SG11201910393QA - On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss - Google Patents

On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss

Info

Publication number
SG11201910393QA
SG11201910393QA SG11201910393QA SG11201910393QA SG11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA
Authority
SG
Singapore
Prior art keywords
radio frequency
coupling capacitor
shielding structure
lower loss
frequency shielding
Prior art date
Application number
SG11201910393QA
Inventor
Haitao Cheng
Zhang Jin
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of SG11201910393QA publication Critical patent/SG11201910393QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223Capacitor integral with wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526Electromagnetic shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225Shielding layers formed together with wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/642Capacitive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H04B1/0053Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
    • H04B1/0057Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H04B1/0053Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
    • H04B1/006Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02Transmitters
    • H04B1/04Circuits
    • H04B1/0483Transmitters with multiple parallel paths
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Semiconductor Integrated Circuits (AREA)
SG11201910393QA 2017-06-20 2018-06-13 On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss SG11201910393QA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762522440P 2017-06-20 2017-06-20
US15/687,065 US10236573B2 (en) 2017-06-20 2017-08-25 On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss
PCT/US2018/037402 WO2018236652A1 (en) 2017-06-20 2018-06-13 On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss

Publications (1)

Publication Number Publication Date
SG11201910393QA true SG11201910393QA (en) 2020-01-30

Family

ID=64657677

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201910393QA SG11201910393QA (en) 2017-06-20 2018-06-13 On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss

Country Status (6)

Country Link
US (1) US10236573B2 (en)
EP (1) EP3642871B1 (en)
KR (1) KR102164669B1 (en)
CN (1) CN110770895B (en)
SG (1) SG11201910393QA (en)
WO (1) WO2018236652A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190378657A1 (en) * 2018-06-11 2019-12-12 Qualcomm Incorporated Multiple layer cylindrical capacitor
US10867904B1 (en) * 2019-06-14 2020-12-15 Taiwan Semiconductor Manufacturing Company Ltd. Integrated circuit structure of capacitive device
US11011459B1 (en) * 2020-02-06 2021-05-18 Qualcomm Incorporated Back-end-of-line (BEOL) on-chip sensor
US11201602B1 (en) * 2020-09-17 2021-12-14 Analog Devices, Inc. Apparatus and methods for tunable filtering
US11201600B1 (en) 2020-10-05 2021-12-14 Analog Devices, Inc. Apparatus and methods for control and calibration of tunable filters
CN114373741B (en) * 2022-03-08 2023-07-18 荣耀终端有限公司 Module, die, wafer and die manufacturing method

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US4757288A (en) * 1987-02-25 1988-07-12 Rockwell International Corporation Ceramic TEM bandstop filters
US6744117B2 (en) * 2002-02-28 2004-06-01 Motorola, Inc. High frequency semiconductor device and method of manufacture
JP3936221B2 (en) 2002-03-28 2007-06-27 株式会社東芝 High frequency semiconductor device
EP1665450B1 (en) 2003-06-13 2009-11-11 Telefonaktiebolaget LM Ericsson (publ) Transmission line
JP4805600B2 (en) 2005-04-21 2011-11-02 ルネサスエレクトロニクス株式会社 Semiconductor device
JP2007306290A (en) 2006-05-11 2007-11-22 Univ Of Tokyo Transmission line
KR20090033177A (en) 2006-06-02 2009-04-01 케네트, 인크 Improved metal-insulator-metal capacitors
US7532483B2 (en) * 2006-06-09 2009-05-12 Peregrine Semiconductor Corporation Mounting integrated circuit dies for high frequency signal isolation
US8559186B2 (en) * 2008-04-03 2013-10-15 Qualcomm, Incorporated Inductor with patterned ground plane
US8279025B2 (en) 2008-12-09 2012-10-02 Taiwan Semiconductor Manufacturing Company, Ltd. Slow-wave coaxial transmission line having metal shield strips and dielectric strips with minimum dimensions
US7999361B1 (en) * 2010-02-19 2011-08-16 Altera Corporation Shielding structure for transmission lines
US7939864B1 (en) * 2010-06-01 2011-05-10 Nxp B.V. Inductive bond-wire circuit
JP5859109B2 (en) * 2011-03-21 2016-02-10 ザイリンクス インコーポレイテッドXilinx Incorporated Symmetric central tap inductor structure
US8759893B2 (en) 2011-09-07 2014-06-24 Taiwan Semiconductor Manufacturing Company, Ltd. Horizontal interdigitated capacitor structure with vias
US8809956B2 (en) 2011-10-13 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Vertically oriented semiconductor device and shielding structure thereof
US8659126B2 (en) 2011-12-07 2014-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit ground shielding structure
US9224685B1 (en) 2012-03-09 2015-12-29 Altera Corporation Shielded metal-oxide-metal (MOM) capacitor structure
US8913401B2 (en) * 2012-11-14 2014-12-16 Fuji Xerox Co., Ltd. Multilayer wiring board
JP6301056B2 (en) * 2012-12-21 2018-03-28 三菱電機株式会社 Electronics
CN205863358U (en) 2013-07-09 2017-01-04 株式会社村田制作所 High-frequency transmission line
US9775243B2 (en) * 2015-04-19 2017-09-26 Mellanox Technologies, Ltd. Module compliance boards for quad small form-factor pluggable (QSFP) devices

Also Published As

Publication number Publication date
CN110770895B (en) 2021-05-25
EP3642871B1 (en) 2022-03-30
US10236573B2 (en) 2019-03-19
KR102164669B1 (en) 2020-10-12
KR20200003214A (en) 2020-01-08
BR112019026551A2 (en) 2020-06-23
CN110770895A (en) 2020-02-07
WO2018236652A1 (en) 2018-12-27
EP3642871A1 (en) 2020-04-29
US20180366822A1 (en) 2018-12-20

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