SG44710A1 - A dielectric a manufacturing method thereof and semiconductor device - Google Patents
A dielectric a manufacturing method thereof and semiconductor deviceInfo
- Publication number
- SG44710A1 SG44710A1 SG1996006112A SG1996006112A SG44710A1 SG 44710 A1 SG44710 A1 SG 44710A1 SG 1996006112 A SG1996006112 A SG 1996006112A SG 1996006112 A SG1996006112 A SG 1996006112A SG 44710 A1 SG44710 A1 SG 44710A1
- Authority
- SG
- Singapore
- Prior art keywords
- dielectric
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H10P14/6336—
-
- H10P14/6682—
-
- H10P14/6686—
-
- H10W20/071—
-
- H10W20/48—
-
- H10W70/69—
-
- H10P14/69215—
-
- H10P14/6922—
-
- H10P14/6924—
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3968795 | 1995-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG44710A1 true SG44710A1 (en) | 1997-12-19 |
Family
ID=12559985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG1996006112A SG44710A1 (en) | 1995-02-28 | 1996-02-28 | A dielectric a manufacturing method thereof and semiconductor device |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0730298A3 (show.php) |
| KR (1) | KR960032507A (show.php) |
| CN (1) | CN1139819A (show.php) |
| SG (1) | SG44710A1 (show.php) |
| TW (1) | TW302525B (show.php) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3178375B2 (ja) * | 1997-06-03 | 2001-06-18 | 日本電気株式会社 | 絶縁膜の形成方法 |
| US5869149A (en) * | 1997-06-30 | 1999-02-09 | Lam Research Corporation | Method for preparing nitrogen surface treated fluorine doped silicon dioxide films |
| US6440550B1 (en) | 1999-10-18 | 2002-08-27 | Honeywell International Inc. | Deposition of fluorosilsesquioxane films |
| US6717181B2 (en) | 2001-02-22 | 2004-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Luminescent device having thin film transistor |
| US6780499B2 (en) * | 2001-05-03 | 2004-08-24 | International Business Machines Corporation | Ordered two-phase dielectric film, and semiconductor device containing the same |
| US7074489B2 (en) * | 2001-05-23 | 2006-07-11 | Air Products And Chemicals, Inc. | Low dielectric constant material and method of processing by CVD |
| US6716770B2 (en) * | 2001-05-23 | 2004-04-06 | Air Products And Chemicals, Inc. | Low dielectric constant material and method of processing by CVD |
| EP1271643A1 (en) | 2001-06-22 | 2003-01-02 | Infineon Technologies AG | A method of forming a bitline and a bitline contact and a dynamic memory cell |
| EP2494601A4 (en) | 2009-10-30 | 2016-09-07 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR |
| CN113892153B (zh) * | 2019-07-09 | 2024-10-11 | 株式会社村田制作所 | 薄膜电容器以及薄膜电容器用薄膜 |
| CN114394597A (zh) * | 2022-01-24 | 2022-04-26 | 贵州理工学院 | 一种利用四氟化硅为原料制备硅薄膜的方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2699695B2 (ja) * | 1991-06-07 | 1998-01-19 | 日本電気株式会社 | 化学気相成長法 |
| DE69311184T2 (de) * | 1992-03-27 | 1997-09-18 | Matsushita Electric Ind Co Ltd | Halbleitervorrichtung samt Herstellungsverfahren |
-
1996
- 1996-02-06 TW TW085101456A patent/TW302525B/zh not_active IP Right Cessation
- 1996-02-27 CN CN96102557A patent/CN1139819A/zh active Pending
- 1996-02-27 KR KR1019960004730A patent/KR960032507A/ko not_active Withdrawn
- 1996-02-28 EP EP96102974A patent/EP0730298A3/en not_active Withdrawn
- 1996-02-28 SG SG1996006112A patent/SG44710A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW302525B (show.php) | 1997-04-11 |
| EP0730298A2 (en) | 1996-09-04 |
| CN1139819A (zh) | 1997-01-08 |
| KR960032507A (ko) | 1996-09-17 |
| EP0730298A3 (en) | 1998-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG44315A1 (en) | Semiconductor device and method manufacturing thereof | |
| SG94757A1 (en) | Semiconductor device and manufacturing method thereof | |
| SG74035A1 (en) | Semiconductor device and manufacturing method thereof | |
| GB2314971B (en) | Semiconductor device having a soi structure and a manufacturing method thereof | |
| GB9713223D0 (en) | Method of fabricating a semiconductor device | |
| SG53021A1 (en) | Semiconductor device and manufacturing method | |
| GB9620718D0 (en) | A method of manufacturing semiconductor devices | |
| GB2314682B (en) | A semiconductor device and method of manufacture | |
| GB2285173B (en) | Semiconductor device and manufacturing method thereof | |
| GB2309825B (en) | Semiconductor device and a method of fabricating the same | |
| SG68542A1 (en) | Semiconductor device and manufacturing method thereof | |
| SG44710A1 (en) | A dielectric a manufacturing method thereof and semiconductor device | |
| GB9626363D0 (en) | A method of manufacturing a semiconductor device | |
| GB2306778B (en) | Semiconductor device and a method of manufacturing the same | |
| KR970009171B1 (en) | Semiconductor device and a method for manufacturing thereof | |
| GB2332984B (en) | Semiconductor device and method of fabricating a semiconductor device | |
| GB2314680B (en) | Semiconductor device and a fabrication method thereof | |
| GB2320805B (en) | Method of fabricating a semiconductor device | |
| AU7715296A (en) | Method in the manufacturing of a semiconductor device | |
| GB2310759B (en) | Method of manufacturing a semiconductor device | |
| GB2303564B (en) | Semiconductor device manufacturing apparatus and manufacturing method | |
| GB2300517B (en) | Method of manufacturing a semiconductor device | |
| GB2275366B (en) | Semiconductor device and a manufacturing method therefor | |
| GB2313477B (en) | Method of manufacturing a semiconductor device | |
| GB2302986B (en) | Semiconductor device and fabricating method thereof |