SG11201910935YA - Surface mount multilayer coupling capacitor and circuit board containing the same - Google Patents

Surface mount multilayer coupling capacitor and circuit board containing the same

Info

Publication number
SG11201910935YA
SG11201910935YA SG11201910935YA SG11201910935YA SG11201910935YA SG 11201910935Y A SG11201910935Y A SG 11201910935YA SG 11201910935Y A SG11201910935Y A SG 11201910935YA SG 11201910935Y A SG11201910935Y A SG 11201910935YA SG 11201910935Y A SG11201910935Y A SG 11201910935YA
Authority
SG
Singapore
Prior art keywords
circuit board
same
coupling capacitor
multilayer coupling
mount multilayer
Prior art date
Application number
SG11201910935YA
Inventor
Jeffrey Cain
Original Assignee
Avx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201762526744P priority Critical
Application filed by Avx Corp filed Critical Avx Corp
Priority to PCT/US2018/039037 priority patent/WO2019005616A1/en
Publication of SG11201910935YA publication Critical patent/SG11201910935YA/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10378Interposers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10522Adjacent components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10734Ball grid array [BGA]; Bump grid array
SG11201910935YA 2017-06-29 2018-06-22 Surface mount multilayer coupling capacitor and circuit board containing the same SG11201910935YA (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US201762526744P true 2017-06-29 2017-06-29
PCT/US2018/039037 WO2019005616A1 (en) 2017-06-29 2018-06-22 Surface mount multilayer coupling capacitor and circuit board containing the same

Publications (1)

Publication Number Publication Date
SG11201910935YA true SG11201910935YA (en) 2020-01-30

Family

ID=64738325

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201910935YA SG11201910935YA (en) 2017-06-29 2018-06-22 Surface mount multilayer coupling capacitor and circuit board containing the same

Country Status (8)

Country Link
US (1) US10672563B2 (en)
EP (1) EP3646356A1 (en)
JP (1) JP2020526041A (en)
KR (1) KR20200014358A (en)
CN (1) CN110800076A (en)
IL (1) IL271711D0 (en)
SG (1) SG11201910935YA (en)
WO (1) WO2019005616A1 (en)

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880925A (en) 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
JP3489728B2 (en) 1999-10-18 2004-01-26 株式会社村田製作所 Multilayer capacitors, wiring boards and high frequency circuits
US6292351B1 (en) * 1999-11-17 2001-09-18 Tdk Corporation Multilayer ceramic capacitor for three-dimensional mounting
US6757152B2 (en) 2001-09-05 2004-06-29 Avx Corporation Cascade capacitor
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7177137B2 (en) 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US7463474B2 (en) 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US6816356B2 (en) * 2002-05-17 2004-11-09 Daniel Devoe Integrated broadband ceramic capacitor array
US6898070B2 (en) * 2002-12-19 2005-05-24 Avx Corporation Transmission line capacitor
US20040125580A1 (en) 2002-12-31 2004-07-01 Intel Corporation Mounting capacitors under ball grid array
US7317622B2 (en) * 2002-12-31 2008-01-08 Intel Corporation Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt
JP3988651B2 (en) * 2003-01-31 2007-10-10 株式会社村田製作所 Multilayer capacitors, wiring boards, decoupling circuits, and high-frequency circuits
US6950300B2 (en) 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7292429B2 (en) 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
JP2007220751A (en) * 2006-02-14 2007-08-30 Tdk Corp Ceramic capacitor and mounting structure thereof
JP4896642B2 (en) 2006-09-12 2012-03-14 Tdk株式会社 Multilayer capacitors and electronic devices
US7545623B2 (en) * 2006-11-27 2009-06-09 Kemet Electronics Corporation Interposer decoupling array having reduced electrical shorts
US7633739B2 (en) 2007-05-24 2009-12-15 Daniel Devoe Stacked multilayer capacitor
JP2009194096A (en) * 2008-02-13 2009-08-27 Murata Mfg Co Ltd Component built-in substrate and component package using the same
JP4957737B2 (en) * 2008-05-14 2012-06-20 株式会社村田製作所 Ceramic electronic component, method for manufacturing the same, and assembly component
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US8456791B2 (en) * 2009-10-02 2013-06-04 Transtector Systems, Inc. RF coaxial surge protectors with non-linear protection devices
US8267718B2 (en) * 2010-04-07 2012-09-18 Panduit Corp. High data rate electrical connector and cable assembly
US9263186B2 (en) * 2013-03-05 2016-02-16 Qualcomm Incorporated DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
KR20140038871A (en) 2013-07-11 2014-03-31 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
US9627142B2 (en) 2013-09-24 2017-04-18 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board for mounting of the same
US9330849B2 (en) 2014-02-21 2016-05-03 Apple Inc. Non-uniform dielectric layer capacitor for vibration and acoustics improvement
KR20140039016A (en) * 2014-02-27 2014-03-31 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
US20150294791A1 (en) 2014-04-14 2015-10-15 Qualcomm Incorporated Ceramic interposer capacitor
KR101630040B1 (en) * 2014-05-28 2016-06-13 삼성전기주식회사 Multi-layered ceramic capacitor and board having the same mounted thereon
KR102016485B1 (en) 2014-07-28 2019-09-02 삼성전기주식회사 Multi layer ceramic capacitor and board having the same mounted thereon
US9847173B2 (en) * 2015-06-26 2017-12-19 Murata Manufacturing Co., Ltd. Mounting substrate
US20180330881A1 (en) 2017-05-15 2018-11-15 Avx Corporation Multilayer capacitor and circuit board containing the same

Also Published As

Publication number Publication date
JP2020526041A (en) 2020-08-27
WO2019005616A1 (en) 2019-01-03
KR20200014358A (en) 2020-02-10
IL271711D0 (en) 2020-02-27
US10672563B2 (en) 2020-06-02
US20190006104A1 (en) 2019-01-03
CN110800076A (en) 2020-02-14
EP3646356A1 (en) 2020-05-06

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