SG11202104414RA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11202104414RA SG11202104414RA SG11202104414RA SG11202104414RA SG11202104414RA SG 11202104414R A SG11202104414R A SG 11202104414RA SG 11202104414R A SG11202104414R A SG 11202104414RA SG 11202104414R A SG11202104414R A SG 11202104414RA SG 11202104414R A SG11202104414R A SG 11202104414RA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018241266A JP7361467B2 (en) | 2018-12-25 | 2018-12-25 | polishing composition |
PCT/JP2019/045657 WO2020137278A1 (en) | 2018-12-25 | 2019-11-21 | Polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202104414RA true SG11202104414RA (en) | 2021-05-28 |
Family
ID=71127941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202104414RA SG11202104414RA (en) | 2018-12-25 | 2019-11-21 | Polishing composition |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7361467B2 (en) |
KR (1) | KR20210106435A (en) |
CN (1) | CN113227309B (en) |
DE (1) | DE112019006394T5 (en) |
SG (1) | SG11202104414RA (en) |
TW (1) | TWI833865B (en) |
WO (1) | WO2020137278A1 (en) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5931355A (en) | 1982-08-13 | 1984-02-20 | ワイケイケイ株式会社 | Remodeling of cap handrail of existing handrail |
JPH11140427A (en) * | 1997-11-13 | 1999-05-25 | Kobe Steel Ltd | Polishing liquid and polishing |
JP5721505B2 (en) | 2011-04-01 | 2015-05-20 | ニッタ・ハース株式会社 | Polishing composition |
WO2013176122A1 (en) * | 2012-05-25 | 2013-11-28 | 日産化学工業株式会社 | Polishing solution composition for wafers |
JP5732601B2 (en) * | 2012-11-30 | 2015-06-10 | ニッタ・ハース株式会社 | Polishing composition |
JP6245939B2 (en) | 2013-10-25 | 2017-12-13 | 花王株式会社 | Polishing liquid composition for silicon wafer |
JP6559936B2 (en) * | 2014-09-05 | 2019-08-14 | 日本キャボット・マイクロエレクトロニクス株式会社 | Slurry composition, rinse composition, substrate polishing method and rinse method |
JP2016213216A (en) | 2015-04-28 | 2016-12-15 | 花王株式会社 | Polishing liquid composition for silicon wafers |
KR20180070586A (en) * | 2015-10-23 | 2018-06-26 | 니타 하스 인코포레이티드 | Abrasive composition |
SG11201803362VA (en) * | 2015-10-23 | 2018-05-30 | Nitta Haas Inc | Polishing composition |
-
2018
- 2018-12-25 JP JP2018241266A patent/JP7361467B2/en active Active
-
2019
- 2019-11-21 DE DE112019006394.4T patent/DE112019006394T5/en active Pending
- 2019-11-21 KR KR1020217018371A patent/KR20210106435A/en unknown
- 2019-11-21 SG SG11202104414RA patent/SG11202104414RA/en unknown
- 2019-11-21 CN CN201980084926.4A patent/CN113227309B/en active Active
- 2019-11-21 WO PCT/JP2019/045657 patent/WO2020137278A1/en active Application Filing
- 2019-12-24 TW TW108147365A patent/TWI833865B/en active
Also Published As
Publication number | Publication date |
---|---|
CN113227309B (en) | 2022-10-11 |
DE112019006394T5 (en) | 2021-09-02 |
CN113227309A (en) | 2021-08-06 |
TWI833865B (en) | 2024-03-01 |
KR20210106435A (en) | 2021-08-30 |
TW202033689A (en) | 2020-09-16 |
WO2020137278A1 (en) | 2020-07-02 |
JP7361467B2 (en) | 2023-10-16 |
JP2020100778A (en) | 2020-07-02 |
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