SG11202108831UA - Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof - Google Patents

Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof

Info

Publication number
SG11202108831UA
SG11202108831UA SG11202108831UA SG11202108831UA SG11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA SG 11202108831U A SG11202108831U A SG 11202108831UA
Authority
SG
Singapore
Prior art keywords
abrasive
making
methods
precisely shaped
shaped features
Prior art date
Application number
SG11202108831UA
Other languages
English (en)
Inventor
Matthew C Fritz
Junqing Xie
Vincent J Laraia
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11202108831UA publication Critical patent/SG11202108831UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11202108831UA 2019-02-13 2020-02-11 Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof SG11202108831UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962805003P 2019-02-13 2019-02-13
PCT/IB2020/051078 WO2020165759A1 (en) 2019-02-13 2020-02-11 Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof

Publications (1)

Publication Number Publication Date
SG11202108831UA true SG11202108831UA (en) 2021-09-29

Family

ID=72045268

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202108831UA SG11202108831UA (en) 2019-02-13 2020-02-11 Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof

Country Status (7)

Country Link
US (1) US20220134512A1 (zh)
EP (1) EP3924146A4 (zh)
JP (1) JP2022519889A (zh)
CN (1) CN113439010A (zh)
SG (1) SG11202108831UA (zh)
TW (1) TW202104520A (zh)
WO (1) WO2020165759A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115106871A (zh) * 2022-08-29 2022-09-27 成都中科卓尔智能科技集团有限公司 一种半导体材料表面缺陷柔性高精度修复装置及工艺

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US8062098B2 (en) * 2000-11-17 2011-11-22 Duescher Wayne O High speed flat lapping platen
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
JP2003188125A (ja) * 2001-12-18 2003-07-04 Ebara Corp ポリッシング装置
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
WO2009088606A2 (en) * 2007-12-31 2009-07-16 3M Innovative Properties Company Plasma treated abrasive article and method of making same
KR101916492B1 (ko) * 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
US9393673B2 (en) * 2012-07-06 2016-07-19 3M Innovative Properties Company Coated abrasive article
SG11201500713PA (en) * 2012-08-02 2015-02-27 3M Innovative Properties Co Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
KR102304574B1 (ko) * 2014-03-21 2021-09-27 엔테그리스, 아이엔씨. 세장형 절삭 에지를 갖는 화학 기계 평탄화 패드 컨디셔너
TW201538276A (zh) * 2014-04-08 2015-10-16 Kinik Co 非等高度之化學機械研磨修整器
CN107107312B (zh) * 2014-10-07 2019-03-29 3M创新有限公司 纹理的磨料制品及相关方法

Also Published As

Publication number Publication date
TW202104520A (zh) 2021-02-01
EP3924146A1 (en) 2021-12-22
JP2022519889A (ja) 2022-03-25
CN113439010A (zh) 2021-09-24
EP3924146A4 (en) 2022-11-09
WO2020165759A1 (en) 2020-08-20
US20220134512A1 (en) 2022-05-05

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