SG11202111416YA - Semiconductor apparatus examination method and semiconductor apparatus examination apparatus - Google Patents

Semiconductor apparatus examination method and semiconductor apparatus examination apparatus

Info

Publication number
SG11202111416YA
SG11202111416YA SG11202111416YA SG11202111416YA SG11202111416YA SG 11202111416Y A SG11202111416Y A SG 11202111416YA SG 11202111416Y A SG11202111416Y A SG 11202111416YA SG 11202111416Y A SG11202111416Y A SG 11202111416YA SG 11202111416Y A SG11202111416Y A SG 11202111416YA
Authority
SG
Singapore
Prior art keywords
examination
semiconductor apparatus
semiconductor
apparatus examination
examination method
Prior art date
Application number
SG11202111416YA
Other languages
English (en)
Inventor
Tomochika Takeshima
Takafumi Higuchi
Kazuhiro Hotta
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of SG11202111416YA publication Critical patent/SG11202111416YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/303—Contactless testing of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Signal Processing (AREA)
  • Environmental & Geological Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG11202111416YA 2019-05-31 2020-04-09 Semiconductor apparatus examination method and semiconductor apparatus examination apparatus SG11202111416YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019102283 2019-05-31
PCT/JP2020/015982 WO2020241083A1 (ja) 2019-05-31 2020-04-09 半導体デバイス検査方法及び半導体デバイス検査装置

Publications (1)

Publication Number Publication Date
SG11202111416YA true SG11202111416YA (en) 2021-11-29

Family

ID=73552858

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202111416YA SG11202111416YA (en) 2019-05-31 2020-04-09 Semiconductor apparatus examination method and semiconductor apparatus examination apparatus

Country Status (8)

Country Link
US (1) US20220221411A1 (ja)
EP (1) EP3979301A4 (ja)
JP (1) JP7398449B2 (ja)
KR (1) KR20220016033A (ja)
CN (1) CN113906544A (ja)
SG (1) SG11202111416YA (ja)
TW (1) TWI846871B (ja)
WO (1) WO2020241083A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7164488B2 (ja) * 2019-05-31 2022-11-01 浜松ホトニクス株式会社 半導体デバイス検査方法及び半導体デバイス検査装置
CN115843466A (zh) * 2020-07-09 2023-03-24 特克特朗尼克公司 指示制造电子电路的探测目标

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030019948A (ko) * 2001-05-03 2003-03-07 코닌클리케 필립스 일렉트로닉스 엔.브이. 광학 주사장치
US7733100B2 (en) 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
SG10201401887YA (en) 2009-05-01 2014-06-27 Dcg Systems Inc Systems and method for laser voltage imaging state mapping
US9581642B2 (en) * 2010-05-12 2017-02-28 International Business Machines Corporation Method and system for quickly identifying circuit components in an emission image
US8669524B2 (en) * 2010-10-25 2014-03-11 The Reseach Foundation of State University of New York Scanning incremental focus microscopy
JP5894745B2 (ja) * 2011-05-31 2016-03-30 浜松ホトニクス株式会社 集積回路検査装置
US10663750B2 (en) * 2016-03-15 2020-05-26 The Regents Of The University Of Colorado, A Body Super-resolution imaging of extended objects
JP2018072290A (ja) * 2016-11-04 2018-05-10 ルネサスエレクトロニクス株式会社 故障箇所特定装置および故障箇所特定方法
US11579184B2 (en) * 2017-11-27 2023-02-14 Hamamatsu Photonics K.K. Analysis method, analysis device, analysis program, and recording medium for recording analysis program
JP7164488B2 (ja) * 2019-05-31 2022-11-01 浜松ホトニクス株式会社 半導体デバイス検査方法及び半導体デバイス検査装置

Also Published As

Publication number Publication date
CN113906544A (zh) 2022-01-07
TWI846871B (zh) 2024-07-01
EP3979301A1 (en) 2022-04-06
US20220221411A1 (en) 2022-07-14
KR20220016033A (ko) 2022-02-08
WO2020241083A1 (ja) 2020-12-03
TW202102871A (zh) 2021-01-16
EP3979301A4 (en) 2023-06-28
JP7398449B2 (ja) 2023-12-14
JPWO2020241083A1 (ja) 2020-12-03

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