SG130162A1 - Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives - Google Patents

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Info

Publication number
SG130162A1
SG130162A1 SG200605716-0A SG2006057160A SG130162A1 SG 130162 A1 SG130162 A1 SG 130162A1 SG 2006057160 A SG2006057160 A SG 2006057160A SG 130162 A1 SG130162 A1 SG 130162A1
Authority
SG
Singapore
Prior art keywords
die attach
quinolinols
adhesion promoters
quinolinol derivatives
attach adhesives
Prior art date
Application number
SG200605716-0A
Other languages
English (en)
Inventor
Osama M Musa
Harry Richard Kuder
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of SG130162A1 publication Critical patent/SG130162A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
SG200605716-0A 2005-08-25 2006-08-22 Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives SG130162A1 (en)

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US11/211,920 US20070049665A1 (en) 2005-08-25 2005-08-25 Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

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EP (1) EP1758164B1 (de)
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KR (1) KR101233224B1 (de)
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US8120153B1 (en) * 2005-09-16 2012-02-21 University Of Central Florida Research Foundation, Inc. High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module
US7468407B2 (en) * 2005-09-26 2008-12-23 National Starch And Chemical Investment Holding Copporation Metal salts of quinolinols and quinolinol derivatives in curable compositions
KR100918345B1 (ko) * 2007-11-23 2009-09-22 제일모직주식회사 이방 전도성 필름용　조성물　및 이를 이용한 이방 전도성필름
EP3294799A4 (de) * 2015-05-08 2018-11-21 Henkel IP & Holding GmbH Sinterbare folien und pasten und verfahren zur verwendung davon

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US2874080A (en) * 1953-07-18 1959-02-17 Deutsch Goldund Silber Scheide Self-hardening surface coating compositions
JPH05125118A (ja) * 1991-11-02 1993-05-21 Nippon Oil & Fats Co Ltd 紫外線吸収性ポリマー
JPH05247220A (ja) * 1992-02-28 1993-09-24 Nippon Steel Chem Co Ltd ８−ヒドロキシキノリン骨格を有する重合体及びその製造方法
US6482503B1 (en) * 1993-03-19 2002-11-19 Xerox Corporation Recording sheets containing pyrrole, pyrrolidine, pyridine, piperidine, homopiperidine, quinoline, isoquinoline, quinuclidine, indole, and indazole compounds
US5744533A (en) * 1997-06-04 1998-04-28 Johnson Matthey, Inc. Adhesive composition for bonding a semiconductor device
US6124374A (en) * 1998-05-29 2000-09-26 Block Drug Company, Inc. Antimicrobial denture adhesive and cleanser compositions
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
JP3816697B2 (ja) * 1999-07-07 2006-08-30 大日精化工業株式会社 重合体が結合した機能剤、その製造方法、それらの使用方法及びそれらを使用した物品
US6583201B2 (en) * 2001-04-25 2003-06-24 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
JP4295047B2 (ja) * 2003-06-02 2009-07-15 日本軽金属株式会社 発光性有機高分子金属錯体及び湿式製膜可能な発光性有機高分子金属錯体組成物並びにその製造方法
CN1246368C (zh) * 2004-06-18 2006-03-22 中国科学院广州化学研究所 含有8－羟基喹啉金属配合物的交联高聚物及其制法和用途

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CN1919953A (zh) 2007-02-28
JP2007056265A (ja) 2007-03-08
KR20070024403A (ko) 2007-03-02
TWI415886B (zh) 2013-11-21
ATE411614T1 (de) 2008-10-15
PT1758164E (pt) 2008-11-26
JP4823809B2 (ja) 2011-11-24
EP1758164A1 (de) 2007-02-28
KR101233224B1 (ko) 2013-02-14
US20070049665A1 (en) 2007-03-01
TW200722470A (en) 2007-06-16
EP1758164B1 (de) 2008-10-15

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