SG54575A1 - Lead bending machine for electronic components - Google Patents

Lead bending machine for electronic components

Info

Publication number
SG54575A1
SG54575A1 SG1997003641A SG1997003641A SG54575A1 SG 54575 A1 SG54575 A1 SG 54575A1 SG 1997003641 A SG1997003641 A SG 1997003641A SG 1997003641 A SG1997003641 A SG 1997003641A SG 54575 A1 SG54575 A1 SG 54575A1
Authority
SG
Singapore
Prior art keywords
electronic components
bending machine
lead bending
lead
machine
Prior art date
Application number
SG1997003641A
Other languages
English (en)
Inventor
Mitoshi Ishii
Original Assignee
Ishii Tool & Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishii Tool & Engineering Corp filed Critical Ishii Tool & Engineering Corp
Publication of SG54575A1 publication Critical patent/SG54575A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
SG1997003641A 1996-11-29 1997-10-02 Lead bending machine for electronic components SG54575A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8334503A JP3053582B2 (ja) 1996-11-29 1996-11-29 電子部品のリード曲げ装置

Publications (1)

Publication Number Publication Date
SG54575A1 true SG54575A1 (en) 1998-11-16

Family

ID=18278136

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003641A SG54575A1 (en) 1996-11-29 1997-10-02 Lead bending machine for electronic components

Country Status (7)

Country Link
US (1) US5860455A (de)
EP (1) EP0845932B1 (de)
JP (1) JP3053582B2 (de)
KR (1) KR100264235B1 (de)
DE (1) DE69718135T2 (de)
SG (1) SG54575A1 (de)
TW (1) TW362268B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214497A (ja) 2003-01-07 2004-07-29 Renesas Technology Corp 半導体素子のリード成形装置およびリード成形方法
JP2009176789A (ja) * 2008-01-22 2009-08-06 Hitachi Ltd ディスクリート部品リードフォーミング治具
CN102013401A (zh) * 2009-02-27 2011-04-13 伟仕高(肇庆)半导体有限公司 集成电路引脚无损伤弧线成型机构及方法
CN103302206B (zh) * 2013-06-20 2015-09-02 深圳市易飞扬通信技术有限公司 4针光接受组件弯管脚夹具
CN103579040A (zh) * 2013-10-30 2014-02-12 山东泰吉星电子科技有限公司 无损伤芯片成型封装工艺
JP7142454B2 (ja) * 2018-04-13 2022-09-27 Juki株式会社 実装装置、実装方法
CN113333628A (zh) * 2021-05-21 2021-09-03 田文勇 一种压敏电阻生产用引脚折角装置
CN113399592B (zh) * 2021-07-08 2022-07-22 上海航天电子通讯设备研究所 一种元器件引脚成形装置及其使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0795576B2 (ja) * 1990-02-22 1995-10-11 株式会社石井工作研究所 電子部品のリードの曲げ加工方法及びその曲げ型
US5210936A (en) * 1992-01-06 1993-05-18 Microelectronics And Computer Technology Corporation Method and apparatus for the excise and lead form of TAB devices
EP0609767A1 (de) * 1993-02-02 1994-08-10 Siemens-Albis Aktiengesellschaft Verfahren und Vorrichtung zum Biegen von Werkstücken
SG69071A1 (en) * 1993-04-14 2002-01-15 Advanced Systems Automation A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam

Also Published As

Publication number Publication date
KR19980041920A (ko) 1998-08-17
DE69718135T2 (de) 2003-10-23
EP0845932B1 (de) 2003-01-02
EP0845932A2 (de) 1998-06-03
JPH10163396A (ja) 1998-06-19
KR100264235B1 (ko) 2000-08-16
JP3053582B2 (ja) 2000-06-19
US5860455A (en) 1999-01-19
TW362268B (en) 1999-06-21
DE69718135D1 (de) 2003-02-06
EP0845932A3 (de) 2000-01-05

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