SG11202000374WA - Scanning alignment device and scanning method therefor - Google Patents

Scanning alignment device and scanning method therefor

Info

Publication number
SG11202000374WA
SG11202000374WA SG11202000374WA SG11202000374WA SG11202000374WA SG 11202000374W A SG11202000374W A SG 11202000374WA SG 11202000374W A SG11202000374W A SG 11202000374WA SG 11202000374W A SG11202000374W A SG 11202000374WA SG 11202000374W A SG11202000374W A SG 11202000374WA
Authority
SG
Singapore
Prior art keywords
scanning
alignment device
method therefor
scanning method
scanning alignment
Prior art date
Application number
SG11202000374WA
Inventor
Dawei Yu
Shihua Wang
Dongliang Huang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11202000374WA publication Critical patent/SG11202000374WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/76—Apparatus for connecting with build-up interconnects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/767—Means for aligning
    • H01L2224/76701—Means for aligning in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/767—Means for aligning
    • H01L2224/76702—Means for aligning in the upper part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/767—Means for aligning
    • H01L2224/76753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
SG11202000374WA 2017-07-17 2018-07-17 Scanning alignment device and scanning method therefor SG11202000374WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710582793.6A CN109273380B (en) 2017-07-17 2017-07-17 Scanning alignment device and scanning method thereof
PCT/CN2018/095896 WO2019015558A1 (en) 2017-07-17 2018-07-17 Scanning alignment device and scanning method therefor

Publications (1)

Publication Number Publication Date
SG11202000374WA true SG11202000374WA (en) 2020-02-27

Family

ID=65015001

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202000374WA SG11202000374WA (en) 2017-07-17 2018-07-17 Scanning alignment device and scanning method therefor

Country Status (7)

Country Link
US (1) US20200168490A1 (en)
JP (1) JP7166329B2 (en)
KR (1) KR102451218B1 (en)
CN (1) CN109273380B (en)
SG (1) SG11202000374WA (en)
TW (1) TWI712869B (en)
WO (1) WO2019015558A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112735993B (en) * 2021-04-01 2022-01-18 中山德华芯片技术有限公司 Wafer surface temperature detector and application thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2526546B2 (en) * 1986-04-21 1996-08-21 日本電気株式会社 Alignment device
US5852497A (en) * 1997-08-28 1998-12-22 Vlsi Technology, Inc. Method and apparatus for detecting edges under an opaque layer
KR100307630B1 (en) * 1998-12-30 2001-09-28 윤종용 Alignment Mark, Alignment System and Alignment Method Using the Same
KR100333554B1 (en) * 1999-10-18 2002-04-22 윤종용 Method for managing IP address of ITM board using master board in PBX system
CN1139845C (en) * 2001-07-26 2004-02-25 清华大学 Alignment method and apparatus for array type optical probe scanning IC photoetching system
EP2204697A3 (en) * 2002-09-20 2012-04-18 ASML Netherlands B.V. Marker structure, lithographic projection apparatus, method for substrate alignment using such a structure, and substrate comprising such marker structure
JP2004165218A (en) * 2002-11-08 2004-06-10 Canon Inc Aligner
WO2004090505A2 (en) * 2003-04-04 2004-10-21 Vp Holding, Llc Method and apparatus for enhanced nano-spectroscopic scanning
US7158208B2 (en) 2004-06-30 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
GB0601287D0 (en) 2006-01-23 2006-03-01 Ocuity Ltd Printed image display apparatus
JP2008177342A (en) 2007-01-18 2008-07-31 Nikon Corp Imaging device, alignment method, and alignment device
US7714996B2 (en) * 2007-01-23 2010-05-11 3i Systems Corporation Automatic inspection system for flat panel substrate
EP2151717A1 (en) * 2008-08-05 2010-02-10 ASML Holding N.V. Full wafer width scanning using step and scan system
WO2010063830A1 (en) * 2008-12-05 2010-06-10 Micronic Laser Systems Ab Rotating arm for writing or reading an image on a workpiece
CN102455600B (en) 2010-10-18 2014-07-23 中芯国际集成电路制造(上海)有限公司 Wafer surface morphology detection method
CN103676487B (en) * 2012-09-07 2016-02-03 上海微电子装备有限公司 A kind of workpiece height measurement mechanism and bearing calibration thereof
CN105527795B (en) * 2014-09-28 2018-09-18 上海微电子装备（集团）股份有限公司 Exposure device and defocus tilt error compensation method
JP6090607B2 (en) * 2014-12-08 2017-03-08 横河電機株式会社 Confocal scanner, confocal microscope
CN106290390B (en) * 2015-05-24 2019-11-26 上海微电子装备（集团）股份有限公司 Defect detecting device and method
CN106569390B (en) * 2015-10-08 2019-01-18 上海微电子装备（集团）股份有限公司 A kind of projection aligner and method

Also Published As

Publication number Publication date
JP2020526937A (en) 2020-08-31
WO2019015558A1 (en) 2019-01-24
TW201908886A (en) 2019-03-01
JP7166329B2 (en) 2022-11-07
CN109273380A (en) 2019-01-25
US20200168490A1 (en) 2020-05-28
KR20200019753A (en) 2020-02-24
TWI712869B (en) 2020-12-11
CN109273380B (en) 2022-02-15
KR102451218B1 (en) 2022-10-06

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