SG11202106682VA - Probe substrate and electrical connecting apparatus - Google Patents

Probe substrate and electrical connecting apparatus

Info

Publication number
SG11202106682VA
SG11202106682VA SG11202106682VA SG11202106682VA SG11202106682VA SG 11202106682V A SG11202106682V A SG 11202106682VA SG 11202106682V A SG11202106682V A SG 11202106682VA SG 11202106682V A SG11202106682V A SG 11202106682VA SG 11202106682V A SG11202106682V A SG 11202106682VA
Authority
SG
Singapore
Prior art keywords
electrical connecting
connecting apparatus
probe substrate
probe
substrate
Prior art date
Application number
SG11202106682VA
Inventor
Toshinori OMORI
Kazuya Goto
Yasuaki Osanai
Takashi Akiniwa
Takeki SUGISAWA
Takeshi Kondo
Shintaro Abe
Maki Watanabe
Original Assignee
Nihon Micronics Kk
Tanaka Precious Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk, Tanaka Precious Metal Ind filed Critical Nihon Micronics Kk
Publication of SG11202106682VA publication Critical patent/SG11202106682VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11202106682VA 2019-01-15 2019-10-18 Probe substrate and electrical connecting apparatus SG11202106682VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019004573A JP6609073B1 (en) 2019-01-15 2019-01-15 Probe board and electrical connection device
PCT/JP2019/041156 WO2020148960A1 (en) 2019-01-15 2019-10-18 Probe substrate and electrical connection device

Publications (1)

Publication Number Publication Date
SG11202106682VA true SG11202106682VA (en) 2021-07-29

Family

ID=68611067

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106682VA SG11202106682VA (en) 2019-01-15 2019-10-18 Probe substrate and electrical connecting apparatus

Country Status (6)

Country Link
US (1) US11747365B2 (en)
JP (1) JP6609073B1 (en)
CN (1) CN113302503B (en)
SG (1) SG11202106682VA (en)
TW (1) TWI742452B (en)
WO (1) WO2020148960A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023027123A1 (en) * 2021-08-26 2023-03-02 デンカ株式会社 Composite sheet and composite sheet manufacturing method, and laminated substrate
JP2023082992A (en) * 2021-12-03 2023-06-15 日本電気硝子株式会社 Probe substrate
JP2024017497A (en) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス electrical connection device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5083697A (en) 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5286417A (en) * 1991-12-06 1994-02-15 International Business Machines Corporation Method and composition for making mechanical and electrical contact
EP1339073B1 (en) * 2000-10-25 2011-09-21 Harima Chemicals, Inc. Electroconductive metal paste and method for production thereof
WO2006126279A1 (en) 2005-05-23 2006-11-30 Kabushiki Kaisha Nihon Micronics Probe assembly, method of producing the probe assembly, and electrical connection device
JP2008145238A (en) 2006-12-08 2008-06-26 Micronics Japan Co Ltd Electrical connection apparatus and electric connection device using it
WO2009090915A1 (en) * 2008-01-17 2009-07-23 Nichia Corporation Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
US8760187B2 (en) 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
JP5611537B2 (en) * 2009-04-28 2014-10-22 日立化成株式会社 Conductive bonding material, bonding method using the same, and semiconductor device bonded thereby
JP5486281B2 (en) * 2009-12-08 2014-05-07 荒川化学工業株式会社 Solder paste
JP5620122B2 (en) * 2010-02-24 2014-11-05 地方独立行政法人 大阪市立工業研究所 Joining material and joining method
JP6079375B2 (en) * 2013-03-29 2017-02-15 三菱マテリアル株式会社 Solder powder, method for producing the same, and solder paste using the powder
JP5757359B2 (en) * 2013-09-30 2015-07-29 三菱マテリアル株式会社 Cu / ceramic bonded body, Cu / ceramic bonded body manufacturing method, and power module substrate
CN106255569B (en) * 2013-12-31 2019-11-05 阿尔法金属公司 Thermosetting flux preparaton without rosin
MX2016015582A (en) * 2014-05-29 2017-05-04 Yupo Corp Label, method for manufacturing label, method for using label, and body with label.
JP2016167527A (en) * 2015-03-10 2016-09-15 株式会社日立製作所 Semiconductor module and manufacturing method of the same
JP6428408B2 (en) * 2015-03-18 2018-11-28 三菱マテリアル株式会社 Method for producing solder powder and method for producing solder paste using the powder
JP2016203208A (en) * 2015-04-22 2016-12-08 住友金属鉱山株式会社 Au-Sn-Ag-BASED SOLDER PASTE, AND ELECTRONIC COMPONENT JOINED OR SEALED USING THE Au-Sn-Ag-BASED SOLDER PASTE
WO2017022523A1 (en) * 2015-08-03 2017-02-09 古河電気工業株式会社 Conductive composition
JP6607006B2 (en) * 2015-12-01 2019-11-20 三菱マテリアル株式会社 Solder powder and method for preparing solder paste using the powder
JP6482144B2 (en) 2015-12-28 2019-03-13 日本碍子株式会社 Bonding substrate and manufacturing method of bonding substrate
JP6835540B2 (en) * 2016-11-09 2021-02-24 京セラ株式会社 Ceramic wiring board, probe board and probe card
US10739381B2 (en) * 2017-05-26 2020-08-11 Tektronix, Inc. Component attachment technique using a UV-cure conductive adhesive

Also Published As

Publication number Publication date
CN113302503A (en) 2021-08-24
US11747365B2 (en) 2023-09-05
WO2020148960A1 (en) 2020-07-23
JP2020112487A (en) 2020-07-27
TWI742452B (en) 2021-10-11
CN113302503B (en) 2024-04-30
TW202028756A (en) 2020-08-01
JP6609073B1 (en) 2019-11-20
KR20210096258A (en) 2021-08-04
US20220099702A1 (en) 2022-03-31

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