SG11201910393QA - On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss - Google Patents
On-chip coupling capacitor with patterned radio frequency shielding structure for lower lossInfo
- Publication number
- SG11201910393QA SG11201910393QA SG11201910393QA SG11201910393QA SG11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA SG 11201910393Q A SG11201910393Q A SG 11201910393QA
- Authority
- SG
- Singapore
- Prior art keywords
- radio frequency
- coupling capacitor
- shielding structure
- lower loss
- frequency shielding
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title 1
- 230000008878 coupling Effects 0.000 title 1
- 238000010168 coupling process Methods 0.000 title 1
- 238000005859 coupling reaction Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/006—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B1/0483—Transmitters with multiple parallel paths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762522440P | 2017-06-20 | 2017-06-20 | |
US15/687,065 US10236573B2 (en) | 2017-06-20 | 2017-08-25 | On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss |
PCT/US2018/037402 WO2018236652A1 (en) | 2017-06-20 | 2018-06-13 | On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201910393QA true SG11201910393QA (en) | 2020-01-30 |
Family
ID=64657677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201910393QA SG11201910393QA (en) | 2017-06-20 | 2018-06-13 | On-chip coupling capacitor with patterned radio frequency shielding structure for lower loss |
Country Status (6)
Country | Link |
---|---|
US (1) | US10236573B2 (en) |
EP (1) | EP3642871B1 (en) |
KR (1) | KR102164669B1 (en) |
CN (1) | CN110770895B (en) |
SG (1) | SG11201910393QA (en) |
WO (1) | WO2018236652A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190378657A1 (en) * | 2018-06-11 | 2019-12-12 | Qualcomm Incorporated | Multiple layer cylindrical capacitor |
US10867904B1 (en) * | 2019-06-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company Ltd. | Integrated circuit structure of capacitive device |
US11011459B1 (en) * | 2020-02-06 | 2021-05-18 | Qualcomm Incorporated | Back-end-of-line (BEOL) on-chip sensor |
US11201602B1 (en) * | 2020-09-17 | 2021-12-14 | Analog Devices, Inc. | Apparatus and methods for tunable filtering |
US11201600B1 (en) | 2020-10-05 | 2021-12-14 | Analog Devices, Inc. | Apparatus and methods for control and calibration of tunable filters |
CN114373741B (en) * | 2022-03-08 | 2023-07-18 | 荣耀终端有限公司 | Module, die, wafer and die manufacturing method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4757288A (en) * | 1987-02-25 | 1988-07-12 | Rockwell International Corporation | Ceramic TEM bandstop filters |
US6744117B2 (en) * | 2002-02-28 | 2004-06-01 | Motorola, Inc. | High frequency semiconductor device and method of manufacture |
JP3936221B2 (en) | 2002-03-28 | 2007-06-27 | 株式会社東芝 | High frequency semiconductor device |
ES2336093T3 (en) | 2003-06-13 | 2010-04-08 | Telefonaktiebolaget Lm Ericsson (Publ) | TRANSMISSION LINE. |
JP4805600B2 (en) | 2005-04-21 | 2011-11-02 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
JP2007306290A (en) | 2006-05-11 | 2007-11-22 | Univ Of Tokyo | Transmission line |
EP2030235A1 (en) | 2006-06-02 | 2009-03-04 | Kenet, Inc. | Improved metal-insulator-metal capacitors |
US7532483B2 (en) * | 2006-06-09 | 2009-05-12 | Peregrine Semiconductor Corporation | Mounting integrated circuit dies for high frequency signal isolation |
US8559186B2 (en) * | 2008-04-03 | 2013-10-15 | Qualcomm, Incorporated | Inductor with patterned ground plane |
US8279025B2 (en) | 2008-12-09 | 2012-10-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Slow-wave coaxial transmission line having metal shield strips and dielectric strips with minimum dimensions |
US7999361B1 (en) * | 2010-02-19 | 2011-08-16 | Altera Corporation | Shielding structure for transmission lines |
US7939864B1 (en) * | 2010-06-01 | 2011-05-10 | Nxp B.V. | Inductive bond-wire circuit |
KR101797267B1 (en) * | 2011-03-21 | 2017-11-13 | 자일링크스 인코포레이티드 | Symmetrical center tap inductor structure |
US8759893B2 (en) | 2011-09-07 | 2014-06-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Horizontal interdigitated capacitor structure with vias |
US8809956B2 (en) | 2011-10-13 | 2014-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Vertically oriented semiconductor device and shielding structure thereof |
US8659126B2 (en) | 2011-12-07 | 2014-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit ground shielding structure |
US9224685B1 (en) | 2012-03-09 | 2015-12-29 | Altera Corporation | Shielded metal-oxide-metal (MOM) capacitor structure |
US8913401B2 (en) * | 2012-11-14 | 2014-12-16 | Fuji Xerox Co., Ltd. | Multilayer wiring board |
JP6301056B2 (en) * | 2012-12-21 | 2018-03-28 | 三菱電機株式会社 | Electronics |
JP5967290B2 (en) | 2013-07-09 | 2016-08-10 | 株式会社村田製作所 | High frequency transmission line |
US9775243B2 (en) * | 2015-04-19 | 2017-09-26 | Mellanox Technologies, Ltd. | Module compliance boards for quad small form-factor pluggable (QSFP) devices |
-
2017
- 2017-08-25 US US15/687,065 patent/US10236573B2/en active Active
-
2018
- 2018-06-13 KR KR1020197037239A patent/KR102164669B1/en active IP Right Grant
- 2018-06-13 SG SG11201910393QA patent/SG11201910393QA/en unknown
- 2018-06-13 CN CN201880040604.5A patent/CN110770895B/en active Active
- 2018-06-13 EP EP18738076.1A patent/EP3642871B1/en active Active
- 2018-06-13 WO PCT/US2018/037402 patent/WO2018236652A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US10236573B2 (en) | 2019-03-19 |
BR112019026551A2 (en) | 2020-06-23 |
KR102164669B1 (en) | 2020-10-12 |
EP3642871A1 (en) | 2020-04-29 |
EP3642871B1 (en) | 2022-03-30 |
US20180366822A1 (en) | 2018-12-20 |
KR20200003214A (en) | 2020-01-08 |
CN110770895A (en) | 2020-02-07 |
CN110770895B (en) | 2021-05-25 |
WO2018236652A1 (en) | 2018-12-27 |
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