SG11202011171TA - High-performance probe card in high-frequency - Google Patents
High-performance probe card in high-frequencyInfo
- Publication number
- SG11202011171TA SG11202011171TA SG11202011171TA SG11202011171TA SG11202011171TA SG 11202011171T A SG11202011171T A SG 11202011171TA SG 11202011171T A SG11202011171T A SG 11202011171TA SG 11202011171T A SG11202011171T A SG 11202011171TA SG 11202011171T A SG11202011171T A SG 11202011171TA
- Authority
- SG
- Singapore
- Prior art keywords
- frequency
- probe card
- performance probe
- performance
- card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102018000005444A IT201800005444A1 (en) | 2018-05-16 | 2018-05-16 | Measurement board with high performance in high frequency |
PCT/EP2019/062276 WO2019219638A1 (en) | 2018-05-16 | 2019-05-14 | High-performance probe card in high-frequency |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202011171TA true SG11202011171TA (en) | 2020-12-30 |
Family
ID=63080366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202011171TA SG11202011171TA (en) | 2018-05-16 | 2019-05-14 | High-performance probe card in high-frequency |
Country Status (9)
Country | Link |
---|---|
US (1) | US11402428B2 (en) |
EP (1) | EP3794357B1 (en) |
JP (1) | JP7416725B2 (en) |
KR (1) | KR20210010895A (en) |
CN (1) | CN112119315B (en) |
IT (1) | IT201800005444A1 (en) |
PH (1) | PH12020551950A1 (en) |
SG (1) | SG11202011171TA (en) |
WO (1) | WO2019219638A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201900024964A1 (en) * | 2019-12-20 | 2021-06-20 | Technoprobe Spa | Measuring head for low pitch applications |
TWI784439B (en) * | 2021-03-12 | 2022-11-21 | 冠銓科技實業股份有限公司 | Test needle seat structure for high frequency measurement |
CN114200278B (en) * | 2021-11-29 | 2022-12-27 | 强一半导体(苏州)有限公司 | Film probe card and probe head thereof |
TWI790065B (en) * | 2021-12-27 | 2023-01-11 | 冠銓科技實業股份有限公司 | Improvement of the structure of the test needle seat for high-frequency measurement |
WO2023237546A1 (en) * | 2022-06-07 | 2023-12-14 | Technoprobe S.P.A. | Improved measurement system for the testing of high-frequency devices |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4912399A (en) * | 1987-06-09 | 1990-03-27 | Tektronix, Inc. | Multiple lead probe for integrated circuits in wafer form |
US4906920A (en) * | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
JP2000131342A (en) | 1998-10-20 | 2000-05-12 | Fujitsu Ltd | Contactor for electronic part |
US6917525B2 (en) * | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
JP4480258B2 (en) | 2000-03-29 | 2010-06-16 | 株式会社日本マイクロニクス | Electrical contact device in semiconductor device inspection equipment |
US6867607B2 (en) * | 2002-01-22 | 2005-03-15 | Sychip, Inc. | Membrane test method and apparatus for integrated circuit testing |
US6911835B2 (en) | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
US7598100B2 (en) * | 2004-11-18 | 2009-10-06 | Renesas Technology Corp. | Manufacturing method of semiconductor integrated circuit device |
JP5065674B2 (en) * | 2006-12-28 | 2012-11-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor integrated circuit device |
JP5049694B2 (en) | 2007-08-07 | 2012-10-17 | ルネサスエレクトロニクス株式会社 | Probe card, semiconductor inspection apparatus, and semiconductor device manufacturing method |
WO2011036718A1 (en) * | 2009-09-25 | 2011-03-31 | 株式会社アドバンテスト | Probe apparatus and testing apparatus |
CN102043074A (en) * | 2009-10-14 | 2011-05-04 | 旺矽科技股份有限公司 | High-frequency probe card |
JP2013246153A (en) | 2012-05-29 | 2013-12-09 | Micronics Japan Co Ltd | Probe card |
KR20170105030A (en) * | 2014-12-30 | 2017-09-18 | 테크노프로브 에스.피.에이. | Semi-finished products including contact probes for a plurality of test heads and a method for manufacturing the same |
US11079406B2 (en) * | 2016-08-31 | 2021-08-03 | International Business Machines Corporation | Semiconductor micro probe array having compliance |
JP2019109103A (en) | 2017-12-18 | 2019-07-04 | 株式会社ヨコオ | Inspection jig |
-
2018
- 2018-05-16 IT IT102018000005444A patent/IT201800005444A1/en unknown
-
2019
- 2019-05-14 EP EP19725944.3A patent/EP3794357B1/en active Active
- 2019-05-14 SG SG11202011171TA patent/SG11202011171TA/en unknown
- 2019-05-14 JP JP2020564127A patent/JP7416725B2/en active Active
- 2019-05-14 KR KR1020207035869A patent/KR20210010895A/en active Search and Examination
- 2019-05-14 CN CN201980032464.1A patent/CN112119315B/en active Active
- 2019-05-14 WO PCT/EP2019/062276 patent/WO2019219638A1/en active Search and Examination
-
2020
- 2020-11-11 PH PH12020551950A patent/PH12020551950A1/en unknown
- 2020-11-13 US US17/098,179 patent/US11402428B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3794357A1 (en) | 2021-03-24 |
EP3794357B1 (en) | 2022-01-19 |
US11402428B2 (en) | 2022-08-02 |
IT201800005444A1 (en) | 2019-11-16 |
KR20210010895A (en) | 2021-01-28 |
TW201947231A (en) | 2019-12-16 |
WO2019219638A1 (en) | 2019-11-21 |
CN112119315A (en) | 2020-12-22 |
CN112119315B (en) | 2024-04-02 |
JP7416725B2 (en) | 2024-01-17 |
JP2021524029A (en) | 2021-09-09 |
PH12020551950A1 (en) | 2021-08-16 |
US20210063478A1 (en) | 2021-03-04 |
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