SG2013069430A - Integrated circuit singulation method and system - Google Patents

Integrated circuit singulation method and system

Info

Publication number
SG2013069430A
SG2013069430A SG2013069430A SG2013069430A SG2013069430A SG 2013069430 A SG2013069430 A SG 2013069430A SG 2013069430 A SG2013069430 A SG 2013069430A SG 2013069430 A SG2013069430 A SG 2013069430A SG 2013069430 A SG2013069430 A SG 2013069430A
Authority
SG
Singapore
Prior art keywords
integrated circuit
singulation method
circuit singulation
integrated
singulation
Prior art date
Application number
SG2013069430A
Inventor
Chang Hwan Ha
Deok Chun Jang
Sang Young Choi
Chang Doun Kim
Seung Ho Baek
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Priority to SG2013069430A priority Critical patent/SG2013069430A/en
Priority to PCT/SG2014/000427 priority patent/WO2015038068A1/en
Priority to TW103131622A priority patent/TW201515938A/en
Publication of SG2013069430A publication Critical patent/SG2013069430A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
SG2013069430A 2013-09-12 2013-09-12 Integrated circuit singulation method and system SG2013069430A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG2013069430A SG2013069430A (en) 2013-09-12 2013-09-12 Integrated circuit singulation method and system
PCT/SG2014/000427 WO2015038068A1 (en) 2013-09-12 2014-09-11 Integrated circuit singulation method and system
TW103131622A TW201515938A (en) 2013-09-12 2014-09-12 Integrated circuit singulation method and system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG2013069430A SG2013069430A (en) 2013-09-12 2013-09-12 Integrated circuit singulation method and system

Publications (1)

Publication Number Publication Date
SG2013069430A true SG2013069430A (en) 2015-04-29

Family

ID=55167996

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013069430A SG2013069430A (en) 2013-09-12 2013-09-12 Integrated circuit singulation method and system

Country Status (3)

Country Link
SG (1) SG2013069430A (en)
TW (1) TW201515938A (en)
WO (1) WO2015038068A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6475085B2 (en) * 2015-05-25 2019-02-27 株式会社ディスコ Chip unloading method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176912A (en) * 1997-12-08 1999-07-02 Mitsubishi Electric Corp Semiconductor substrate processor and its control
US7024275B2 (en) * 2003-11-05 2006-04-04 Taiwan Semiconductor Manufacturing Company Control method and system for an automated material handling system
US20110156033A1 (en) * 2009-12-31 2011-06-30 Stmicroelectronics Asia Pacific Pte. Ltd. Method and system for tracing die at unit level

Also Published As

Publication number Publication date
TW201515938A (en) 2015-05-01
WO2015038068A1 (en) 2015-03-19

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