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Application filed by Kuei-Min LiaofiledCriticalKuei-Min Liao
Priority to SG200705129-5ApriorityCriticalpatent/SG149706A1/en
Publication of SG149706A1publicationCriticalpatent/SG149706A1/en
METHOD FOR REMOVING MICROCIRCUITS FROM SILICON WAFER SURFACE A method for removing microcircuits from a faulty wafer including an upper metal layer, an intermediate thin film, and a lower silicon substrate is disclosed. The method includes classifying the faulty wafers into a plurality of different groups; sandblasting the grouped wafers to destroy microcircuits on the metal layer of each wafer with the thin film and the silicon substrate being undamaged; cutting edges of each wafer into a predetermined shape; submerging the wafers in an acid solution, submerging the wafers in sodium hydroxide, and cleaning the wafers in pure water for completely removing the microcircuits from the metal layer of each wafer; drying the wafers; and packing the wafers. The invention can reuse or recycle faulty wafers in a value increased manner.
SG200705129-5A2007-07-102007-07-10Method for removing microcircuits from silicon wafer surface
SG149706A1
(en)