SG11202002226QA - Semiconductor element mounting structure, and combination of semiconductor element and substrate - Google Patents

Semiconductor element mounting structure, and combination of semiconductor element and substrate

Info

Publication number
SG11202002226QA
SG11202002226QA SG11202002226QA SG11202002226QA SG11202002226QA SG 11202002226Q A SG11202002226Q A SG 11202002226QA SG 11202002226Q A SG11202002226Q A SG 11202002226QA SG 11202002226Q A SG11202002226Q A SG 11202002226QA SG 11202002226Q A SG11202002226Q A SG 11202002226QA
Authority
SG
Singapore
Prior art keywords
semiconductor element
substrate
combination
mounting structure
element mounting
Prior art date
Application number
SG11202002226QA
Inventor
Hitoshi Onozeki
Shizu Fukuzumi
Naoya Suzuki
Toshihisa Nonaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11202002226QA publication Critical patent/SG11202002226QA/en

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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SG11202002226QA 2017-09-15 2018-09-14 Semiconductor element mounting structure, and combination of semiconductor element and substrate SG11202002226QA (en)

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US11444054B2 (en) 2022-09-13
TW201933561A (en) 2019-08-16

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