SG11202005465SA - Laser-releasable bonding materials for 3-d ic applications - Google Patents
Laser-releasable bonding materials for 3-d ic applicationsInfo
- Publication number
- SG11202005465SA SG11202005465SA SG11202005465SA SG11202005465SA SG11202005465SA SG 11202005465S A SG11202005465S A SG 11202005465SA SG 11202005465S A SG11202005465S A SG 11202005465SA SG 11202005465S A SG11202005465S A SG 11202005465SA SG 11202005465S A SG11202005465S A SG 11202005465SA
- Authority
- SG
- Singapore
- Prior art keywords
- laser
- applications
- bonding materials
- releasable bonding
- releasable
- Prior art date
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- B32B7/06—Interconnection of layers permitting easy separation
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- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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US201762609426P | 2017-12-22 | 2017-12-22 | |
PCT/US2018/067099 WO2019126648A1 (en) | 2017-12-22 | 2018-12-21 | Laser-releasable bonding materials for 3-d ic applications |
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CN (1) | CN111556807B (en) |
SG (1) | SG11202005465SA (en) |
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US10490525B1 (en) * | 2018-05-10 | 2019-11-26 | International Business Machines Corporation | High speed handling of ultra-small chips by selective laser bonding and debonding |
US11073572B2 (en) * | 2019-01-17 | 2021-07-27 | Infineon Technologies Ag | Current sensor device with a routable molded lead frame |
US11610801B2 (en) * | 2019-01-22 | 2023-03-21 | Brewer Science, Inc. | Laser-releasable bonding materials for 3-D IC applications |
CN110396404B (en) * | 2019-07-12 | 2022-06-17 | 新乡医学院 | Fluorescent molecular probe based on hydrazone derivative, preparation method thereof and application thereof in cation recognition |
EP4007799A4 (en) * | 2019-08-02 | 2023-09-06 | Brewer Science Inc. | Permanent bonding and patterning material |
KR20210087337A (en) | 2020-01-02 | 2021-07-12 | 삼성전자주식회사 | A semiconductor package, an electronic apparatus and a method of manufacturing the semiconductor package |
TW202219231A (en) * | 2020-08-14 | 2022-05-16 | 美商布魯爾科技公司 | Permanent bonding and patterning material |
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US5989700A (en) * | 1996-01-05 | 1999-11-23 | Tekscan Incorporated | Pressure sensitive ink means, and methods of use |
US7052597B2 (en) * | 2001-03-27 | 2006-05-30 | Exxonmobil Research And Engineering Company | Tuning fuel composition for driving cycle conditions in spark ignition engines |
ATE384150T1 (en) * | 2005-03-22 | 2008-02-15 | Ems Chemie Ag | THERMOPLASTIC FIBER MATERIAL SPUN FROM A RAW MATERIAL CONTAINING POLYHYDROXYETHER, METHOD FOR THE PRODUCTION THEREOF AND USES THEREOF |
KR101096142B1 (en) | 2008-01-24 | 2011-12-19 | 브레우어 사이언스 인코포레이션 | Method for reversibly mounting a device wafer to a carrier substrate |
CN101393400B (en) * | 2008-10-29 | 2011-12-14 | 清溢精密光电(深圳)有限公司 | Method for removing glue at surface of liquid light-sensitive resin letterpress |
US8859672B2 (en) * | 2011-06-27 | 2014-10-14 | Sabic Global Technologies B.V. | Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making |
US9827757B2 (en) | 2011-07-07 | 2017-11-28 | Brewer Science Inc. | Methods of transferring device wafers or layers between carrier substrates and other surfaces |
WO2013102146A1 (en) * | 2011-12-30 | 2013-07-04 | Deca Technologies, Inc. | Die up fully molded fan-out wafer level packaging |
US9127126B2 (en) | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
JP2015021082A (en) * | 2013-07-19 | 2015-02-02 | 日東電工株式会社 | Thermal peeling type adhesive tape for cutting-off electronic component and cutting-off method of electronic component |
US9865490B2 (en) * | 2014-01-07 | 2018-01-09 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
US9496164B2 (en) * | 2014-01-07 | 2016-11-15 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
US9827740B2 (en) | 2014-07-22 | 2017-11-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-D IC applications |
US9324601B1 (en) * | 2014-11-07 | 2016-04-26 | International Business Machines Corporation | Low temperature adhesive resins for wafer bonding |
US9850406B2 (en) * | 2014-11-07 | 2017-12-26 | International Business Machines Corporation | Adhesive resins for wafer bonding |
US10522383B2 (en) * | 2015-03-25 | 2019-12-31 | International Business Machines Corporation | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding |
JP7356902B2 (en) | 2016-07-15 | 2023-10-05 | ブルーワー サイエンス アイ エヌ シー. | Dielectric materials for laser ablation |
US10617010B2 (en) | 2016-08-29 | 2020-04-07 | Brewer Science, Inc. | Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices |
US10217637B1 (en) * | 2017-09-20 | 2019-02-26 | International Business Machines Corporation | Chip handling and electronic component integration |
JP2021502272A (en) * | 2017-11-08 | 2021-01-28 | サイテック インダストリーズ インコーポレイテッド | A method for producing a composite having interlayer strengthening particles and the composite thereof. |
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