SG49189A1 - Process and apparatus for treating copper chloride etching waste liquor - Google Patents

Process and apparatus for treating copper chloride etching waste liquor

Info

Publication number
SG49189A1
SG49189A1 SG1996007405A SG1996007405A SG49189A1 SG 49189 A1 SG49189 A1 SG 49189A1 SG 1996007405 A SG1996007405 A SG 1996007405A SG 1996007405 A SG1996007405 A SG 1996007405A SG 49189 A1 SG49189 A1 SG 49189A1
Authority
SG
Singapore
Prior art keywords
copper chloride
waste liquor
etching waste
chloride etching
treating copper
Prior art date
Application number
SG1996007405A
Other languages
English (en)
Inventor
Tatsuya Uchida
Toshio Suemitsu
Original Assignee
Chemirite Ltd
Hitachi Chemical Co Ltd
Hitachi Chemical Techno Plant
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemirite Ltd, Hitachi Chemical Co Ltd, Hitachi Chemical Techno Plant filed Critical Chemirite Ltd
Publication of SG49189A1 publication Critical patent/SG49189A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00Compounds of copper
    • C01G3/02Oxides; Hydroxides
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00Halogens; Halogen acids
    • C01B7/01Chlorine; Hydrogen chloride
    • C01B7/03Preparation from chlorides
    • C01B7/035Preparation of hydrogen chloride from chlorides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacture And Refinement Of Metals (AREA)
SG1996007405A 1992-06-02 1993-03-23 Process and apparatus for treating copper chloride etching waste liquor SG49189A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14144992A JP3304397B2 (ja) 1992-06-02 1992-06-02 塩化銅エッチング廃液の再生利用方法及び装置

Publications (1)

Publication Number Publication Date
SG49189A1 true SG49189A1 (en) 1998-05-18

Family

ID=15292182

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996007405A SG49189A1 (en) 1992-06-02 1993-03-23 Process and apparatus for treating copper chloride etching waste liquor

Country Status (6)

Country Link
EP (1) EP0574113B1 (zh)
JP (1) JP3304397B2 (zh)
CN (1) CN1032584C (zh)
DE (1) DE69310811T2 (zh)
MY (1) MY124226A (zh)
SG (1) SG49189A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430146B1 (ko) * 2002-02-26 2004-05-03 한국생산기술연구원 폐수내 유가금속 회수처리용 사이클론 전해장치
CN100378014C (zh) * 2005-02-03 2008-04-02 黄伟君 污水处理及资源回收的系统和方法
CN100402442C (zh) * 2005-11-17 2008-07-16 常州市裕和金属材料有限公司 一种酸性蚀刻废液的高效环保处理方法
CN100395186C (zh) * 2006-07-31 2008-06-18 阮玉根 用线路板蚀刻废液生产氧氯化铜的方法
CN104591255A (zh) * 2013-10-31 2015-05-06 孙立 一种利用氯化铜蚀刻废液制备微米级氧化铜的方法
EP2927347A1 (en) * 2014-04-01 2015-10-07 Sigma Engineering Ab Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
KR101636936B1 (ko) * 2014-06-16 2016-07-08 (주)화백엔지니어링 염화동 폐액을 이용한 산화동 분말 제조장치

Also Published As

Publication number Publication date
CN1082511A (zh) 1994-02-23
DE69310811T2 (de) 1998-01-22
JP3304397B2 (ja) 2002-07-22
DE69310811D1 (de) 1997-06-26
MY124226A (en) 2006-06-30
EP0574113A1 (en) 1993-12-15
EP0574113B1 (en) 1997-05-21
CN1032584C (zh) 1996-08-21
JPH073475A (ja) 1995-01-06

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