SG10202006562UA - Three-dimensional semiconductor devices and methods of fabricating the same - Google Patents
Three-dimensional semiconductor devices and methods of fabricating the sameInfo
- Publication number
- SG10202006562UA SG10202006562UA SG10202006562UA SG10202006562UA SG10202006562UA SG 10202006562U A SG10202006562U A SG 10202006562UA SG 10202006562U A SG10202006562U A SG 10202006562UA SG 10202006562U A SG10202006562U A SG 10202006562UA SG 10202006562U A SG10202006562U A SG 10202006562UA
- Authority
- SG
- Singapore
- Prior art keywords
- fabricating
- methods
- same
- semiconductor devices
- dimensional semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1037—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure and non-planar channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/105—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with vertical doping variation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
- H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190102564A KR20210024318A (en) | 2019-08-21 | 2019-08-21 | Three-dimensional semiconductor devices and methods of fabricating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202006562UA true SG10202006562UA (en) | 2021-03-30 |
Family
ID=74495872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202006562UA SG10202006562UA (en) | 2019-08-21 | 2020-07-08 | Three-dimensional semiconductor devices and methods of fabricating the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US11387253B2 (en) |
JP (1) | JP2021034717A (en) |
KR (1) | KR20210024318A (en) |
CN (1) | CN112420723A (en) |
DE (1) | DE102020121073A1 (en) |
SG (1) | SG10202006562UA (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210024318A (en) | 2019-08-21 | 2021-03-05 | 삼성전자주식회사 | Three-dimensional semiconductor devices and methods of fabricating the same |
JP2022534308A (en) | 2019-10-22 | 2022-07-28 | 長江存儲科技有限責任公司 | Three-dimensional memory device with pocket structure in memory string and method |
JP2022139554A (en) * | 2021-03-12 | 2022-09-26 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
TWI789295B (en) * | 2022-04-27 | 2023-01-01 | 旺宏電子股份有限公司 | Memory device |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101825534B1 (en) * | 2011-02-07 | 2018-02-06 | 삼성전자주식회사 | Three Dimensional Semiconductor Memory Device |
US9425210B2 (en) * | 2014-08-13 | 2016-08-23 | SK Hynix Inc. | Double-source semiconductor device |
US9362298B2 (en) | 2014-09-11 | 2016-06-07 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor memory device and manufacturing method thereof |
KR20160080365A (en) | 2014-12-29 | 2016-07-08 | 에스케이하이닉스 주식회사 | Electronic device and manufacturing method thereof |
US9455261B1 (en) | 2015-07-10 | 2016-09-27 | Micron Technology, Inc. | Integrated structures |
KR102581032B1 (en) | 2015-12-08 | 2023-09-22 | 에스케이하이닉스 주식회사 | Semiconductor device and manufacturing method thereof |
KR102589594B1 (en) * | 2016-03-02 | 2023-10-17 | 삼성전자주식회사 | Semiconductor memory device |
US9741737B1 (en) | 2016-04-15 | 2017-08-22 | Micron Technology, Inc. | Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material |
US10121794B2 (en) | 2016-06-20 | 2018-11-06 | Sandisk Technologies Llc | Three-dimensional memory device having epitaxial germanium-containing vertical channel and method of making thereof |
US9824966B1 (en) * | 2016-08-12 | 2017-11-21 | Sandisk Technologies Llc | Three-dimensional memory device containing a lateral source contact and method of making the same |
KR102629454B1 (en) | 2016-08-22 | 2024-01-26 | 에스케이하이닉스 주식회사 | Semiconductor memory device |
US10361218B2 (en) * | 2017-02-28 | 2019-07-23 | Toshiba Memory Corporation | Semiconductor device and method for manufacturing same |
KR20180129457A (en) | 2017-05-26 | 2018-12-05 | 에스케이하이닉스 주식회사 | Semiconductor device and manufacturing method thereof |
US10224340B2 (en) * | 2017-06-19 | 2019-03-05 | Sandisk Technologies Llc | Three-dimensional memory device having discrete direct source strap contacts and method of making thereof |
US10438964B2 (en) | 2017-06-26 | 2019-10-08 | Sandisk Technologies Llc | Three-dimensional memory device having direct source contact and metal oxide blocking dielectric and method of making thereof |
US10199359B1 (en) | 2017-08-04 | 2019-02-05 | Sandisk Technologies Llc | Three-dimensional memory device employing direct source contact and hole current detection and method of making the same |
JP2019041054A (en) | 2017-08-28 | 2019-03-14 | 東芝メモリ株式会社 | Semiconductor device |
JP6842386B2 (en) | 2017-08-31 | 2021-03-17 | キオクシア株式会社 | Semiconductor device |
JP2019054162A (en) | 2017-09-15 | 2019-04-04 | 東芝メモリ株式会社 | Method for manufacturing storage device and storage device |
US10720445B1 (en) * | 2018-02-08 | 2020-07-21 | Sandisk Technologies Llc | Three-dimensional memory device having nitrided direct source strap contacts and method of making thereof |
US10629613B1 (en) * | 2018-11-20 | 2020-04-21 | Sandisk Technologies Llc | Three-dimensional memory device having vertical semiconductor channels including source-side boron-doped pockets and methods of making the same |
KR20210024318A (en) | 2019-08-21 | 2021-03-05 | 삼성전자주식회사 | Three-dimensional semiconductor devices and methods of fabricating the same |
-
2019
- 2019-08-21 KR KR1020190102564A patent/KR20210024318A/en not_active Application Discontinuation
-
2020
- 2020-06-17 JP JP2020104599A patent/JP2021034717A/en active Pending
- 2020-06-24 US US16/910,199 patent/US11387253B2/en active Active
- 2020-07-08 SG SG10202006562UA patent/SG10202006562UA/en unknown
- 2020-08-11 DE DE102020121073.6A patent/DE102020121073A1/en active Pending
- 2020-08-19 CN CN202010836465.6A patent/CN112420723A/en active Pending
-
2022
- 2022-07-07 US US17/859,631 patent/US11792993B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11387253B2 (en) | 2022-07-12 |
US11792993B2 (en) | 2023-10-17 |
KR20210024318A (en) | 2021-03-05 |
DE102020121073A1 (en) | 2021-02-25 |
US20220352203A1 (en) | 2022-11-03 |
JP2021034717A (en) | 2021-03-01 |
US20210057445A1 (en) | 2021-02-25 |
CN112420723A (en) | 2021-02-26 |
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