SG11202006060WA - Edge lock assembly for a stencil printer - Google Patents

Edge lock assembly for a stencil printer

Info

Publication number
SG11202006060WA
SG11202006060WA SG11202006060WA SG11202006060WA SG11202006060WA SG 11202006060W A SG11202006060W A SG 11202006060WA SG 11202006060W A SG11202006060W A SG 11202006060WA SG 11202006060W A SG11202006060W A SG 11202006060WA SG 11202006060W A SG11202006060W A SG 11202006060WA
Authority
SG
Singapore
Prior art keywords
lock assembly
stencil printer
edge lock
edge
stencil
Prior art date
Application number
SG11202006060WA
Inventor
Daniel Mariano
William A Losiewicz
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/860,093 external-priority patent/US10703089B2/en
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Publication of SG11202006060WA publication Critical patent/SG11202006060WA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0813—Machines for printing sheets with flat screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
SG11202006060WA 2018-01-02 2018-12-24 Edge lock assembly for a stencil printer SG11202006060WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/860,093 US10703089B2 (en) 2015-04-07 2018-01-02 Edge lock assembly for a stencil printer
PCT/US2018/067437 WO2019135959A1 (en) 2018-01-02 2018-12-24 Edge lock assembly for a stencil printer

Publications (1)

Publication Number Publication Date
SG11202006060WA true SG11202006060WA (en) 2020-07-29

Family

ID=65139211

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006060WA SG11202006060WA (en) 2018-01-02 2018-12-24 Edge lock assembly for a stencil printer

Country Status (7)

Country Link
EP (1) EP3735807B1 (en)
JP (1) JP7216733B2 (en)
KR (1) KR102581104B1 (en)
CN (1) CN111670612A (en)
SG (1) SG11202006060WA (en)
TW (1) TWI783104B (en)
WO (1) WO2019135959A1 (en)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT989517B (en) * 1971-12-10 1975-06-10 Produ Ag NETWORK PRINTING MACHINE
US4924304A (en) * 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
US5157438A (en) * 1992-02-04 1992-10-20 Dek Printing Machines Limited Workpiece support and clamping means
JPH0839761A (en) * 1994-07-28 1996-02-13 Nitto Boseki Co Ltd Method and apparatus for positioning printing of continuous sheet
JPH10119241A (en) * 1996-10-22 1998-05-12 Sony Corp Positioning apparatus of circuit substrate
US6607318B2 (en) * 1998-01-12 2003-08-19 Easyprint A/S Thermal printer
TW406629U (en) * 1999-09-03 2000-09-21 Tsai Ming Hung Structure of halftone making machine
DE60011664T2 (en) * 1999-11-08 2005-09-08 Speedline Technologies, Inc., Franklin METHOD AND DEVICE FOR MAINTAINING A PCB IN AN EXACT POSITION DURING PROCESSING
KR100364074B1 (en) * 2001-02-14 2002-12-11 주식회사 남영기계 Layering system for mult-layer printed circuit board
JP2003034012A (en) * 2001-07-23 2003-02-04 Hitachi Industries Co Ltd Cream solder printing apparatus
JP2004181574A (en) * 2002-12-03 2004-07-02 Minami Denshi Kogyo Kk Transfer device for board
US7293691B2 (en) * 2003-01-17 2007-11-13 Speedline Technologies, Inc. Electronic substrate printing
TWM261957U (en) * 2004-05-07 2005-04-11 Via Tech Inc Semi-automatic solder paste printer
US7121199B2 (en) * 2004-10-18 2006-10-17 Speedline Technologies, Inc. Method and apparatus for supporting and clamping a substrate
US20060105612A1 (en) * 2004-11-12 2006-05-18 Airline Hydraulics Corp. Printed circuit board clamp
JP4925746B2 (en) * 2005-12-25 2012-05-09 大関 ▲高▼志 Direct foil printing device
JP5091286B2 (en) * 2010-07-30 2012-12-05 富士機械製造株式会社 Screen printing machine
US9370923B1 (en) * 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
FR3051718A1 (en) * 2016-05-27 2017-12-01 Mgi Digital Tech DEVICE AND METHOD FOR MAINTAINING / TRANSPORTING SUBSTRATES IN A PRINTING MACHINE
CN107364223A (en) * 2017-08-07 2017-11-21 珠海市臻成网印机械有限公司 Mult-functional printing press

Also Published As

Publication number Publication date
TWI783104B (en) 2022-11-11
WO2019135959A1 (en) 2019-07-11
CN111670612A (en) 2020-09-15
JP2021509641A (en) 2021-04-01
EP3735807B1 (en) 2023-09-13
TW201934350A (en) 2019-09-01
JP7216733B2 (en) 2023-02-01
EP3735807A1 (en) 2020-11-11
KR20200105492A (en) 2020-09-07
KR102581104B1 (en) 2023-09-20

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