WO2011055960A3 - Apparatus and method for polishing and washing a semiconductor wafer - Google Patents

Apparatus and method for polishing and washing a semiconductor wafer Download PDF

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Publication number
WO2011055960A3
WO2011055960A3 PCT/KR2010/007675 KR2010007675W WO2011055960A3 WO 2011055960 A3 WO2011055960 A3 WO 2011055960A3 KR 2010007675 W KR2010007675 W KR 2010007675W WO 2011055960 A3 WO2011055960 A3 WO 2011055960A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
washing
semiconductor wafer
module
transfer station
Prior art date
Application number
PCT/KR2010/007675
Other languages
French (fr)
Korean (ko)
Other versions
WO2011055960A2 (en
Inventor
정인권
Original Assignee
Jeong In Kwon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeong In Kwon filed Critical Jeong In Kwon
Priority to KR1020127013772A priority Critical patent/KR101684228B1/en
Publication of WO2011055960A2 publication Critical patent/WO2011055960A2/en
Publication of WO2011055960A3 publication Critical patent/WO2011055960A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber

Abstract

The invention relates to a polishing apparatus including at least one polishing module. Each polishing module includes: at least one polishing surface; at least one polishing head; at least one wafer transfer station; and a transfer device for transferring the at least one polishing head between the at least one polishing surface and the at least one wafer transfer station. The polishing module may include sealing means for protecting the at least one polishing surface from external particles, and fluid-spraying devices. The washing apparatus may include two or more drying chambers for enabling high productivity.
PCT/KR2010/007675 2009-11-03 2010-11-02 Apparatus and method for polishing and washing a semiconductor wafer WO2011055960A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020127013772A KR101684228B1 (en) 2009-11-03 2010-11-02 Apparatus for polishing semiconductor wafer

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
US28044109P 2009-11-03 2009-11-03
US61/280,441 2009-11-03
US28332409P 2009-12-02 2009-12-02
US61/283,324 2009-12-02
US28347909P 2009-12-04 2009-12-04
US61/283,479 2009-12-04
US28369409P 2009-12-08 2009-12-08
US61/283,694 2009-12-08
US28416009P 2009-12-14 2009-12-14
US61/284,160 2009-12-14
US28444809P 2009-12-21 2009-12-21
US61/284,448 2009-12-21
US39909610P 2010-07-06 2010-07-06
US61/399,096 2010-07-06
US12/912,738 2010-10-26
US12/912,738 US20110104997A1 (en) 2009-11-03 2010-10-26 Apparatuses and methods for polishing and cleaning semiconductor wafers

Publications (2)

Publication Number Publication Date
WO2011055960A2 WO2011055960A2 (en) 2011-05-12
WO2011055960A3 true WO2011055960A3 (en) 2011-11-03

Family

ID=43925928

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/007675 WO2011055960A2 (en) 2009-11-03 2010-11-02 Apparatus and method for polishing and washing a semiconductor wafer

Country Status (4)

Country Link
US (1) US20110104997A1 (en)
KR (2) KR101684228B1 (en)
TW (1) TW201124233A (en)
WO (1) WO2011055960A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101581862B1 (en) * 2014-04-28 2015-12-31 이성수 Grinding Module and Device having the Same
KR102177123B1 (en) * 2014-08-28 2020-11-11 삼성전자주식회사 Chemical mechanical polishing apparatus
JP6093741B2 (en) * 2014-10-21 2017-03-08 信越半導体株式会社 Polishing apparatus and wafer polishing method
CN109037101A (en) * 2018-07-13 2018-12-18 清华大学 Wafer processing
US20220111486A1 (en) * 2020-10-08 2022-04-14 Kctech Co., Ltd. Substrate processing system
US20220111485A1 (en) * 2020-10-08 2022-04-14 Kctech Co., Ltd. Substrate processing system
KR20220122360A (en) * 2021-02-26 2022-09-02 주식회사 케이씨텍 Substrate polishing system
CN115338718B (en) * 2022-10-18 2023-03-24 杭州众硅电子科技有限公司 Wafer polishing system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030089508A (en) * 2002-05-17 2003-11-21 가부시키가이샤 토쿄 세이미쯔 Method and apparatus for chemical mechanical polishing
KR100759453B1 (en) * 2006-06-20 2007-09-20 세크론 주식회사 Method for wafer hardening
KR20070104870A (en) * 2002-08-02 2007-10-29 어플라이드 머티어리얼스, 인코포레이티드 Conductive polishing article for electrochemical mechanical polishing
KR20080002982A (en) * 2005-04-21 2008-01-04 가부시키가이샤 에바라 세이사꾸쇼 Wafer transfer apparatus, polishing apparatus and wafer receiving method
KR20080042867A (en) * 2005-09-09 2008-05-15 이노플라 아엔씨 Apparatus and method for polishing objects using object cleaners
KR100902177B1 (en) * 2008-02-19 2009-06-10 박용길 Carousel rotating type cmp apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
US5816891A (en) * 1995-06-06 1998-10-06 Advanced Micro Devices, Inc. Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
US7097544B1 (en) * 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US5947802A (en) * 1997-11-05 1999-09-07 Aplex, Inc. Wafer shuttle system
JP3048142B2 (en) * 1998-10-19 2000-06-05 株式会社東京精密 Wafer processing equipment
CN101990702B (en) * 2008-04-09 2013-06-19 应用材料公司 Polishing system having track

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030089508A (en) * 2002-05-17 2003-11-21 가부시키가이샤 토쿄 세이미쯔 Method and apparatus for chemical mechanical polishing
KR20070104870A (en) * 2002-08-02 2007-10-29 어플라이드 머티어리얼스, 인코포레이티드 Conductive polishing article for electrochemical mechanical polishing
KR20080002982A (en) * 2005-04-21 2008-01-04 가부시키가이샤 에바라 세이사꾸쇼 Wafer transfer apparatus, polishing apparatus and wafer receiving method
KR20080042867A (en) * 2005-09-09 2008-05-15 이노플라 아엔씨 Apparatus and method for polishing objects using object cleaners
KR100759453B1 (en) * 2006-06-20 2007-09-20 세크론 주식회사 Method for wafer hardening
KR100902177B1 (en) * 2008-02-19 2009-06-10 박용길 Carousel rotating type cmp apparatus

Also Published As

Publication number Publication date
WO2011055960A2 (en) 2011-05-12
KR20160135117A (en) 2016-11-24
KR101814360B1 (en) 2018-01-04
KR101684228B1 (en) 2016-12-12
KR20120099702A (en) 2012-09-11
US20110104997A1 (en) 2011-05-05
TW201124233A (en) 2011-07-16

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