SG11202002725UA - Modular print head assembly for plasma jet printing - Google Patents

Modular print head assembly for plasma jet printing

Info

Publication number
SG11202002725UA
SG11202002725UA SG11202002725UA SG11202002725UA SG11202002725UA SG 11202002725U A SG11202002725U A SG 11202002725UA SG 11202002725U A SG11202002725U A SG 11202002725UA SG 11202002725U A SG11202002725U A SG 11202002725UA SG 11202002725U A SG11202002725U A SG 11202002725UA
Authority
SG
Singapore
Prior art keywords
print head
head assembly
jet printing
plasma jet
modular print
Prior art date
Application number
SG11202002725UA
Other languages
English (en)
Inventor
Ramprasad Gandhiraman
Fergal John O'moore
Lief Niklas Dennis Nordlund
Arlene Lynette Lopez
Original Assignee
Space Foundry Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Space Foundry Inc filed Critical Space Foundry Inc
Publication of SG11202002725UA publication Critical patent/SG11202002725UA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205Means for applying layers
    • B29C64/209Heads; Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2425Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being flush with the dielectric
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • H05H1/246Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using external electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • H05H1/2465Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated by inductive coupling, e.g. using coiled electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/22Direct deposition of molten metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50Means for feeding of material, e.g. heads
    • B22F12/53Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/70Gas flow means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348Dielectric barrier discharge
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fluid Mechanics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
SG11202002725UA 2017-10-01 2018-10-01 Modular print head assembly for plasma jet printing SG11202002725UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762566488P 2017-10-01 2017-10-01
US201862626171P 2018-02-05 2018-02-05
PCT/US2018/053703 WO2019068070A1 (en) 2017-10-01 2018-10-01 MODULAR PRINT HEAD ASSEMBLY FOR PLASMA JET PRINTING

Publications (1)

Publication Number Publication Date
SG11202002725UA true SG11202002725UA (en) 2020-04-29

Family

ID=65903309

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202002725UA SG11202002725UA (en) 2017-10-01 2018-10-01 Modular print head assembly for plasma jet printing

Country Status (6)

Country Link
US (3) US20200258717A1 (de)
EP (1) EP3692563A4 (de)
JP (1) JP2021501710A (de)
CA (1) CA3076753A1 (de)
SG (1) SG11202002725UA (de)
WO (1) WO2019068070A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110621476B (zh) * 2017-02-24 2022-04-12 埃森提姆公司 将电磁能施加于3d打印部件的大气等离子体传导通路
CN110636933B (zh) 2017-05-19 2022-03-22 埃森提姆公司 三维打印设备
CA3076753A1 (en) 2017-10-01 2019-04-04 Space Foundry Inc. Modular print head assembly for plasma jet printing
WO2020122859A1 (en) * 2018-12-10 2020-06-18 Hewlett-Packard Development Company, L.P. Patterning for selective ejections of printable ammonium-based chalcogenometalate fluids
US11993011B1 (en) * 2020-02-03 2024-05-28 National Technology & Engineering Solutions Of Sandia, Llc Plasma micronozzle adapter
GB202007023D0 (en) * 2020-05-13 2020-06-24 Univ Of Lancaster Plasma device
US11731366B2 (en) 2020-07-31 2023-08-22 Xerox Corporation Method and system for operating a metal drop ejecting three-dimensional (3D) object printer to form electrical circuits on substrates
FR3114476A1 (fr) * 2020-09-23 2022-03-25 Centre National De La Recherche Scientifique Dispositif d’excitation pour transformer un gaz en plasma dans un tube capillaire diélectrique et accélérateur laser-plasma.
CN117083416A (zh) * 2021-01-29 2023-11-17 米德耐克斯股份公司 将金属涂层施加到表面上的方法和装置
US11872751B2 (en) 2021-09-27 2024-01-16 Xerox Corporation Printer jetting mechanism and printer employing the printer jetting mechanism
US11806783B2 (en) 2021-09-27 2023-11-07 Xerox Corporation Method of jetting print material and method of printing
US20230098918A1 (en) * 2021-09-27 2023-03-30 Palo Alto Research Center Incorporated Printer jetting mechanism and printer employing the printer jetting mechanism
US11919226B2 (en) 2021-09-27 2024-03-05 Xerox Corporation Method of jetting print material and method of printing
US11794241B2 (en) 2021-09-27 2023-10-24 Xerox Corporation Method of jetting print material and method of printing

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179782A (en) 1962-02-07 1965-04-20 Matvay Leo Plasma flame jet spray gun with a controlled arc region
US3450926A (en) 1966-10-10 1969-06-17 Air Reduction Plasma torch
US3639831A (en) 1968-11-12 1972-02-01 Autometrics Co Method and apparatus for producing a directable current-conducting gas jet for use in a method for inspecting and measuring nonconductive film coatings on conductive substrates
US3756511A (en) 1971-02-02 1973-09-04 Kogyo Kaihatsu Kenyusho Nozzle and torch for plasma jet
US3958883A (en) 1974-07-10 1976-05-25 Baird-Atomic, Inc. Radio frequency induced plasma excitation of optical emission spectroscopic samples
US5066125A (en) 1987-03-06 1991-11-19 Geochemical Services, Inc. Electrothermal direct injection torch for inductively coupled plasma
US4916273A (en) 1987-03-11 1990-04-10 Browning James A High-velocity controlled-temperature plasma spray method
US4990740A (en) 1989-03-06 1991-02-05 The Dow Chemical Company Intra-microspray ICP torch
US5204144A (en) 1991-05-10 1993-04-20 Celestech, Inc. Method for plasma deposition on apertured substrates
JP2852838B2 (ja) 1992-09-10 1999-02-03 セイコーインスツルメンツ株式会社 誘導結合プラズマ質量分析装置
DE19601586C1 (de) * 1996-01-18 1997-07-10 Roland Man Druckmasch Verfahren zum Bebildern einer ferroelektrischen Druckform und Druckkopf
US6194036B1 (en) 1997-10-20 2001-02-27 The Regents Of The University Of California Deposition of coatings using an atmospheric pressure plasma jet
JPH11285882A (ja) 1998-03-31 1999-10-19 Amada Co Ltd 制御機能付二重構造ノズル
DE29919142U1 (de) 1999-10-30 2001-03-08 Agrodyn Hochspannungstechnik G Plasmadüse
KR100436297B1 (ko) 2000-03-14 2004-06-18 주성엔지니어링(주) 반도체 소자 제조용 플라즈마 스프레이 장치 및 이를이용한 반도체 소자 제조방법
JP3902380B2 (ja) 2000-05-19 2007-04-04 エスアイアイ・ナノテクノロジー株式会社 Icp分析装置
US6652069B2 (en) * 2000-11-22 2003-11-25 Konica Corporation Method of surface treatment, device of surface treatment, and head for use in ink jet printer
US7591957B2 (en) 2001-01-30 2009-09-22 Rapt Industries, Inc. Method for atmospheric pressure reactive atom plasma processing for surface modification
AUPR292301A0 (en) 2001-02-06 2001-03-01 Silverbrook Research Pty. Ltd. A method and apparatus (ART99)
US6685803B2 (en) * 2001-06-22 2004-02-03 Applied Materials, Inc. Plasma treatment of processing gases
US7479630B2 (en) 2004-03-25 2009-01-20 Bandura Dmitry R Method and apparatus for flow cytometry linked with elemental analysis
US6660177B2 (en) 2001-11-07 2003-12-09 Rapt Industries Inc. Apparatus and method for reactive atom plasma processing for material deposition
US7180005B2 (en) 2002-05-17 2007-02-20 Nec Corporation Printed wiring board
US7511246B2 (en) 2002-12-12 2009-03-31 Perkinelmer Las Inc. Induction device for generating a plasma
US20040173316A1 (en) 2003-03-07 2004-09-09 Carr Jeffrey W. Apparatus and method using a microwave source for reactive atom plasma processing
US7446335B2 (en) 2004-06-18 2008-11-04 Regents Of The University Of Minnesota Process and apparatus for forming nanoparticles using radiofrequency plasmas
JP4398330B2 (ja) * 2004-09-02 2010-01-13 株式会社イー・スクエア プラズマ表面処理装置
US20060054279A1 (en) * 2004-09-10 2006-03-16 Yunsang Kim Apparatus for the optimization of atmospheric plasma in a processing system
US8143326B2 (en) * 2004-09-28 2012-03-27 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
US7573202B2 (en) * 2004-10-04 2009-08-11 The Board Of Trustees Of The University Of Illinois Metal/dielectric multilayer microdischarge devices and arrays
EP1797579B1 (de) * 2004-10-04 2015-09-02 The Board Of Trustees Of The University Of Illinois Mikroentladegeräte mit eingeschlossenen elektroden und herstellungsverfahren dafür
KR101428679B1 (ko) 2006-07-31 2014-08-08 테크나 플라즈마 시스템 인코포레이티드 유전체 장벽 방전을 이용하는 플라즈마 표면 처리
US20080179286A1 (en) * 2007-01-29 2008-07-31 Igor Murokh Dielectric plasma chamber apparatus and method with exterior electrodes
US20110298376A1 (en) * 2009-01-13 2011-12-08 River Bell Co. Apparatus And Method For Producing Plasma
US7952709B2 (en) 2009-03-06 2011-05-31 Scp Science Spectrochemical plasma torch and method of manufacture
US8253058B2 (en) 2009-03-19 2012-08-28 Integrated Photovoltaics, Incorporated Hybrid nozzle for plasma spraying silicon
CN203409418U (zh) 2010-05-05 2014-01-29 珀金埃尔默健康科学股份有限公司 感应装置和使用感应装置的低流动等离子体
GB2489493B (en) 2011-03-31 2013-03-13 Norsk Titanium Components As Method and arrangement for building metallic objects by solid freeform fabrication
DE102011076830A1 (de) 2011-05-31 2012-12-06 Innovent E.V. Verfahren und Vorrichtung zum Beschichten eines Floatglasbandes
JP5764433B2 (ja) * 2011-08-26 2015-08-19 株式会社日立ハイテクノロジーズ 質量分析装置及び質量分析方法
CN103094038B (zh) 2011-10-27 2017-01-11 松下知识产权经营株式会社 等离子体处理装置以及等离子体处理方法
JP5510437B2 (ja) 2011-12-07 2014-06-04 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
DE102012206081A1 (de) 2012-04-13 2013-10-17 Krones Ag Beschichtung von Behältern mit Plasmadüsen
GB201209693D0 (en) 2012-05-31 2012-07-18 Dow Corning Silicon wafer coated with a passivation layer
US9023259B2 (en) 2012-11-13 2015-05-05 Amastan Technologies Llc Method for the densification and spheroidization of solid and solution precursor droplets of materials using microwave generated plasma processing
JP2015060672A (ja) * 2013-09-17 2015-03-30 株式会社リコー 改質装置、画像形成装置、画像形成システム、及び印刷物の製造方法
ITPD20130310A1 (it) * 2013-11-14 2015-05-15 Nadir S R L Metodo per la generazione di un getto o jet di plasma atmosferico e dispositivo minitorcia al plasma atmosferico
US20160325487A1 (en) 2014-02-24 2016-11-10 Empire Technology Development Llc Increased interlayer adhesion of three-dimensional printed articles
US9433071B2 (en) * 2014-06-13 2016-08-30 Plasma Innovations, LLC Dielectric barrier discharge plasma generator
WO2016154103A1 (en) 2015-03-20 2016-09-29 EP Technologies LLC 3d printers having plasma applicators and method of using same
US20160329192A1 (en) * 2015-05-05 2016-11-10 Eastman Kodak Company Radial-flow plasma treatment system
US11241833B2 (en) 2016-03-09 2022-02-08 Universities Space Research Association 3D printed electronics using directional plasma jet
US10995406B2 (en) 2016-04-01 2021-05-04 Universities Space Research Association In situ tailoring of material properties in 3D printed electronics
US20180006223A1 (en) 2016-05-31 2018-01-04 Universities Space Research Association Method to print organic electronics without changing its properties
US10086622B2 (en) 2016-07-14 2018-10-02 Integrated Deposition Solutions, Inc. Apparatuses and methods for stable aerosol-based printing using an internal pneumatic shutter
CA3076753A1 (en) 2017-10-01 2019-04-04 Space Foundry Inc. Modular print head assembly for plasma jet printing

Also Published As

Publication number Publication date
JP2021501710A (ja) 2021-01-21
US10991548B2 (en) 2021-04-27
US20200335303A1 (en) 2020-10-22
WO2019068070A1 (en) 2019-04-04
CA3076753A1 (en) 2019-04-04
US20200258717A1 (en) 2020-08-13
EP3692563A1 (de) 2020-08-12
US20210358714A1 (en) 2021-11-18
EP3692563A4 (de) 2021-07-07

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