SG11202010479PA - Alignment device and alignment method - Google Patents

Alignment device and alignment method

Info

Publication number
SG11202010479PA
SG11202010479PA SG11202010479PA SG11202010479PA SG11202010479PA SG 11202010479P A SG11202010479P A SG 11202010479PA SG 11202010479P A SG11202010479P A SG 11202010479PA SG 11202010479P A SG11202010479P A SG 11202010479PA SG 11202010479P A SG11202010479P A SG 11202010479PA
Authority
SG
Singapore
Prior art keywords
alignment
alignment device
alignment method
Prior art date
Application number
SG11202010479PA
Inventor
Karl Heinz Priewasser
Yoshiyuki Harioka
Ken Ikehata
Yoshinori Kakinuma
Yosuke Ishimatsu
Ryouta Sawayama
Original Assignee
Disco Hi Tec Europe Gmbh
Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Hi Tec Europe Gmbh, Takatori Corp filed Critical Disco Hi Tec Europe Gmbh
Publication of SG11202010479PA publication Critical patent/SG11202010479PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vehicle Body Suspensions (AREA)
  • Radiation-Therapy Devices (AREA)
  • Eye Examination Apparatus (AREA)
SG11202010479PA 2018-04-24 2018-04-24 Alignment device and alignment method SG11202010479PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/016542 WO2019207633A1 (en) 2018-04-24 2018-04-24 Alignment device and alignment method

Publications (1)

Publication Number Publication Date
SG11202010479PA true SG11202010479PA (en) 2020-11-27

Family

ID=68294456

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010479PA SG11202010479PA (en) 2018-04-24 2018-04-24 Alignment device and alignment method

Country Status (8)

Country Link
US (1) US20210249294A1 (en)
JP (1) JP7298851B2 (en)
KR (1) KR102555605B1 (en)
CN (1) CN112020769A (en)
DE (1) DE112018007512T5 (en)
SG (1) SG11202010479PA (en)
TW (1) TWI818978B (en)
WO (1) WO2019207633A1 (en)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154585A (en) * 1997-08-01 1999-02-26 Hitachi Ltd Article identification system
CN1260800C (en) * 2001-09-19 2006-06-21 奥林巴斯光学工业株式会社 Semiconductor wafer inspection apparatus
JP4256115B2 (en) * 2002-05-28 2009-04-22 富士通マイクロエレクトロニクス株式会社 Mark recognition method and semiconductor device manufacturing method
US7053393B2 (en) * 2002-06-04 2006-05-30 Olympus Corporation Alignment apparatus for object on stage
JP2006007363A (en) 2004-06-25 2006-01-12 Mori Seiki Co Ltd Nc program correcting device and nc program generating device including it
JP2006073603A (en) 2004-08-31 2006-03-16 Takatori Corp Alignment method of wafer
JP4885483B2 (en) * 2005-06-06 2012-02-29 リンテック株式会社 Transfer device and method, peeling device and method, sticking device and method
JP2009010054A (en) * 2007-06-26 2009-01-15 Yamaha Corp Reader for identification mark, and reading method for identification mark
JP4693817B2 (en) * 2007-07-02 2011-06-01 日東電工株式会社 Adhesive tape affixing method to semiconductor wafer and protective tape peeling method
DE102009032210B4 (en) * 2009-07-03 2011-06-09 Kleo Ag processing plant
EP2339331A1 (en) * 2009-12-23 2011-06-29 Nanda Technologies GmbH Inspection and positioning systems and methods
JP5737647B2 (en) * 2010-06-30 2015-06-17 Ｎｌｔテクノロジー株式会社 Optical sheet laminating method
JP5589045B2 (en) * 2012-10-23 2014-09-10 日東電工株式会社 Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
CN104756243B (en) * 2012-10-29 2018-02-13 日商乐华股份有限公司 The position detecting device and method for detecting position of Semiconductor substrate
WO2014068763A1 (en) 2012-11-02 2014-05-08 富士機械製造株式会社 System for measuring inner diameter of expand ring of die supply apparatus, and system for avoiding thrust operation interference
JP2014204033A (en) * 2013-04-08 2014-10-27 日東電工株式会社 Semiconductor device manufacturing method
JP2014229790A (en) * 2013-05-23 2014-12-08 日東電工株式会社 Encapsulation sheet pasting method
JP6215730B2 (en) 2014-02-26 2017-10-18 株式会社ディスコ Wafer center detection method in processing equipment
JP6393583B2 (en) 2014-10-30 2018-09-19 株式会社ディスコ Protective film detection apparatus and protective film detection method
US9905453B2 (en) * 2014-12-29 2018-02-27 Disco Corporation Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing method
JP6207671B1 (en) * 2016-06-01 2017-10-04 キヤノン株式会社 Pattern forming apparatus, substrate arranging method, and article manufacturing method
JP6688695B2 (en) * 2016-06-24 2020-04-28 株式会社ディスコ Protective film coating device and protective film coating method
WO2019207634A1 (en) * 2018-04-24 2019-10-31 ディスコ ハイテック ヨーロッパ ゲーエムベーハー Device and method for attaching protective tape to semiconductor wafer
JP2023032491A (en) * 2021-08-27 2023-03-09 キオクシア株式会社 Substrate processing device and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP7298851B2 (en) 2023-06-27
DE112018007512T5 (en) 2021-03-11
TWI818978B (en) 2023-10-21
JPWO2019207633A1 (en) 2021-04-22
KR102555605B1 (en) 2023-07-18
US20210249294A1 (en) 2021-08-12
CN112020769A (en) 2020-12-01
TW201946200A (en) 2019-12-01
WO2019207633A1 (en) 2019-10-31
KR20210003140A (en) 2021-01-11

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