SG5288G - Stripping compositions and methods of stripping resists - Google Patents

Stripping compositions and methods of stripping resists

Info

Publication number
SG5288G
SG5288G SG52/88A SG5288A SG5288G SG 5288 G SG5288 G SG 5288G SG 52/88 A SG52/88 A SG 52/88A SG 5288 A SG5288 A SG 5288A SG 5288 G SG5288 G SG 5288G
Authority
SG
Singapore
Prior art keywords
stripping
compositions
methods
resists
stripping compositions
Prior art date
Application number
SG52/88A
Other languages
English (en)
Original Assignee
Baker J T Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker J T Inc filed Critical Baker J T Inc
Publication of SG5288G publication Critical patent/SG5288G/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Epoxy Compounds (AREA)
  • ing And Chemical Polishing (AREA)
SG52/88A 1982-09-02 1988-01-16 Stripping compositions and methods of stripping resists SG5288G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/413,996 US4401747A (en) 1982-09-02 1982-09-02 Stripping compositions and methods of stripping resists

Publications (1)

Publication Number Publication Date
SG5288G true SG5288G (en) 1988-06-17

Family

ID=23639523

Family Applications (1)

Application Number Title Priority Date Filing Date
SG52/88A SG5288G (en) 1982-09-02 1988-01-16 Stripping compositions and methods of stripping resists

Country Status (12)

Country Link
US (1) US4401747A (de)
EP (1) EP0102629B1 (de)
JP (1) JPS5949539A (de)
AT (1) ATE25435T1 (de)
AU (1) AU562148B2 (de)
CA (1) CA1194765A (de)
DE (1) DE3369746D1 (de)
HK (1) HK51888A (de)
IE (1) IE54416B1 (de)
IL (1) IL69399A0 (de)
SG (1) SG5288G (de)
ZA (1) ZA835589B (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491530A (en) * 1983-05-20 1985-01-01 Allied Corporation Brown stain suppressing phenol free and chlorinated hydrocarbons free photoresist stripper
DE3581659D1 (de) * 1984-05-21 1991-03-14 Shipley Co Photolackentferner und verfahren zum entfernen von photolacken.
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
ZA87922B (en) * 1986-02-28 1987-09-30 Macdermid Inc Photoresist stripper composition
IE59971B1 (en) * 1986-11-10 1994-05-04 Baker J T Inc Stripping compositions and their use for stripping resists from substrates
JPS63159849A (ja) * 1986-12-24 1988-07-02 Asahi Chem Ind Co Ltd フオトレジスト剥離剤組成物
JPS63163457A (ja) * 1986-12-26 1988-07-06 Asahi Chem Ind Co Ltd フオトレジスト用剥離剤組成物
JPS63168651A (ja) * 1987-01-06 1988-07-12 Asahi Chem Ind Co Ltd フオトレジストの剥離剤組成物
WO1988008445A1 (en) * 1987-04-29 1988-11-03 Coroman Industries, Inc. Graffiti removal composition and method
US5049314A (en) * 1989-08-24 1991-09-17 Chute Chemical Company Paint stripping composition consisting essentially of NMP and ethyl-3-ethoxy propionate
US7205265B2 (en) 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US7135445B2 (en) * 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
KR100335011B1 (ko) 1999-08-19 2002-05-02 주식회사 동진쎄미켐 레지스트 제거용 조성물
US6413923B2 (en) 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
JP2001183850A (ja) 1999-12-27 2001-07-06 Sumitomo Chem Co Ltd 剥離剤組成物
US6475966B1 (en) 2000-02-25 2002-11-05 Shipley Company, L.L.C. Plasma etching residue removal
US6531436B1 (en) 2000-02-25 2003-03-11 Shipley Company, L.L.C. Polymer removal
US7456140B2 (en) * 2000-07-10 2008-11-25 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductor devices
EP1360077A4 (de) 2000-07-10 2009-06-24 Ekc Technology Inc Zusammensetzung zur reinigung von halbleitern von organischen und resten der plasma-ätzung
TW573217B (en) 2000-12-27 2004-01-21 Sumitomo Chemical Co Remover composition
GB0105718D0 (en) * 2001-03-08 2001-04-25 Shipley Co Llc Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
AU2003225178A1 (en) * 2002-04-24 2003-11-10 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
US20050089489A1 (en) * 2003-10-22 2005-04-28 Carter Melvin K. Composition for exfoliation agent effective in removing resist residues
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
CN1862391B (zh) * 2005-05-13 2013-07-10 安集微电子（上海）有限公司 除光阻层的组合物及其使用方法
JP4741315B2 (ja) * 2005-08-11 2011-08-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． ポリマー除去組成物
FR2912151B1 (fr) * 2007-02-05 2009-05-08 Arkema France Formulation de dimethylsulfoxyde en melange avec un additif permettant d'abaisser le point de cristallisation de ce dernier, et applications de ce melange
KR101570256B1 (ko) * 2008-02-29 2015-11-18 아반토르 퍼포먼스 머티리얼스, 인크. 마이크로전자 기재 세정용 조성물
KR20220058069A (ko) 2020-10-30 2022-05-09 주식회사 이엔에프테크놀로지 세정제 조성물 및 이를 이용한 세정방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2891849A (en) * 1956-11-30 1959-06-23 Eastman Kodak Co Solvent composition
NL6800538A (de) * 1968-01-12 1969-07-15
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4055515A (en) * 1975-12-31 1977-10-25 Borden, Inc. Developer for printing plates
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
US4395479A (en) * 1981-09-23 1983-07-26 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists

Also Published As

Publication number Publication date
IL69399A0 (en) 1983-11-30
EP0102629B1 (de) 1987-02-04
IE831700L (en) 1984-03-02
AU1744083A (en) 1984-03-08
HK51888A (en) 1988-07-15
DE3369746D1 (en) 1987-03-12
JPH0143948B2 (de) 1989-09-25
EP0102629A1 (de) 1984-03-14
JPS5949539A (ja) 1984-03-22
US4401747A (en) 1983-08-30
ZA835589B (en) 1984-04-25
ATE25435T1 (de) 1987-02-15
IE54416B1 (en) 1989-09-27
CA1194765A (en) 1985-10-08
AU562148B2 (en) 1987-05-28

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