SG11202003349PA - Multilayer electronic device having improved connectivity and method for making the same - Google Patents

Multilayer electronic device having improved connectivity and method for making the same

Info

Publication number
SG11202003349PA
SG11202003349PA SG11202003349PA SG11202003349PA SG11202003349PA SG 11202003349P A SG11202003349P A SG 11202003349PA SG 11202003349P A SG11202003349P A SG 11202003349PA SG 11202003349P A SG11202003349P A SG 11202003349PA SG 11202003349P A SG11202003349P A SG 11202003349PA
Authority
SG
Singapore
Prior art keywords
making
electronic device
same
multilayer electronic
improved connectivity
Prior art date
Application number
SG11202003349PA
Inventor
Marianne Berolini
Michael Kirk
Palaniappan Ravindranathan
Original Assignee
Avx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avx Corp filed Critical Avx Corp
Publication of SG11202003349PA publication Critical patent/SG11202003349PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
SG11202003349PA 2017-10-23 2018-10-22 Multilayer electronic device having improved connectivity and method for making the same SG11202003349PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762575626P 2017-10-23 2017-10-23
PCT/US2018/056891 WO2019083891A1 (en) 2017-10-23 2018-10-22 Multilayer electronic device having improved connectivity and method for making the same

Publications (1)

Publication Number Publication Date
SG11202003349PA true SG11202003349PA (en) 2020-05-28

Family

ID=66243236

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202003349PA SG11202003349PA (en) 2017-10-23 2018-10-22 Multilayer electronic device having improved connectivity and method for making the same

Country Status (12)

Country Link
US (1) US10840018B2 (en)
EP (1) EP3701555A4 (en)
JP (2) JP2021500752A (en)
KR (1) KR20200062354A (en)
CN (1) CN111433869A (en)
AU (1) AU2018355167A1 (en)
IL (1) IL273984B (en)
MX (1) MX2020007245A (en)
PH (1) PH12020550835A1 (en)
RU (1) RU2020115560A (en)
SG (1) SG11202003349PA (en)
WO (1) WO2019083891A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021089816A2 (en) * 2019-11-08 2021-05-14 Tdk Electronics Ag Varistor
KR20220037728A (en) * 2020-09-18 2022-03-25 삼성전기주식회사 Mutilayer electronic component
CN116529843A (en) * 2020-11-30 2023-08-01 京瓷Avx元器件公司 Multilayer ceramic capacitor

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JPH09260207A (en) * 1996-03-22 1997-10-03 Taiyo Yuden Co Ltd Manufacture of laminated capacitor
JPH09270360A (en) * 1996-03-29 1997-10-14 Hitachi Aic Inc Laminated ceramic capacitor
US5880925A (en) 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US6380619B2 (en) 1998-03-31 2002-04-30 Tdk Corporation Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate
JP2000195754A (en) * 1998-12-25 2000-07-14 Tdk Corp Laminated ceramic chip capacitor array and its manufacture
US7463474B2 (en) 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7177137B2 (en) 2002-04-15 2007-02-13 Avx Corporation Plated terminations
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KR100678496B1 (en) * 2002-09-10 2007-02-06 티디케이가부시기가이샤 Multilayer capacitor
JP2005285801A (en) * 2004-03-26 2005-10-13 Kyocera Corp Method of manufacturing stacked electronic component
KR100587006B1 (en) * 2004-12-23 2006-06-08 삼성전기주식회사 Multi-layer chip capacitor and method for manufacturing the same
US7329976B2 (en) * 2005-04-27 2008-02-12 Kyocera Corporation Laminated electronic component
US7414857B2 (en) 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
JP4385385B2 (en) 2006-12-14 2009-12-16 Ｔｄｋ株式会社 Multilayer capacitor
US20080165468A1 (en) * 2007-01-05 2008-07-10 Avx Corporation Very low profile multilayer components
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JP5062237B2 (en) 2009-11-05 2012-10-31 Ｔｄｋ株式会社 Multilayer capacitor, mounting structure thereof, and manufacturing method thereof
JP5532027B2 (en) 2010-09-28 2014-06-25 株式会社村田製作所 Multilayer ceramic electronic component and manufacturing method thereof
KR101153686B1 (en) * 2010-12-21 2012-06-18 삼성전기주식회사 Fabricating method for multi layer ceramic electronic device and multi layer ceramic electronic device using thereof
KR101843190B1 (en) * 2011-08-31 2018-03-28 삼성전기주식회사 Ceramic electronic component and method for manufacturing the same
JP2013089870A (en) * 2011-10-20 2013-05-13 Sony Corp Method for manufacturing electrostatic capacitor element
KR101872524B1 (en) * 2011-11-14 2018-06-28 삼성전기주식회사 Multi-Layered Ceramic Electronic Component and Manufacturing Method of the Same
KR101971912B1 (en) * 2012-03-05 2019-04-25 삼성전기주식회사 Multi-Layered Ceramic Electronic Component and Manufacturing Method of the Same
KR101452070B1 (en) * 2012-12-20 2014-10-16 삼성전기주식회사 Multi-layered ceramic capacitor and method of manufacturing the same
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KR102004781B1 (en) 2014-01-27 2019-07-29 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same

Also Published As

Publication number Publication date
PH12020550835A1 (en) 2021-05-10
MX2020007245A (en) 2020-12-07
US10840018B2 (en) 2020-11-17
KR20200062354A (en) 2020-06-03
IL273984A (en) 2020-05-31
EP3701555A4 (en) 2022-01-19
WO2019083891A1 (en) 2019-05-02
JP2021500752A (en) 2021-01-07
JP2023110018A (en) 2023-08-08
EP3701555A1 (en) 2020-09-02
CN111433869A (en) 2020-07-17
RU2020115560A (en) 2021-11-25
IL273984B (en) 2021-08-31
US20190131067A1 (en) 2019-05-02
AU2018355167A1 (en) 2020-05-07

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