SG115593A1 - Bond pad scheme for cu process - Google Patents

Bond pad scheme for cu process

Info

Publication number
SG115593A1
SG115593A1 SG200307202A SG200307202A SG115593A1 SG 115593 A1 SG115593 A1 SG 115593A1 SG 200307202 A SG200307202 A SG 200307202A SG 200307202 A SG200307202 A SG 200307202A SG 115593 A1 SG115593 A1 SG 115593A1
Authority
SG
Singapore
Prior art keywords
bond pad
bond pads
semiconductor device
bond
pad scheme
Prior art date
Application number
SG200307202A
Other languages
English (en)
Inventor
Lai Chia-Hung
Lin Jiunn-Jyi
Chang Tzong-Sheng
Cao Min
Tseng Huan-Chi
Lee Yu-Hua
Yang Chin-Tien
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Publication of SG115593A1 publication Critical patent/SG115593A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13005—Structure
    • H01L2224/13007—Bump connector smaller than the underlying bonding area, e.g. than the under bump metallisation [UBM]
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    • H01L2224/13001—Core members of the bump connector
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    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
SG200307202A 2003-05-23 2003-12-04 Bond pad scheme for cu process SG115593A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/444,229 US6844626B2 (en) 2003-05-23 2003-05-23 Bond pad scheme for Cu process

Publications (1)

Publication Number Publication Date
SG115593A1 true SG115593A1 (en) 2005-10-28

Family

ID=33450603

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200307202A SG115593A1 (en) 2003-05-23 2003-12-04 Bond pad scheme for cu process

Country Status (4)

Country Link
US (2) US6844626B2 (zh)
CN (2) CN1574321B (zh)
SG (1) SG115593A1 (zh)
TW (1) TWI222710B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10337569B4 (de) * 2003-08-14 2008-12-11 Infineon Technologies Ag Integrierte Anschlussanordnung und Herstellungsverfahren
KR100675275B1 (ko) * 2004-12-16 2007-01-26 삼성전자주식회사 반도체 장치 및 이 장치의 패드 배치방법
CN100377627C (zh) * 2006-02-28 2008-03-26 友达光电股份有限公司 可防止相邻焊垫短路的电路板
KR100791080B1 (ko) * 2007-01-23 2008-01-03 삼성전자주식회사 금속 패드 구조체를 갖는 전자 장치 및 그 제조방법
US7888257B2 (en) * 2007-10-10 2011-02-15 Agere Systems Inc. Integrated circuit package including wire bonds
EP2195837A1 (en) * 2007-10-31 2010-06-16 Agere Systems Inc. Bond pad support structure for semiconductor device
KR101383002B1 (ko) * 2012-05-25 2014-04-08 엘지이노텍 주식회사 반도체 패키지 기판, 이를 이용한 패키지 시스템 및 이의 제조 방법
KR101350989B1 (ko) 2012-06-13 2014-01-15 도시바삼성스토리지테크놀러지코리아 주식회사 대물렌즈 구동 유니트 및, 이를 적용하는 광 픽업 장치 및 광 디스크 드라이브
US11424204B2 (en) * 2019-08-15 2022-08-23 Mediatek Inc. Semiconductor component and manufacturing method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187680B1 (en) * 1998-10-07 2001-02-13 International Business Machines Corporation Method/structure for creating aluminum wirebound pad on copper BEOL
TWI249548B (en) * 1998-12-08 2006-02-21 Toyo Boseki Void-containing polyester-based film
US6197681B1 (en) * 1999-12-31 2001-03-06 United Microelectronics Corp. Forming copper interconnects in dielectric materials with low constant dielectrics
US6709965B1 (en) * 2002-10-02 2004-03-23 Taiwan Semiconductor Manufacturing Company Aluminum-copper bond pad design and method of fabrication

Also Published As

Publication number Publication date
US20050095836A1 (en) 2005-05-05
CN1574321A (zh) 2005-02-02
US20040235223A1 (en) 2004-11-25
CN2720634Y (zh) 2005-08-24
TW200426987A (en) 2004-12-01
CN1574321B (zh) 2010-04-28
US6844626B2 (en) 2005-01-18
US7015129B2 (en) 2006-03-21
TWI222710B (en) 2004-10-21

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