SG121700A1 - A method and related apparatus for cutting a product from a sheet material - Google Patents

A method and related apparatus for cutting a product from a sheet material

Info

Publication number
SG121700A1
SG121700A1 SG200108105A SG200108105A SG121700A1 SG 121700 A1 SG121700 A1 SG 121700A1 SG 200108105 A SG200108105 A SG 200108105A SG 200108105 A SG200108105 A SG 200108105A SG 121700 A1 SG121700 A1 SG 121700A1
Authority
SG
Singapore
Prior art keywords
sheet material
predetermined shape
cut
line
support means
Prior art date
Application number
SG200108105A
Other languages
English (en)
Inventor
Michael William Gadd
Original Assignee
Jetsis Int Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jetsis Int Pte Ltd filed Critical Jetsis Int Pte Ltd
Priority to SG200108105A priority Critical patent/SG121700A1/en
Priority to MYPI20024867A priority patent/MY138820A/en
Priority to DE60231553T priority patent/DE60231553D1/de
Priority to KR10-2004-7010310A priority patent/KR20040073531A/ko
Priority to US10/500,273 priority patent/US7231855B2/en
Priority to CNB028260066A priority patent/CN1304179C/zh
Priority to PCT/SG2002/000297 priority patent/WO2003055654A1/fr
Priority to AU2002367166A priority patent/AU2002367166A1/en
Priority to JP2003556215A priority patent/JP4596780B2/ja
Priority to EP02805919A priority patent/EP1467845B1/fr
Priority to AT02805919T priority patent/ATE424979T1/de
Priority to CA002470898A priority patent/CA2470898C/fr
Priority to HK05109311A priority patent/HK1077253A1/xx
Publication of SG121700A1 publication Critical patent/SG121700A1/en
Priority to US11/748,010 priority patent/US20070209491A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02Wire-cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/10Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461Welding tables
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K7/00Cutting, scarfing, or desurfacing by applying flames
    • B23K7/002Machines, apparatus, or equipment for cutting plane workpieces, e.g. plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10Making cuts of other than simple rectilinear form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20Cutting beds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/04Processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/364By fluid blast and/or suction
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/647With means to convey work relative to tool station
    • Y10T83/6476Including means to move work from one tool station to another
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/647With means to convey work relative to tool station
    • Y10T83/6584Cut made parallel to direction of and during work movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Making Paper Articles (AREA)
SG200108105A 2001-12-28 2001-12-28 A method and related apparatus for cutting a product from a sheet material SG121700A1 (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
SG200108105A SG121700A1 (en) 2001-12-28 2001-12-28 A method and related apparatus for cutting a product from a sheet material
MYPI20024867A MY138820A (en) 2001-12-28 2002-12-24 Method and related apparatus for cutting a product from a sheet material
AU2002367166A AU2002367166A1 (en) 2001-12-28 2002-12-27 A method and related apparatus for cutting a product from a sheet material
KR10-2004-7010310A KR20040073531A (ko) 2001-12-28 2002-12-27 박판재료로부터 제품을 절단하기 위한 방법 및 그 장치
US10/500,273 US7231855B2 (en) 2001-12-28 2002-12-27 Method and related apparatus for cutting a product from a sheet material
CNB028260066A CN1304179C (zh) 2001-12-28 2002-12-27 从板材切割产品的方法及相关设备
PCT/SG2002/000297 WO2003055654A1 (fr) 2001-12-28 2002-12-27 Procede et appareil associe permettant de decouper un produit a partir d'un materiau de tole
DE60231553T DE60231553D1 (de) 2001-12-28 2002-12-27 Verfahren und verwandte vorrichtung zum schneiden eines produkts aus einem bahnmaterial
JP2003556215A JP4596780B2 (ja) 2001-12-28 2002-12-27 シート材料から製品を切断するための方法および関連装置
EP02805919A EP1467845B1 (fr) 2001-12-28 2002-12-27 Procede et appareil associe permettant de decouper un produit a partir d'un materiau de tole
AT02805919T ATE424979T1 (de) 2001-12-28 2002-12-27 Verfahren und verwandte vorrichtung zum schneiden eines produkts aus einem bahnmaterial
CA002470898A CA2470898C (fr) 2001-12-28 2002-12-27 Procede et appareil associe permettant de decouper un produit a partir d'un materiau de tole
HK05109311A HK1077253A1 (en) 2001-12-28 2005-10-20 A method and related apparatus for cutting a product from a sheet material
US11/748,010 US20070209491A1 (en) 2001-12-28 2007-05-14 Method and Related Apparatus for Cutting a Product from a Sheet Material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200108105A SG121700A1 (en) 2001-12-28 2001-12-28 A method and related apparatus for cutting a product from a sheet material

Publications (1)

Publication Number Publication Date
SG121700A1 true SG121700A1 (en) 2006-05-26

Family

ID=20430883

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200108105A SG121700A1 (en) 2001-12-28 2001-12-28 A method and related apparatus for cutting a product from a sheet material

Country Status (13)

Country Link
US (2) US7231855B2 (fr)
EP (1) EP1467845B1 (fr)
JP (1) JP4596780B2 (fr)
KR (1) KR20040073531A (fr)
CN (1) CN1304179C (fr)
AT (1) ATE424979T1 (fr)
AU (1) AU2002367166A1 (fr)
CA (1) CA2470898C (fr)
DE (1) DE60231553D1 (fr)
HK (1) HK1077253A1 (fr)
MY (1) MY138820A (fr)
SG (1) SG121700A1 (fr)
WO (1) WO2003055654A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7153186B2 (en) 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
ATE395717T1 (de) 2002-09-13 2008-05-15 Towa Corp Strahlvereinzelung eines substrats
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
JP2007190625A (ja) * 2006-01-17 2007-08-02 Disco Abrasive Syst Ltd ウォータージェット加工方法およびウォータージェット加工装置
SG136008A1 (en) * 2006-03-29 2007-10-29 Jetsis Int Pte Ltd Platform and method for supporting a workpiece to be cut from sheet material
KR20110095267A (ko) * 2008-11-18 2011-08-24 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 고속 레이저 블랭킹을 위한 지지 테이블 프레임
CH702452A1 (de) * 2009-12-17 2011-06-30 Micromachining Ag Bearbeitungsvorrichtung zum Bearbeiten eines Werkstücks mittels mindestens eines Flüssigkeitsstrahls.
CN103567642B (zh) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问(深圳)有限公司 蓝宝石切割装置
FR2997880B1 (fr) * 2012-11-13 2015-09-04 Christophe Ribot Procede de decoupe de rectangles
US20150053058A1 (en) 2013-08-21 2015-02-26 John Bean Technologies Corporation Rotatable manifold cutter for use in portioning
IS3000B (is) * 2013-08-21 2018-07-15 John Bean Tech Corporation A Delaware State Corporation Snúanlegur margþættur skeri til þess að nota við skömmtun
CN104028864A (zh) * 2014-06-25 2014-09-10 哈尔滨工业大学 一种多线电火花切割装置
CN107073738A (zh) * 2014-10-24 2017-08-18 福伊特专利有限公司 水射流切割装置
CN110167270B (zh) * 2019-05-29 2020-06-05 业成科技(成都)有限公司 治具及贴装设备
CN110549078B (zh) * 2019-09-12 2021-06-04 山东上达稀土材料有限公司 一种钕铁硼加工方法

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US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPH10128570A (ja) * 1996-10-29 1998-05-19 Mitsubishi Electric Corp レーザ加工機、レーザ加工機のワーク搬送装置およびワークを搬送する搬送装置

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US6634928B2 (en) * 2001-11-09 2003-10-21 International Business Machines Corporation Fluid jet cutting method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092889A (en) * 1975-04-09 1978-06-06 The British Hydromechanics Research Association Slotted worktable
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPH10128570A (ja) * 1996-10-29 1998-05-19 Mitsubishi Electric Corp レーザ加工機、レーザ加工機のワーク搬送装置およびワークを搬送する搬送装置

Also Published As

Publication number Publication date
CN1607998A (zh) 2005-04-20
CN1304179C (zh) 2007-03-14
MY138820A (en) 2009-07-31
KR20040073531A (ko) 2004-08-19
AU2002367166A1 (en) 2003-07-15
US20050235789A1 (en) 2005-10-27
CA2470898A1 (fr) 2003-07-10
JP4596780B2 (ja) 2010-12-15
EP1467845A1 (fr) 2004-10-20
CA2470898C (fr) 2008-09-02
DE60231553D1 (de) 2009-04-23
JP2005512837A (ja) 2005-05-12
ATE424979T1 (de) 2009-03-15
HK1077253A1 (en) 2006-02-10
US7231855B2 (en) 2007-06-19
US20070209491A1 (en) 2007-09-13
WO2003055654A1 (fr) 2003-07-10
EP1467845B1 (fr) 2009-03-11

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