SG11202107797YA - A stretchable interconnect structure and method of fabricating the same - Google Patents

A stretchable interconnect structure and method of fabricating the same

Info

Publication number
SG11202107797YA
SG11202107797YA SG11202107797YA SG11202107797YA SG11202107797YA SG 11202107797Y A SG11202107797Y A SG 11202107797YA SG 11202107797Y A SG11202107797Y A SG 11202107797YA SG 11202107797Y A SG11202107797Y A SG 11202107797YA SG 11202107797Y A SG11202107797Y A SG 11202107797YA
Authority
SG
Singapore
Prior art keywords
fabricating
same
interconnect structure
stretchable interconnect
stretchable
Prior art date
Application number
SG11202107797YA
Inventor
Chee Keong Tee
Yue Zhao
Yu Jun Tan
Original Assignee
Nat Univ Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Univ Singapore filed Critical Nat Univ Singapore
Publication of SG11202107797YA publication Critical patent/SG11202107797YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/06—Extensible conductors or cables, e.g. self-coiling cords
    • H01B7/065—Extensible conductors or cables, e.g. self-coiling cords having the shape of an helix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/008—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing extensible conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
SG11202107797YA 2019-01-16 2020-01-16 A stretchable interconnect structure and method of fabricating the same SG11202107797YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG10201900416P 2019-01-16
PCT/SG2020/050023 WO2020149796A1 (en) 2019-01-16 2020-01-16 A stretchable interconnect structure and method of fabricating the same

Publications (1)

Publication Number Publication Date
SG11202107797YA true SG11202107797YA (en) 2021-08-30

Family

ID=71614070

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202107797YA SG11202107797YA (en) 2019-01-16 2020-01-16 A stretchable interconnect structure and method of fabricating the same

Country Status (4)

Country Link
US (1) US20220117082A1 (en)
EP (1) EP3912174A4 (en)
SG (1) SG11202107797YA (en)
WO (1) WO2020149796A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2255378B1 (en) * 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Stretchable and foldable electronic devices
KR101048356B1 (en) * 2009-06-08 2011-07-14 서울대학교산학협력단 Metal connection structure of stretchable electronic elements and manufacturing method thereof
US9752259B2 (en) * 2012-04-09 2017-09-05 The Hong Kong Research Intitute Of Textiles And Apparel Limited Stretchable electrical interconnect and method of making same
KR20140049314A (en) * 2012-10-17 2014-04-25 한국전자통신연구원 Stretchable electric device and manufacturing method of the same
US9674949B1 (en) * 2013-08-27 2017-06-06 Flextronics Ap, Llc Method of making stretchable interconnect using magnet wires
US20150189753A1 (en) * 2013-12-30 2015-07-02 Aliphcom Stress-tolerant interconnections for connectivity in wearable electronics platforms
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same
KR102061127B1 (en) * 2015-01-27 2020-01-02 한국전자통신연구원 Electrically conductive stretchable interconnect using twisted nature of yarn fibers and method of manufacturing thereof
WO2016133065A1 (en) * 2015-02-20 2016-08-25 国立研究開発法人産業技術総合研究所 Highly elastic wiring, and method and device for producing same
KR101878031B1 (en) * 2016-05-03 2018-07-12 홍익대학교 산학협력단 Method for manufacturing stretchable wiring structures consisting of coil-shaped conductors and stretchable wiring structures manufactured thereof
KR101926034B1 (en) * 2017-06-29 2019-02-26 한국과학기술연구원 Wavy metal nanowire network thin film, flexible transparent electrode comprising the same, and the preparation method thereof
CN108520795B (en) * 2018-03-26 2019-12-17 中国科学院上海硅酸盐研究所 Ultrahigh-elasticity wire and preparation method thereof

Also Published As

Publication number Publication date
EP3912174A4 (en) 2022-03-16
EP3912174A1 (en) 2021-11-24
US20220117082A1 (en) 2022-04-14
WO2020149796A1 (en) 2020-07-23

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