SG121982A1 - Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections - Google Patents

Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections

Info

Publication number
SG121982A1
SG121982A1 SG200506636A SG200506636A SG121982A1 SG 121982 A1 SG121982 A1 SG 121982A1 SG 200506636 A SG200506636 A SG 200506636A SG 200506636 A SG200506636 A SG 200506636A SG 121982 A1 SG121982 A1 SG 121982A1
Authority
SG
Singapore
Prior art keywords
inaccessible
diagnosing
methods
contact testing
shorted connections
Prior art date
Application number
SG200506636A
Other languages
English (en)
Inventor
Kenneth P Parker
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of SG121982A1 publication Critical patent/SG121982A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG200506636A 2004-11-02 2005-10-11 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections SG121982A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/979,590 US7224169B2 (en) 2004-11-02 2004-11-02 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections

Publications (1)

Publication Number Publication Date
SG121982A1 true SG121982A1 (en) 2006-05-26

Family

ID=36385606

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200506636A SG121982A1 (en) 2004-11-02 2005-10-11 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections

Country Status (4)

Country Link
US (1) US7224169B2 (zh)
CN (1) CN1769916A (zh)
SG (1) SG121982A1 (zh)
TW (1) TW200615560A (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928591B2 (en) * 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US20070187844A1 (en) 2006-02-10 2007-08-16 Wintec Industries, Inc. Electronic assembly with detachable components
US7307427B2 (en) * 2005-07-23 2007-12-11 Agilent Technologies, Inc. Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards
US7818698B2 (en) * 2007-06-29 2010-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Accurate parasitic capacitance extraction for ultra large scale integrated circuits
US9638742B2 (en) * 2008-11-14 2017-05-02 Teradyne, Inc. Method and apparatus for testing electrical connections on a printed circuit board
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
CN105093057A (zh) * 2015-09-23 2015-11-25 武汉安科新能电力科技有限公司 电路模块故障的诊断测试方法
CN108169664B (zh) * 2017-12-29 2021-01-01 深圳市大族数控科技有限公司 电路板故障检测方法和装置、计算机设备和存储介质
US10955465B2 (en) * 2018-09-14 2021-03-23 Teradyne, Inc. Method and apparatus for bond wire testing in an integrated circuit
CN109975687B (zh) * 2019-03-14 2022-07-08 深圳市大族封测科技股份有限公司 一种基于ic键合引线的质量检测装置及方法
CN113711064B (zh) * 2019-04-10 2024-03-08 Iee国际电子工程股份公司 多通道电容感测测量电路

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254953A (en) 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5557209A (en) 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5124660A (en) 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5274336A (en) 1992-01-14 1993-12-28 Hewlett-Packard Company Capacitively-coupled test probe
DE69229389T2 (de) 1992-02-25 1999-10-07 Hewlett-Packard Co., Palo Alto Testsystem für Schaltkreise
US5696451A (en) 1992-03-10 1997-12-09 Hewlett-Packard Co. Identification of pin-open faults by capacitive coupling
US5420500A (en) 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
US6087842A (en) 1996-04-29 2000-07-11 Agilent Technologies Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
US6998849B2 (en) * 2003-09-27 2006-02-14 Agilent Technologies, Inc. Capacitive sensor measurement method for discrete time sampled system for in-circuit test
US20050253616A1 (en) * 2004-04-30 2005-11-17 Parker Kenneth P Method and apparatus for testing and diagnosing electrical paths through area array integrated circuits

Also Published As

Publication number Publication date
CN1769916A (zh) 2006-05-10
TW200615560A (en) 2006-05-16
US20060103391A1 (en) 2006-05-18
US7224169B2 (en) 2007-05-29

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