-18 1997-02-18 表面検査装置及び方法

Publications (1)

Publication Number Publication Date
SG65050A1 true SG65050A1 (en) 1999-05-25

Family

ID=12388440

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000265A SG65050A1 (en) 1997-02-18 1998-02-06 Apparatus and method for surface inspection

Country Status (7)

Country Link
US (1) US5920387A (ja)
EP (1) EP0865072B1 (ja)
JP (1) JP3264634B2 (ja)
CN (1) CN1065955C (ja)
DE (1) DE69832225T2 (ja)
MY (1) MY118374A (ja)
SG (1) SG65050A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0930498A3 (en) * 1997-12-26 1999-11-17 Nidek Co., Ltd. Inspection apparatus and method for detecting defects
AU2001295198A1 (en) * 2000-04-28 2001-11-12 Electro Scientific Industries, Inc. Directional lighting and method to distinguish three dimensional information
DE10146583A1 (de) * 2001-09-21 2003-04-17 Siemens Ag Vorrichtung und Verfahren zum optischen Abtasten einer Substratscheibe
JP2003097924A (ja) * 2001-09-21 2003-04-03 Matsushita Electric Ind Co Ltd 形状測定装置および測定方法
JP2005030891A (ja) * 2003-07-11 2005-02-03 Toshiba Corp 表面非破壊検査装置および表面非破壊検査方法
CN100395587C (zh) * 2005-05-23 2008-06-18 友达光电股份有限公司 液晶显示器的检查装置
US7898651B2 (en) * 2005-10-24 2011-03-01 General Electric Company Methods and apparatus for inspecting an object
US7492450B2 (en) * 2005-10-24 2009-02-17 General Electric Company Methods and apparatus for inspecting an object
JP4697110B2 (ja) * 2006-09-27 2011-06-08 パナソニック株式会社 3次元撮像装置および撮像方法、部品実装装置
KR101123464B1 (ko) * 2007-05-24 2012-03-27 파나소닉 주식회사 부품 실장 방법, 부품 실장기, 실장 조건 결정 방법, 실장 조건 결정 장치 및 프로그램
KR101078781B1 (ko) 2010-02-01 2011-11-01 주식회사 고영테크놀러지 3차원 형상 검사방법
JP6524803B2 (ja) * 2015-06-02 2019-06-05 三星ダイヤモンド工業株式会社 ブレイクシステム
KR20180077898A (ko) * 2016-12-29 2018-07-09 엘지디스플레이 주식회사 검사장치 및 이를 이용한 검사방법
CN109341578B (zh) * 2018-10-22 2021-03-02 东旭光电科技股份有限公司 测量装置及曲面玻璃的测量方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333834A (ja) * 1986-07-28 1988-02-13 Canon Inc 表面状態検査装置
US4740708A (en) * 1987-01-06 1988-04-26 International Business Machines Corporation Semiconductor wafer surface inspection apparatus and method
JPH06258235A (ja) * 1993-03-04 1994-09-16 Canon Inc 面検査装置
JPH07159336A (ja) * 1993-12-07 1995-06-23 Canon Inc 表面状態検査装置及びそれを用いた露光装置

Also Published As

Publication number Publication date
EP0865072A1 (en) 1998-09-16
JPH10227621A (ja) 1998-08-25
MY118374A (en) 2004-10-30
CN1191967A (zh) 1998-09-02
CN1065955C (zh) 2001-05-16
US5920387A (en) 1999-07-06
DE69832225D1 (de) 2005-12-15
EP0865072B1 (en) 2005-11-09
JP3264634B2 (ja) 2002-03-11
DE69832225T2 (de) 2006-08-03

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