SG154362A1 - Positioning apparatus and method - Google Patents

Positioning apparatus and method

Info

Publication number
SG154362A1
SG154362A1 SG200800852-6A SG2008008526A SG154362A1 SG 154362 A1 SG154362 A1 SG 154362A1 SG 2008008526 A SG2008008526 A SG 2008008526A SG 154362 A1 SG154362 A1 SG 154362A1
Authority
SG
Singapore
Prior art keywords
semiconductor devices
plate
transferred
holding tray
transferring
Prior art date
Application number
SG200800852-6A
Inventor
Lim Kian Hock
Ng Lian Seng
Sun Haiyuan
Elmer Decena Almonte
Original Assignee
Advanced Systems Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Ltd filed Critical Advanced Systems Automation Ltd
Priority to SG200800852-6A priority Critical patent/SG154362A1/en
Priority to PCT/SG2008/000035 priority patent/WO2009096897A1/en
Publication of SG154362A1 publication Critical patent/SG154362A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Manufacturing of semiconductor devices is fully automated for cost savings to be achieved in terms of capital and material costs. Semiconductor devices separated from the lead-frames or substrates are typically washed and dried before being transferred to a plate. The semiconductor devices are then subsequently transferred from the plate to a holding tray. However, the large contact surface between the semiconductor devices and the plate results in the semiconductor devices adhering to the surface of the plate when transferring the semiconductor devices to the holding tray. Furthermore, misalignment also tends to occur when the devices are transferred from the plate to the holding tray due to gravitational displacement of the semiconductor devices occurring during the transfer. An embodiment of the invention describes an apparatus and a method for transferring semiconductor devices into component pockets of holding trays.
SG200800852-6A 2008-01-30 2008-01-30 Positioning apparatus and method SG154362A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200800852-6A SG154362A1 (en) 2008-01-30 2008-01-30 Positioning apparatus and method
PCT/SG2008/000035 WO2009096897A1 (en) 2008-01-30 2008-01-31 Positioning apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200800852-6A SG154362A1 (en) 2008-01-30 2008-01-30 Positioning apparatus and method

Publications (1)

Publication Number Publication Date
SG154362A1 true SG154362A1 (en) 2009-08-28

Family

ID=40913051

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200800852-6A SG154362A1 (en) 2008-01-30 2008-01-30 Positioning apparatus and method

Country Status (2)

Country Link
SG (1) SG154362A1 (en)
WO (1) WO2009096897A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3351395B2 (en) * 1999-07-19 2002-11-25 日本電気株式会社 Flip chip forming method using chip tray
US20030102016A1 (en) * 2001-12-04 2003-06-05 Gary Bouchard Integrated circuit processing system
JP2004055860A (en) * 2002-07-22 2004-02-19 Renesas Technology Corp Semiconductor device fabricating process
US7309089B2 (en) * 2004-02-04 2007-12-18 Delaware Capital Formation, Inc. Vacuum cup

Also Published As

Publication number Publication date
WO2009096897A1 (en) 2009-08-06

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