SG11202001659PA - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
SG11202001659PA
SG11202001659PA SG11202001659PA SG11202001659PA SG11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA
Authority
SG
Singapore
Prior art keywords
plating apparatus
plating
Prior art date
Application number
SG11202001659PA
Other languages
English (en)
Inventor
Zhaowei Jia
Hongchao Yang
Chenhua Lu
Jian Wang
Hui Wang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11202001659PA publication Critical patent/SG11202001659PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
SG11202001659PA 2017-08-30 2017-08-30 Plating apparatus SG11202001659PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/099572 WO2019041154A1 (en) 2017-08-30 2017-08-30 METALLIZATION APPARATUS

Publications (1)

Publication Number Publication Date
SG11202001659PA true SG11202001659PA (en) 2020-03-30

Family

ID=65524711

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202001659PA SG11202001659PA (en) 2017-08-30 2017-08-30 Plating apparatus

Country Status (6)

Country Link
US (1) US11859303B2 (ja)
JP (1) JP6999195B2 (ja)
KR (1) KR102420759B1 (ja)
CN (1) CN111032923B (ja)
SG (1) SG11202001659PA (ja)
WO (1) WO2019041154A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112410851A (zh) * 2019-08-23 2021-02-26 盛美半导体设备(上海)股份有限公司 阴极腔
CN111560638B (zh) * 2020-07-06 2021-06-29 苏州清飙科技有限公司 晶圆电镀设备
WO2022102119A1 (ja) * 2020-11-16 2022-05-19 株式会社荏原製作所 プレート、めっき装置、及びプレートの製造方法
CN114645311A (zh) * 2020-12-18 2022-06-21 盛美半导体设备(上海)股份有限公司 基板保持装置的杯形夹盘及基板保持装置
CN113151881A (zh) * 2021-04-27 2021-07-23 中国工程物理研究院核物理与化学研究所 一种适用于小面积放射源制备的电镀装置
WO2023073860A1 (ja) * 2021-10-28 2023-05-04 株式会社荏原製作所 めっき装置
CN116265621A (zh) * 2021-12-17 2023-06-20 盛美半导体设备(上海)股份有限公司 清洗电镀装置的方法
CN116926649A (zh) * 2022-03-31 2023-10-24 盛美半导体设备(上海)股份有限公司 电镀设备
CN115142104B (zh) * 2022-07-28 2024-04-26 福州一策仪器有限公司 电镀装置、多通道电镀装置组和电镀反应系统
CN115896904B (zh) * 2023-03-09 2023-05-30 苏州智程半导体科技股份有限公司 一种晶圆电镀腔室结构

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3112119B2 (ja) * 1992-04-30 2000-11-27 沖電気工業株式会社 半導体ウエハのメッキ装置
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
EP1174912A4 (en) * 1999-12-24 2009-11-25 Ebara Corp SEMICONDUCTOR DISC GENERATING APPARATUS AND MANUFACTURING METHOD
JP3980809B2 (ja) * 2000-05-01 2007-09-26 株式会社荏原製作所 電解処理装置
JP2001234394A (ja) * 2000-02-28 2001-08-31 Tokyo Electron Ltd ウェハーめっき装置
KR100804714B1 (ko) 2000-03-17 2008-02-18 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 방법
US6517698B1 (en) * 2000-10-06 2003-02-11 Motorola, Inc. System and method for providing rotation to plating flow
EP1563119A4 (en) * 2001-08-31 2006-03-22 Semitool Inc APPARATUS AND METHOD FOR DISPERSING AN ELECTROPHORETIC EMULSION
TWI274393B (en) * 2002-04-08 2007-02-21 Acm Res Inc Electropolishing and/or electroplating apparatus and methods
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
JP4448133B2 (ja) * 2003-07-08 2010-04-07 アプライド マテリアルズ インコーポレイテッド 電気化学処理セル
WO2009055992A1 (en) * 2007-11-02 2009-05-07 Acm Research (Shanghai) Inc. Plating apparatus for metallization on semiconductor workpiece
CN101457379B (zh) * 2007-12-14 2012-05-30 盛美半导体设备（上海）有限公司 在半导体工件上电镀金属的电镀装置
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
KR20120011939A (ko) * 2010-07-28 2012-02-09 주식회사 케이씨텍 기판 도금 장치
US8496789B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
WO2015002942A1 (en) * 2013-07-03 2015-01-08 Tel Nexx, Inc. Electrochemical deposition apparatus and methods for controlling the chemistry therein
US9677190B2 (en) * 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9816194B2 (en) * 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US9765443B2 (en) * 2015-09-02 2017-09-19 Applied Materials, Inc. Electroplating processor with current thief electrode
US9920448B2 (en) 2015-11-18 2018-03-20 Applied Materials, Inc. Inert anode electroplating processor and replenisher with anionic membranes

Also Published As

Publication number Publication date
US20200354851A1 (en) 2020-11-12
KR20200045510A (ko) 2020-05-04
CN111032923A (zh) 2020-04-17
WO2019041154A1 (en) 2019-03-07
KR102420759B1 (ko) 2022-07-14
JP2020531696A (ja) 2020-11-05
CN111032923B (zh) 2021-12-28
US11859303B2 (en) 2024-01-02
JP6999195B2 (ja) 2022-01-18

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