SG11202011323TA - Server, server rack and data centre - Google Patents

Server, server rack and data centre

Info

Publication number
SG11202011323TA
SG11202011323TA SG11202011323TA SG11202011323TA SG11202011323TA SG 11202011323T A SG11202011323T A SG 11202011323TA SG 11202011323T A SG11202011323T A SG 11202011323TA SG 11202011323T A SG11202011323T A SG 11202011323TA SG 11202011323T A SG11202011323T A SG 11202011323TA
Authority
SG
Singapore
Prior art keywords
server
data centre
rack
server rack
centre
Prior art date
Application number
SG11202011323TA
Inventor
Poh Seng Lee
yong jie Chen
Matthew Lee Liong Law
Navin Raja Kuppusamy
Original Assignee
Nat Univ Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Univ Singapore filed Critical Nat Univ Singapore
Publication of SG11202011323TA publication Critical patent/SG11202011323TA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG11202011323TA 2018-08-21 2019-08-07 Server, server rack and data centre SG11202011323TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG10201807100Y 2018-08-21
PCT/SG2019/050392 WO2020040694A1 (en) 2018-08-21 2019-08-07 Server, server rack and data centre

Publications (1)

Publication Number Publication Date
SG11202011323TA true SG11202011323TA (en) 2020-12-30

Family

ID=69593387

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202011323TA SG11202011323TA (en) 2018-08-21 2019-08-07 Server, server rack and data centre

Country Status (3)

Country Link
US (1) US11497145B2 (en)
SG (1) SG11202011323TA (en)
WO (1) WO2020040694A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112954949B (en) * 2019-12-10 2024-05-03 台达电子工业股份有限公司 Network equipment power supply and heat dissipation system for network equipment power supply
CN112672611A (en) * 2020-12-25 2021-04-16 佛山市液冷时代科技有限公司 Server cabinet liquid cooling system combined with shell-and-tube heat exchanger and control method
US20220346285A1 (en) * 2021-04-23 2022-10-27 Nvidia Corporation Intelligent in-rack pump or compressor unit for datacenter cooling systems
TWI810559B (en) * 2021-05-07 2023-08-01 緯穎科技服務股份有限公司 Immersion cooling system and electronic apparatus having the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7203063B2 (en) * 2004-05-21 2007-04-10 Hewlett-Packard Development Company, L.P. Small form factor liquid loop cooling system
US7578337B2 (en) * 2005-04-14 2009-08-25 United States Thermoelectric Consortium Heat dissipating device
US7342789B2 (en) 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
US7701714B2 (en) * 2006-05-26 2010-04-20 Flextronics Ap, Llc Liquid-air hybrid cooling in electronics equipment
US7400505B2 (en) * 2006-10-10 2008-07-15 International Business Machines Corporation Hybrid cooling system and method for a multi-component electronics system
US7957132B2 (en) 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US7477514B2 (en) 2007-05-04 2009-01-13 International Business Machines Corporation Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US7963119B2 (en) * 2007-11-26 2011-06-21 International Business Machines Corporation Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center
CA2731994C (en) 2008-08-11 2018-03-06 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
US7800900B1 (en) 2009-04-21 2010-09-21 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US7969727B2 (en) * 2009-04-29 2011-06-28 Hewlett-Packard Development Company, L.P. Cooling
EP2591646B1 (en) * 2010-07-06 2014-12-24 Sam Technologies GmbH System and method for cooling a computer system
US20150237767A1 (en) * 2011-06-27 2015-08-20 Ebullient, Llc Heat sink for use with pumped coolant
US9445529B2 (en) 2012-05-23 2016-09-13 International Business Machines Corporation Liquid cooled data center design selection
WO2016018423A1 (en) 2014-07-31 2016-02-04 Hewlett-Packard Development Company, L.P. Air and fluid cooling of a data center
US9683794B2 (en) * 2014-09-12 2017-06-20 Schneider Electric It Corporation Indirect free cooling module
WO2016069271A1 (en) * 2014-10-27 2016-05-06 Ebullient, Llc Method of absorbing heat with series-connected heat sink modules
CN106132176A (en) * 2016-08-24 2016-11-16 浪潮电子信息产业股份有限公司 A kind of Rack whole machine cabinet fin-tube type cooling system
US20180066663A1 (en) * 2016-09-08 2018-03-08 Intel Corporation Cooling using coolant-driven fans
US10238011B1 (en) * 2017-10-10 2019-03-19 Baidu Usa Llc Optimal controller for hybrid liquid-air cooling system of electronic racks of a data center
CN108024480B (en) 2017-12-07 2024-04-30 广东西江数据科技有限公司 Liquid-cooled cabinet, whole cabinet and whole cabinet server
CN107960049A (en) 2017-12-29 2018-04-24 华南理工大学 The Intelligent server cabinet and its control method that a kind of liquid is cold, wind-cooling heat dissipating combines

Also Published As

Publication number Publication date
WO2020040694A1 (en) 2020-02-27
US11497145B2 (en) 2022-11-08
US20210274683A1 (en) 2021-09-02
WO2020040694A8 (en) 2020-04-30

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