ATE411614T1 - Quinolinol-derivate als haftvermittler für klebstoffe zur befestigung von chips. - Google Patents
Quinolinol-derivate als haftvermittler für klebstoffe zur befestigung von chips.Info
- Publication number
- ATE411614T1 ATE411614T1 AT06017529T AT06017529T ATE411614T1 AT E411614 T1 ATE411614 T1 AT E411614T1 AT 06017529 T AT06017529 T AT 06017529T AT 06017529 T AT06017529 T AT 06017529T AT E411614 T1 ATE411614 T1 AT E411614T1
- Authority
- AT
- Austria
- Prior art keywords
- adhesives
- quinolinol derivatives
- adhesive promoters
- attaching chips
- quinolinol
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
- C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
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- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/211,920 US20070049665A1 (en) | 2005-08-25 | 2005-08-25 | Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE411614T1 true ATE411614T1 (de) | 2008-10-15 |
Family
ID=37478757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06017529T ATE411614T1 (de) | 2005-08-25 | 2006-08-23 | Quinolinol-derivate als haftvermittler für klebstoffe zur befestigung von chips. |
Country Status (10)
Country | Link |
---|---|
US (1) | US20070049665A1 (de) |
EP (1) | EP1758164B1 (de) |
JP (1) | JP4823809B2 (de) |
KR (1) | KR101233224B1 (de) |
CN (1) | CN1919953A (de) |
AT (1) | ATE411614T1 (de) |
DE (1) | DE602006003151D1 (de) |
PT (1) | PT1758164E (de) |
SG (1) | SG130162A1 (de) |
TW (1) | TWI415886B (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8120153B1 (en) * | 2005-09-16 | 2012-02-21 | University Of Central Florida Research Foundation, Inc. | High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module |
US7468407B2 (en) * | 2005-09-26 | 2008-12-23 | National Starch And Chemical Investment Holding Copporation | Metal salts of quinolinols and quinolinol derivatives in curable compositions |
KR100918345B1 (ko) * | 2007-11-23 | 2009-09-22 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
CN107709418B (zh) * | 2015-05-08 | 2021-04-27 | 汉高知识产权控股有限责任公司 | 可烧结的膜和膏及其使用方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2874080A (en) * | 1953-07-18 | 1959-02-17 | Deutsch Goldund Silber Scheide | Self-hardening surface coating compositions |
JPH05125118A (ja) * | 1991-11-02 | 1993-05-21 | Nippon Oil & Fats Co Ltd | 紫外線吸収性ポリマー |
JPH05247220A (ja) * | 1992-02-28 | 1993-09-24 | Nippon Steel Chem Co Ltd | 8−ヒドロキシキノリン骨格を有する重合体及びその製造方法 |
US6482503B1 (en) * | 1993-03-19 | 2002-11-19 | Xerox Corporation | Recording sheets containing pyrrole, pyrrolidine, pyridine, piperidine, homopiperidine, quinoline, isoquinoline, quinuclidine, indole, and indazole compounds |
US5744533A (en) * | 1997-06-04 | 1998-04-28 | Johnson Matthey, Inc. | Adhesive composition for bonding a semiconductor device |
US6124374A (en) * | 1998-05-29 | 2000-09-26 | Block Drug Company, Inc. | Antimicrobial denture adhesive and cleanser compositions |
US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
JP3816697B2 (ja) * | 1999-07-07 | 2006-08-30 | 大日精化工業株式会社 | 重合体が結合した機能剤、その製造方法、それらの使用方法及びそれらを使用した物品 |
US6583201B2 (en) * | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
US7108806B2 (en) * | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
JP4295047B2 (ja) * | 2003-06-02 | 2009-07-15 | 日本軽金属株式会社 | 発光性有機高分子金属錯体及び湿式製膜可能な発光性有機高分子金属錯体組成物並びにその製造方法 |
CN1246368C (zh) * | 2004-06-18 | 2006-03-22 | 中国科学院广州化学研究所 | 含有8-羟基喹啉金属配合物的交联高聚物及其制法和用途 |
-
2005
- 2005-08-25 US US11/211,920 patent/US20070049665A1/en not_active Abandoned
-
2006
- 2006-08-22 SG SG200605716-0A patent/SG130162A1/en unknown
- 2006-08-22 CN CNA2006101265039A patent/CN1919953A/zh active Pending
- 2006-08-23 JP JP2006226254A patent/JP4823809B2/ja not_active Expired - Fee Related
- 2006-08-23 AT AT06017529T patent/ATE411614T1/de not_active IP Right Cessation
- 2006-08-23 DE DE602006003151T patent/DE602006003151D1/de active Active
- 2006-08-23 EP EP06017529A patent/EP1758164B1/de not_active Not-in-force
- 2006-08-23 PT PT06017529T patent/PT1758164E/pt unknown
- 2006-08-24 TW TW095131062A patent/TWI415886B/zh not_active IP Right Cessation
- 2006-08-24 KR KR1020060080520A patent/KR101233224B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1758164B1 (de) | 2008-10-15 |
KR20070024403A (ko) | 2007-03-02 |
SG130162A1 (en) | 2007-03-20 |
US20070049665A1 (en) | 2007-03-01 |
TW200722470A (en) | 2007-06-16 |
PT1758164E (pt) | 2008-11-26 |
DE602006003151D1 (de) | 2008-11-27 |
KR101233224B1 (ko) | 2013-02-14 |
JP2007056265A (ja) | 2007-03-08 |
CN1919953A (zh) | 2007-02-28 |
JP4823809B2 (ja) | 2011-11-24 |
EP1758164A1 (de) | 2007-02-28 |
TWI415886B (zh) | 2013-11-21 |
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