CN114373741B

CN114373741B - Module, die, wafer and die manufacturing method

Info

Publication number: CN114373741B
Application number: CN202210218290.1A
Authority: CN
Inventors: 孙江涛
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-03-08
Filing date: 2022-03-08
Publication date: 2023-07-18
Anticipated expiration: 2042-03-08
Also published as: CN114373741A

Abstract

The embodiment of the application provides a manufacturing method of a module, a crystal grain, a wafer and a crystal grain, wherein after a first crystal grain is arranged on a substrate, the substrate is provided with a substrate through hole and a grounding pin, the first crystal grain comprises a metal bump with an isolation function, the first crystal grain is arranged on the substrate, the metal bump with the isolation function can be connected with the grounding pin through the substrate through hole, so that a grounding loop can be formed, interference of signals on a link formed by the first crystal grain on signals on other links is shielded, and communication quality is improved.

Description

Module, die, wafer and die manufacturing method

Technical Field

The present disclosure relates to the field of chip technologies, and in particular, to a module, a die, a wafer, and a method for manufacturing a die.

Background

With the continuous update of electronic devices, modules in the electronic devices are rapidly developed, and different functions can be implemented by different modules, for example, a receiving module is used for implementing a radio frequency receiving function, and the receiving module can be a N77 frequency band multiple input multiple output (multiple input multiple output, MIMO) receiving module.

In general, the N77 MIMO receiving module may include 2 low noise amplifier (low noise amplifier, LNA) dies and 2 filter dies, where there is electromagnetic coupling between signals between a link formed by one LNA die and one filter die and a link formed by another LNA die and another filter die, which may reduce communication quality.

Disclosure of Invention

The embodiment of the application provides a module, a die, a wafer and a manufacturing method of the die, so as to improve communication quality.

In a first aspect, an embodiment of the present application provides a module, including a substrate and a first die, where the substrate has a substrate through hole and a ground pin, and the first die includes a metal bump with an isolation function; the first crystal grain is arranged on the substrate; the metal bump with isolation function is connected with the grounding pin through the substrate through hole. Thus, a grounding loop can be formed, interference of signals on a link formed by the first crystal grains on signals on other links is shielded, and communication quality is improved.

In a possible implementation manner, the first crystal grain further includes N radio frequency units with the same function, and metal bumps with interconnection functions are arranged in the N radio frequency units with the same function, where N is greater than or equal to 1. Thus, the module can be miniaturized, the space of the module is saved, and the metal lug with the interconnection function is arranged in the crystal grain, so that the interconnection between the crystal grains can be realized based on the lug.

In a possible implementation manner, among the N radio frequency units with the same function, a scribing groove is arranged between two adjacent radio frequency units, a metal bump with an isolation function is arranged in the scribing groove, N is greater than 1, and the scribing groove is parallel to the transmission direction of electromagnetic signals.

In a possible implementation manner, the radio frequency unit includes any one of the following: a filter unit or an amplifier unit.

In one possible implementation, the module further includes a second die; the metal bump with isolation function in the second crystal grain is connected with the grounding pin through the substrate through hole. In this way, a ground loop can be formed to shield the influence of the signal on the link composed of the second crystal grains on the signal on the link composed of the first crystal grains, namely, the electromagnetic coupling between the shielding signals, so that the communication quality is further improved.

In a possible implementation manner, the module is a multiple input multiple output MIMO receiving module with an N77 frequency band, the first die is a filter die, the first die includes 2 filter units, the 2 filter units support an operating frequency range of the filter with the N77 frequency band, the second die is an amplifier die, the second die includes 2 amplifier units, the 2 amplifier units are low noise amplifiers, and the 2 amplifier units support an operating frequency range of the low noise amplifier with the N77 frequency band.

In one possible implementation, the operating frequency range of the filter in the N77 band is 3.3ghz to 4.2ghz, and the operating frequency range of the low noise amplifier in the N77 band is 3.3ghz to 4.2ghz.

In one possible implementation, the module is an N79 band MIMO receiving module.

In a second aspect, an embodiment of the present application provides a die for manufacturing M modules, where the M modules are used for implementing radio frequency transmitting or receiving functions in different mobile systems, the die includes: n radio frequency units with the same function; the radio frequency unit is used for manufacturing M modules; wherein M is greater than 1, N is greater than or equal to 1, and each of the N radio frequency units with the same function is provided with a metal bump with an interconnection function.

In a third aspect, embodiments of the present application provide a wafer, where the wafer includes X rf units with the same function; each of the X radio frequency units with the same function is provided with a metal bump with an interconnection function; wherein X is greater than or equal to 2.

In a possible implementation manner, in the X radio frequency units with the same function, two adjacent radio frequency units are provided with dicing grooves, metal bumps with isolation functions are progressively manufactured in the dicing grooves, and the dicing grooves are parallel to the transmission direction of electromagnetic signals.

In a fourth aspect, embodiments of the present application provide a method for manufacturing a die, including: providing a wafer; the wafer comprises X radio frequency units with the same function, wherein each radio frequency unit of the X radio frequency units with the same function is provided with a metal lug with an interconnection function, and X is more than or equal to 2, wherein in the radio frequency units with the same function, two adjacent radio frequency units are provided with scribing grooves, metal lugs with isolation functions are progressively manufactured in the scribing grooves, and the scribing grooves are parallel to the transmission direction of electromagnetic signals; cutting the wafer to obtain a first crystal grain; the first crystal grain comprises N radio frequency units with the same function, and N is greater than or equal to 1.

In a fifth aspect, embodiments of the present application provide a radio frequency system, including an antenna and a module as described in the first aspect and possible implementation manners of the first aspect.

These and other aspects, implementations, and advantages of the exemplary embodiments will become apparent from the following description of the embodiments, taken in conjunction with the accompanying drawings. It is to be understood that the description and drawings are only for purposes of illustration and are not to be taken as a definition of the limits of the embodiments of the present application, for which reference is made to the appended claims. Additional aspects and advantages of embodiments of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the application. Furthermore, the aspects and advantages of the embodiments of the application may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

Drawings

Fig. 1 is a schematic diagram of an N77 MIMO receiving module according to an embodiment of the present application;

fig. 2 is a schematic diagram of an N77 MIMO receiving module pin according to an embodiment of the present application;

fig. 3 is a schematic diagram of an N77 MIMO receiving module according to an embodiment of the present application;

fig. 4 is a schematic diagram of a MIMO receiving system according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a wafer according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of a filter wafer according to an embodiment of the present disclosure;

FIG. 7 is a partially enlarged schematic illustration of a first die according to an embodiment of the present disclosure;

FIG. 8 is a partially enlarged schematic illustration of a first die according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of a second die partially enlarged according to an embodiment of the present application;

fig. 10 is a schematic diagram of an N77 MIMO receiving module according to an embodiment of the present application;

FIG. 11 is a schematic diagram of an electromagnetic shielding loop according to an embodiment of the present disclosure;

fig. 12 is a schematic diagram of a 4 x 4 MIMO receiving module with an N77 frequency band according to an embodiment of the present application;

fig. 13 is a schematic diagram of an N79 MIMO receiving module according to an embodiment of the present application.

Detailed Description

In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same item or similar items having substantially the same function and effect. For example, the first chip and the second chip are merely for distinguishing different chips, and the order of the different chips is not limited. It will be appreciated by those of skill in the art that the words "first," "second," and the like do not limit the amount and order of execution, and that the words "first," "second," and the like do not necessarily differ.

It should be noted that, in the embodiments of the present application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a alone, a and B together, and B alone, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b, or c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural.

For example, fig. 1 is a schematic diagram of an N77 MIMO receiving module provided in the embodiment of the present application, where the N77 MIMO receiving module is an N77 band MIMO receiving module, and the N77 MIMO receiving module may implement a radio frequency receiving function, as shown in fig. 1, the N77 MIMO receiving module may include 2 LNA grains, 2 filter grains, and a switch grain, where the 2 LNA grains are respectively LNA grain 1 and LNA grain 2, the 2 filter grains are respectively filter grain 1 and filter grain 2, the switch grain, LNA grain 1 and filter grain 1 may form one of receiving links of N77 MIMO, and the switch grain, LNA grain 2 and filter grain 2 may form another receiving link of N77 MIMO, and electromagnetic coupling exists between the one receiving link and the other receiving link.

In a possible manner, when designing the N77 MIMO receiving module, the spatial distances between 2 LNA grains and 2 filter grains may be increased, and due to the increased spatial distances of the same grains, the isolation requirement between N77 MIMO receiving links may be greater than 35dB, so as to reduce electromagnetic coupling between N77 MIMO receiving links, thereby improving communication quality.

The LNA die 1 and the LNA die 2 are dies with the same size, the same function and the same die mask cut from the same LNA wafer, and the filter die 1 and the filter die 2 are dies with the same size, the same function and the same die mask cut from the same filter wafer; the isolation requirement of the output port of the N77 MIMO receiving module is at least more than 30dB.

Referring to fig. 1, for example, fig. 2 is a schematic diagram of an N77 MIMO receiving module pin provided in the embodiment of the present application, as shown in fig. 2, the N77 MIMO receiving module pin includes rx_2, GND, rx_1, VIO, SDATA, SCLK, VDD, ANT, ANT1 and SRSIN, where the pin corresponding to number 1 is rx_2, the pin corresponding to number 2, number 9, number 10, number 11, number 13, number 15, number 17, number 18, number 19 and the pin corresponding to number 20 are all GND, the pin corresponding to number 3 is rx_1, the pin corresponding to number 5 is VIO, the pin corresponding to number 6 is SDATA, the pin corresponding to number 7 is SCLK, the pin corresponding to number 8 is VDD, the pin corresponding to number 12 is ANT1, the pin corresponding to number 14 is ANT2, and the pin corresponding to number 16 is SRSIN.

Referring to fig. 1 and fig. 2, for example, fig. 3 is a schematic diagram of an N77 MIMO receiving module according to an embodiment of the present application, as shown in fig. 3, fig. 3 includes an LNA die 1, an impedance matching network1 (impedance matching network, IMN 1), a filter die 1, a switch die, an LNA die 2, an impedance matching network2 (impedance matching network, IMN 2), and a filter die 2, and fig. 3 further includes a pin rx_2, a pin rx_1, a pin ANT1, a pin ANT2, and a pin SRSIN.

The LNA die 1, the impedance matching network1 (impedance matching network, IMN 1), the filter die 1 and the switch die may be interconnected on the substrate by a substrate trace, where, in conjunction with fig. 2, one end of the substrate trace corresponding to the switch die may be connected to the filter die 1, the other end of the substrate trace corresponding to the switch die may be interconnected with ANT2 in the N77 MIMO receiving module pin, one end of the substrate trace corresponding to the LNA die 1 may be connected to the IMN1, and the other end of the substrate trace corresponding to the LNA die 1 may be connected to rx_2 in the N77 MIMO receiving module pin.

The LNA die 2, the impedance matching network2 (impedance matching network, IMN 2), the filter die 2, and the switch die may be interconnected on the substrate by a substrate trace, where, in conjunction with fig. 2, one end of the substrate trace corresponding to the switch die may be connected to the filter die 2, the other end of the substrate trace corresponding to the switch die may be interconnected with ANT1 in the N77 MIMO receiving module pin, one end of the substrate trace corresponding to the LNA die 2 may be connected to the IMN2, and the other end of the substrate trace corresponding to the LNA die 2 may be connected to rx_1 in the N77 MIMO receiving module pin.

It should be noted that, the N77 MIMO receiving module described in fig. 1-3 is described, so that the LNA grain in the module is an N77 band LNA grain, and the filter grain in the module is an N77 band filter grain, where the N77 band LNA grain can amplify signals with a working frequency range of 3.3ghz to 4.2ghz, and the N77 band filter grain can filter signals with a working frequency range outside 3.3ghz to 4.2 ghz.

In conjunction with the foregoing, fig. 4 is a schematic diagram of a MIMO receiving system according to an embodiment of the present application, and as shown in fig. 4, a terminal side may send MIMO signals from a base station side to a receiver through a switch die, a filter die, and an LNA die.

As an example, the terminal side antenna 1 may receive the MIMO signal 1 from any one of the base station side antenna 3, the base station side antenna 4, the base station side antenna 1, or the base station side antenna 2, the terminal side may process the MIMO signal 1 through the switch die 1, the filter die 1, and the LNA die 1, for example, the terminal side may transmit the MIMO signal 1 to the filter die 1 through the switch die 1, the filter die 1 may filter the MIMO signal 1, and the LNA die 1 may perform signal amplification processing on the filtered signal such that the receiver receives the amplified signal.

As another example, the terminal side antenna 2 may receive the MIMO signal 2 from any one of the base station side antenna 3, the base station side antenna 4, the base station side antenna 1, or the base station side antenna 2, the terminal side may process the MIMO signal 2 through the switch die 1, the filter die 2, and the LNA die 2, for example, the terminal side may transmit the MIMO signal 2 to the filter die 2 through the switch die 1, the filter die 2 may filter the MIMO signal 2, and the LNA die 2 may perform signal amplification processing on the filtered signal such that the receiver receives the amplified signal.

As yet another example, the terminal side antenna 3 may receive the MIMO signal 3 from any one of the base station side antenna 3, the base station side antenna 4, the base station side antenna 1, or the base station side antenna 2, the terminal side may process the MIMO signal 3 through the switch die 2, the filter die 3, and the LNA die 3, for example, the terminal side may transmit the MIMO signal 3 to the filter die 3 through the switch die 2, the filter die 3 may filter the MIMO signal 3, the switch die 3 may transmit the filtered signal to the LNA die 1, and the LNA die 1 may perform signal amplification processing on the filtered signal, so that the receiver receives the amplified signal; the switching die 3 may send the filtered signal to a Power Amplifier (PA), and the PA may send the received signal to a receiver.

As yet another example, the terminal side antenna 4 may receive the MIMO signal 4 from any one of the base station side antenna 3, the base station side antenna 4, the base station side antenna 1, or the base station side antenna 2, the terminal side may process the MIMO signal 4 through the switch die 2, the filter die 4, and the LNA die 4, for example, the terminal side may transmit the MIMO signal 4 to the filter die 4 through the switch die 2, the filter die 4 may filter the MIMO signal 4, and the LNA die 4 may perform signal amplification processing on the filtered signal such that the receiver receives the amplified signal.

In combination with the above, in the N77 MIMO receiving module shown in fig. 1, although the mode of increasing the spatial distance between 2 LNA grains and 2 filter grains is adopted, electromagnetic coupling of downlink MIMO link operation can be reduced, high isolation requirement is achieved, and communication quality is improved.

In view of the foregoing, the embodiments of the present application provide a module, a die, a wafer, and a method for manufacturing a die, where after a first die is disposed on a substrate, the substrate is provided with a substrate through hole and a grounding pin, the first die includes a metal bump with an isolation function, and the first die is disposed on the substrate, and the metal bump with an isolation function can be connected with the grounding pin through the substrate through hole, so that a grounding loop can be formed, interference of signals on a link formed by the first die on signals on other links is shielded, and communication quality is improved.

Fig. 5 is a schematic diagram of a wafer provided in an embodiment of the present application, where the wafer includes X radio frequency units with the same function, or is understood to include X dies with the same function, where X is greater than or equal to 2, and the radio frequency units may be a filter unit and an amplifier unit.

For example, when the rf unit is an amplifier unit, the filter wafer includes X filter dies with the same function; when the RF unit is a low noise amplifier unit, the LNA wafer includes X LNA dies with the same function.

It should be noted that, each of the X radio frequency units with the same function is provided with a metal bump with an interconnection function; in the X radio frequency units with the same function, two adjacent radio frequency units are provided with scribing grooves, metal bumps with isolation functions are progressively manufactured in the scribing grooves, wherein the scribing grooves are parallel to the transmission direction of electromagnetic signals.

Referring to fig. 5, a wafer is diced to obtain a first die, where the die may be used to manufacture M modules, where the M modules are used to implement radio frequency transmitting or receiving functions in different mobile systems, the die includes N radio frequency units with the same function, and the radio frequency units are used to manufacture M modules, where M is greater than 1, N is greater than or equal to 1, and each of the N radio frequency units with the same function is provided with a metal bump with an interconnection function.

When N is greater than 1, the dicing grooves between two adjacent radio frequency units are provided with metal bumps with isolation function, wherein the dicing grooves are parallel to the transmission direction of electromagnetic signals; in addition, the specific value of N may be set according to the module requirement, which is not limited in this embodiment.

In combination with the above, when one of the M modules is an N77 MIMO receiving module, as shown in fig. 6, an exemplary diagram of a filter wafer provided in the embodiment of the present application is shown in fig. 6, in which a plurality of filter dies fabricated along the same direction are arranged in the filter wafer, all the filter dies have the same size, the same function and the same die mask, and scribe lines are provided between two adjacent filter dies.

In the N77 MIMO receiving module, the electromagnetic signal transmission direction is as shown in fig. 6, so in the filter wafer, the dicing grooves parallel to the electromagnetic signal transmission direction and the dicing grooves perpendicular to the electromagnetic signal transmission direction are distributed between the filter die and the filter die, for example, the nth dicing groove and the n+2th dicing groove are the dicing grooves parallel to the electromagnetic signal transmission direction, and the P th dicing groove is the dicing groove perpendicular to the electromagnetic signal transmission direction.

In connection with fig. 1, in the N77 MIMO receiving module, since 2 filter dies are required, when the filter wafer is cut, every 2 filter dies may be cut together, so that the die obtained by cutting is a first die, and there are 2 filter units with the same function in the first die, or it is understood that the first die is a 2 in 1 die, and the 2 in 1 die may be understood that 2 filter dies are cut together to obtain 1 die, where the nth scribe line or the n+2th scribe line may be understood as a scribe line between the 2 filter dies cut together, that is, a scribe line in the first die, which is a scribe line parallel to the transmission direction of the electromagnetic signal.

Based on the foregoing, it is known that by increasing the spatial distance between the same dies, the strength of electromagnetic coupling can be reduced, but the module size can be increased, so that, in order not to increase the module size, before dicing the filter wafer, metal bumps having an isolation function can be sequentially fabricated in scribe lines parallel to the electromagnetic signal transmission direction, and thus, after dicing the filter wafer, metal bumps having an isolation function are provided in the scribe lines in the first die.

For example, in connection with fig. 6, metal bumps with isolation function may be sequentially fabricated in the nth scribe line and the n+2 th scribe line, or it is understood that, starting with the nth scribe line, metal bumps with isolation function may be sequentially fabricated in every other scribe line, so that the metal bumps with isolation function may isolate interference signals of the same kind of die between different links, and reduce electromagnetic coupling during downlink MIMO link operation.

Fig. 7 is a schematic diagram of a partial enlargement of a first die according to an embodiment of the present application, as shown in fig. 7, where the first die includes 2 filter units with the same function, or it is understood that the first die includes 2 filter dies, that is, a filter die 1 and a filter die 2, respectively, and a scribe line between the filter die 1 and the filter die 2 is complete, and the scribe line is provided with a metal bump with an isolation function.

It should be noted that, the number of metal bumps with isolation function shown in fig. 7 is 4, which is an example, the number of metal bumps with isolation function is related to the size of the die, and in the scribe line of the same die, the number of metal bumps with isolation function is at least one, when the number of metal bumps with isolation function is plural, the spacing between adjacent metal bumps with isolation function may be any value between 80um (micrometers) and 100um, or the spacing between adjacent metal bumps with isolation function may be other values, and the specific value of the spacing between adjacent metal bumps with isolation function may be set according to the practical application scenario.

In order to implement a certain circuit interconnection function, in connection with fig. 6, a metal bump having an interconnection function may be fabricated in each of the filter dies in the filter wafer such that each of the filter dies can implement input and output of electromagnetic signals through the metal bump having an interconnection function, and thus the metal bump having an interconnection function may include a metal bump having an input interconnection function and a metal bump having an output interconnection function, and the position of the metal bump having an input interconnection function in each of the filter dies is related to the position of the metal bump having an output interconnection function and the transmission direction of electromagnetic signals.

Referring to fig. 7, for example, fig. 8 is an enlarged schematic view of a portion of a first die provided in an embodiment of the present application, as shown in fig. 8, the first die includes 2 filter dies, namely, a filter die 1 and a filter die 2, each of the 2 filter dies is fabricated with a metal bump having an input interconnect function and a metal bump having an output interconnect function, for example, the filter die 1 is provided with the metal bump 1 having the input interconnect function and the metal bump 2 having the output interconnect function, the filter die 2 is provided with the metal bump 3 having the input interconnect function and the metal bump 4 having the output interconnect function, and the direction of the position of the metal bump having the input interconnect function is parallel to the electromagnetic signal transmission direction.

It should be noted that, the manufacturing process and the metal composition of the metal bump with the isolation function and the metal bump with the interconnection function are completely consistent, and no additional special process or separate manufacturing is needed; the metal bump with the isolation function is completely independent of the die circuit function layer, and the metal bump with the isolation function is also independent of the metal bump with the interconnection function.

It will be appreciated that since the manufacturing processes and metal compositions of the metal bump having the isolation function and the metal bump having the interconnection function are completely identical, the metal bump has the isolation function or the interconnection function, depending on the position where the metal bump is disposed, the metal bump has the isolation function when disposed in the scribe line, and the metal bump has the interconnection function when disposed in the die.

In the N77 MIMO receiving module, 2 LNA dies are further required, so, based on the content shown in fig. 6 to 8, when the LNA wafer is cut, every 2 LNA dies can be cut together, so that a second die can be obtained by cutting, the second die includes 2 low noise amplifier units with the same function, the second die is a 2 in 1 die, the 2 in 1 die can be understood as the 2 LNA dies are cut together to obtain 1 die, and metal bumps with isolation function are arranged in scribe grooves in the 2 LNA dies, and the scribe grooves are scribe grooves parallel to the transmission direction of electromagnetic signals; also, each of the 2 LNA dies is provided with a metal bump having an input interconnection function and a metal bump having an output interconnection function.

As an example, fig. 9 is a schematic diagram of a second die partially enlarged, as shown in fig. 9, where the second die includes 2 LNA dies, that is, LNA die 1 and LNA die 2, and each of the 2 LNA dies has a metal bump with an input interconnect function and a metal bump with an output interconnect function fabricated therein, for example, the LNA die 1 has a metal bump 5 with an input interconnect function and a metal bump 6 with an output interconnect function, the LNA die 2 has a metal bump 7 with an input interconnect function and a metal bump 8 with an output interconnect function, and the direction of the position of the metal bump with an input interconnect function pointing to the position of the metal bump with an output interconnect function is parallel to the electromagnetic signal transmission direction.

In the N77 MIMO receiving module, there is also a need for the light-emitting die, so before dicing the switch wafer, 2 metal bumps having an input interconnection function and 2 metal bumps having an output interconnection function may be provided in each light-emitting die in the switch wafer, so that after dicing the switch wafer, the 2 metal bumps having an input interconnection function and the 2 metal bumps having an output interconnection function in the diced switch die are obtained.

The cut switch crystal grain can be connected with the antenna based on one metal bump with an input interconnection function, can be connected with the metal bump with the input interconnection function in one filter crystal grain in the first crystal grain based on one metal bump with the output interconnection function through the substrate wire, and likewise can be connected with the antenna based on the other metal bump with the input interconnection function, and can be connected with the metal bump with the input interconnection function in the other filter crystal grain in the first crystal grain based on the other metal bump with the output interconnection function through the substrate wire.

In summary, when packaging the N77 MIMO module, according to the module function, the first die, the second die, and the switch die obtained by cutting may be disposed on the substrate through the interconnection design, so as to form a complete module.

Fig. 10 is a schematic diagram of an N77 MIMO receiving module according to an embodiment of the present application, and as shown in fig. 10, the module includes a switching die, a first die, and a second die, where the switching die, the first die, and the second die are disposed on a substrate.

Wherein the first die comprises 2 filter dies, namely a filter die 1 and a filter die 2, metal bumps with isolation function are arranged in scribing grooves between the filter die 1 and the filter die 2, moreover, the filter die 1 is provided with metal bumps 1 with input interconnection function and metal bumps 2 with output interconnection function, and the filter die 2 is provided with metal bumps 3 with input interconnection function and metal bumps 4 with output interconnection function.

Wherein the second die comprises 2 LNA dies, namely LNA die 1 and LNA die 2, a metal bump with an isolation function is arranged in a scribing groove between the LNA die 1 and the LNA die 2, a metal bump 5 with an input interconnection function and a metal bump 6 with an output interconnection function are arranged in the LNA die 1, and a metal bump 7 with an input interconnection function and a metal bump 8 with an output interconnection function are arranged in the LNA die 2.

Wherein, 2 metal bumps with input interconnection function and 2 metal bumps with output interconnection function are arranged in the switch crystal grain, the 2 metal bumps with input interconnection function are respectively a metal bump 9 with input interconnection function and a metal bump 11 with input interconnection function, and the 2 metal bumps with output interconnection function are respectively a metal bump 10 with output interconnection function and a metal bump 12 with output interconnection function.

In fig. 10, the connection between the die and the metal bump is a tandem connection, or it is understood that the connection between the die and the metal bump is a tandem connection.

The connection modes among the switch crystal grain, the filter crystal grain 1 and the LNA crystal grain 1 are as follows: after the metal bump 9 with the input interconnection function in the switch crystal grain is connected with the antenna through the substrate wire, the metal bump 9 with the input interconnection function can be interconnected with the metal bump 10 with the output interconnection function through the metal wire, after the metal bump 10 with the output interconnection function is interconnected with the metal bump 1 with the input interconnection function in the filter crystal grain 1 through the substrate wire, the metal bump 1 with the input interconnection function can be interconnected with the metal bump 2 with the output interconnection function through the metal wire, and after the metal bump 2 with the output interconnection function is interconnected with the metal bump 5 with the input interconnection function in the LNA crystal grain 1 through the substrate wire, the metal bump 5 with the input interconnection function can be interconnected with the metal bump 6 with the output interconnection function through the metal wire.

Based on the connection manner between the switch die, the filter die 1 and the LNA die 1 described above, one of the receiving links in the N77 MIMO receiving module may be configured, so that when the terminal receives a signal based on the antenna, the received signal may be processed through the receiving link, and the processed signal may be sent to the receiver.

The connection modes among the switch crystal grain, the filter crystal grain 2 and the LNA crystal grain 2 are as follows: after the metal bump 11 with the input interconnection function in the switch die is connected with the antenna through the substrate wire, the metal bump 11 with the input interconnection function can be interconnected with the metal bump 12 with the output interconnection function through the metal wire, after the metal bump 12 with the output interconnection function is interconnected with the metal bump 3 with the input interconnection function in the filter die 2 through the substrate wire, the metal bump 3 with the input interconnection function can be interconnected with the metal bump 4 with the output interconnection function through the metal wire, and after the metal bump 4 with the output interconnection function is interconnected with the metal bump 7 with the input interconnection function in the LNA die 2 through the substrate wire, the metal bump 7 with the input interconnection function can be interconnected with the metal bump 8 with the output interconnection function through the metal wire.

Based on the connection manner between the switch die, the filter die 2 and the LNA die 2 described above, another receiving link in the N77 MIMO receiving module may be formed, so that when the terminal receives a signal based on the antenna, the terminal may process the received signal through the receiving link and transmit the processed signal to the receiver.

It should be noted that, in fig. 10, the metal bump and the substrate trace are bonded together on the substrate through a bonding process, and since the process of inputting and outputting signals between the metal bump and the metal bump in the die is an internal process in the die, the signal transmission direction between the metal bump and the metal bump in the die is not shown in the figure.

In fig. 10, a metal bump with an isolation function is disposed in a first die, a metal bump with an isolation function is disposed in a second die, the metal bump with an isolation function in the first die and the metal bump with an isolation function in the second die are respectively connected with a ground pin in the substrate through a substrate through hole, so that the first die and the second die can form a ground loop with the outside, electromagnetic shielding can be realized through the ground loop, or it is understood that after the metal bump with an isolation function in the first die is connected with a ground pin through the substrate through hole, the first die can form a ground loop with the outside, interference of signals on a link composed of the first die on signals on a link composed of the second die on the link can be shielded through the ground loop, and after the metal bump with an isolation function in the second die is connected with the ground pin through the substrate through hole, interference of signals on the link composed of the second die on the link composed of the first die on the link can be shielded through the ground loop, thereby further improving the isolation quality of MIMO on the link composed of the link, wherein the ground pin can be GND.

Referring to fig. 10, for example, fig. 11 is a schematic diagram of an electromagnetic shielding loop provided in an embodiment of the present application, as shown in fig. 11, a substrate through hole and a ground pin are formed in a substrate, an LNA die 1 is formed in a circuit layer 1, an LNA die 2 is formed in a circuit layer 2, a scribe line is formed between the circuit layer 1 and the circuit layer 2, a metal bump with an isolation function is formed below the scribe line, the LNA die 1 and the LNA die 2 form a second die, the metal bump with an isolation function is formed in the scribe line in the second die, and the metal bump with an isolation function is connected with a common reference ground through the substrate through hole to form the ground loop, so as to improve the isolation degree of downlink MIMO, wherein the common reference ground in fig. 11 can be understood as the ground pin, and the LNA die 1 in the circuit layer 1 and the LNA die 2 in the circuit layer 2 are not shown in fig. 11.

It can be understood that the circuit layer 1 may also be a filter die 1, the circuit layer 2 may also be a filter die 2, the filter die 1 and the filter die 2 form a first die, a scribe line in the first die has a metal bump with an isolation function, and the metal bump with an isolation function is connected with a common reference ground through a substrate through hole to form a ground loop, so as to realize electromagnetic shielding, thereby improving the isolation of downlink MIMO and further improving the communication quality.

After the first die and the second die are obtained by dicing, the first die and the second die are flip-chip disposed on the substrate, and therefore, in fig. 11, a metal bump having an isolation function is disposed below the scribe line.

In summary, in this application embodiment, the scribing groove makes the metal lug that has the isolation function before the cutting, and simple process is ripe, does not increase the module size, helps the module miniaturization, and moreover, this metal lug makes the same crystal grain do not communicate each other to can improve the isolation degree problem between the radio frequency receiving module, improve user's communication experience.

The above is an exemplary description taking the N77 MIMO receiving module as an example, the N77 MIMO receiving module may be understood as a 2 x 2 MIMO receiving module, and 2 LNA dies may be cut together to obtain the second die when the LNA wafer is cut because 2 LNA dies are required for manufacturing the N77 MIMO receiving module described above, and similarly, 2 filter dies may be cut together to obtain the first die when the filter wafer is cut because 2 filter dies are required for manufacturing the N77 MIMO receiving module described above.

It can be appreciated that when manufacturing other types of N77 band receiving modules, the number of die cut together may be determined according to the module requirement, which is not limited in the embodiment of the present application.

Fig. 12 is a schematic diagram of a 4 x 4 MIMO receiving module with N77 frequency band according to the embodiment of the present application, as shown in fig. 12, since the module includes 4 LNA dies, i.e. LNA die 1, LNA die 2, LNA die 3 and LNA die 4, respectively, when dicing an LNA wafer, every 4 LNA dies can be diced together, and the same applies; since the module includes 4 filter dies, namely, the filter die 1, the filter die 2, the filter die 3 and the filter die 4, each 4 filter dies can be cut together when the filter wafer is cut.

Based on the above description, before dicing the LNA wafer, metal bumps with interconnection function are set in all LNA dies in the LNA wafer, and metal bumps with isolation function are progressively fabricated in scribe lines in the LNA wafer, where the scribe lines are scribe lines parallel to the electromagnetic signal transmission direction, so that after dicing together every 4 LNA dies, metal bumps with isolation function are in the scribe lines in every 4 LNA dies; before cutting the filter wafer, the same mode as that of cutting the LNA wafer is adopted, based on the mode, the manufactured 4 x 4 MIMO receiving module with the N77 frequency band can reduce electromagnetic coupling of downlink MIMO link work in the communication process of the base station and the terminal, and improve communication quality.

It should be noted that, in the switch die in the 4×4 MIMO receiving module of the N77 frequency band, before the switch wafer is cut, 4 metal bumps with an input interconnection function and 4 metal bumps with an output interconnection function are set in the switch wafer, and based on the 4 metal bumps with an input interconnection function and the 4 metal bumps with an output interconnection function, signal transmission between the LNA die and the filter die in the 4×4 MIMO receiving module of the N77 frequency band can be respectively implemented, and specific connection modes can be described with reference to the foregoing content adaptation and are not described herein.

The above is an exemplary description taking an N77 MIMO receiving module as an example, when one of the M modules is an N79 band MIMO receiving module (hereinafter referred to as an N79 MIMO receiving module), the method of the embodiment of the present application may also be applied to an N79 MIMO receiving module, where LNA grains in the N79 MIMO receiving module may amplify signals with a working frequency range between 4.4ghz and 5.0ghz, and filter grains in the N79 MIMO receiving module may select signals with a working frequency range between 4.4ghz and 5.0 ghz.

Fig. 13 is a schematic diagram of an N79 MIMO receiving module according to an embodiment of the present application, where the N79 MIMO receiving module includes an N79 band LNA die 5 (hereinafter referred to as an N79 LNA die 5), an N79 LNA die 6, an N79 band filter die 5 (hereinafter referred to as an N79 filter die 5), an N79 filter die 6, and a switch die.

The switch die, the N79 LNA die 5 and the N79 filter die 5 may form one receiving link in the N79 MIMO receiving module, and the switch die, the N79 LNA die 6 and the N79 filter die 6 may form another receiving link in the N79 MIMO receiving module, where signals in the two links affect each other, which may increase the strength of spatial electromagnetic coupling on the MIMO link and reduce the communication quality.

Because the N79 MIMO receiving module includes 2N 79 LNA dies, in combination with the above, before the N79 LNA wafers are cut, metal bumps with interconnection function are set in each LNA die in the N79 LNA wafer, and metal bumps with isolation function are progressively manufactured in dicing grooves in the N79 LNA wafer, where the dicing grooves are dicing grooves parallel to the electromagnetic signal transmission direction, so that when every 2N 79 LNA dies are cut together, metal bumps with isolation function are set in the dicing grooves in every 2N 79 LNA dies; because the N79 MIMO receiving module comprises 2N 79 filter crystal grains, before cutting the filter wafer with the N79 frequency band, every 2N 79 filter crystal grains can be cut together, and the dicing grooves in every 2N 79 filter crystal grains are provided with metal bumps with isolation functions, so that the crystal grains are not communicated with each other, and the intensity of space electromagnetic coupling on the MIMO link can be reduced.

Thus, based on the above, the N79 LNA die 7 in which the N79 LNA die 5 and the N79 LNA die 6 are cut together, and the N79 filter die 7 in which the N79 filter die 5 and the N79 filter die 6 are cut together can be obtained, wherein the metal bumps having the isolation function are provided in the dicing grooves between the N79 LNA die 5 and the N79 LNA die 6, and the metal bumps having the isolation function are provided in the dicing grooves between the N79 filter die 5 and the N79 filter die 6, and the schematic diagram can be referred to in fig. 7 to 9.

In addition, when interconnection design is performed, the N79 LNA die 7 and the N79 filter die 7 may be connected to a ground pin through substrate through holes, so that the N79 LNA die 7, the N79 filter die 7 and the external ground form a ground loop, and electromagnetic shielding is implemented based on the ground loop, so that in the process of communication between the base station and the terminal, the N79 MIMO receiving module manufactured based on the above manner can reduce electromagnetic coupling of downlink MIMO link operation and improve communication quality, and a schematic diagram of an electromagnetic shielding loop is not drawn, and the schematic diagram can refer to fig. 11.

Claims

1. The module is characterized by comprising a substrate and a first crystal grain, wherein the first crystal grain comprises a metal bump with an isolation function, and a substrate through hole and a grounding pin are arranged in the substrate;

The first crystal grain is arranged on the substrate;

the metal bump with the isolation function is connected with the grounding pin through the substrate through hole;

the first crystal grain also comprises N radio frequency units with the same function, wherein the N radio frequency units with the same function are provided with metal bumps with interconnection functions, and N is larger than 1;

among the N radio frequency units with the same function, a scribing groove is arranged between two adjacent radio frequency units, the metal lug with the isolation function is arranged in the scribing groove, N is larger than 1, and the scribing groove is parallel to the transmission direction of electromagnetic signals;

the module further includes a second die;

the metal bump with isolation function in the second crystal grain is connected with the grounding pin through the substrate through hole,

the first die is a filter die, the first die includes 2 filter units,

the second crystal grain is an amplifier crystal grain, and the second crystal grain comprises 2 amplifier units;

wherein one of the filter units in the first die and one of the amplifier units in the second die are used for forming one receiving link in the module, the other of the filter units in the first die and the other of the amplifier units in the second die are used for forming the other receiving link in the module, and the metal bumps with isolation function in the first die and the metal bumps with isolation function in the second die are respectively connected with the grounding pin through the substrate through holes so as to form a grounding loop between the first die, the second die and the outside, and the electromagnetic interference between the one receiving link and the other receiving link in the module is reduced;

The metal bump with the isolation function and the metal bump with the interconnection function are consistent in manufacturing process and metal composition, and are bonded on the substrate through a bonding process.

2. The module of claim 1, wherein the module is an N77 band MIMO receiving module, the 2 filter units support an operating frequency range of an N77 band filter, the 2 amplifier units are low noise amplifier units, and the 2 amplifier units support an operating frequency range of an N77 band low noise amplifier.

3. The module according to claim 2, wherein the filter in the N77 band has an operating frequency range of 3.3GHz to 4.2GHz, and the low noise amplifier in the N77 band has an operating frequency range of 3.3GHz to 4.2GHz.

4. The module of claim 1, wherein the module is an N79 band MIMO receiving module.

5. A die for making M modules for implementing radio frequency transmit or receive functions in different mobile systems, the die comprising: n radio frequency units with the same function; the module comprises a substrate, wherein a substrate through hole and a grounding pin are arranged in the substrate; the crystal grains are arranged on the substrate;

The radio frequency unit is used for manufacturing the M modules;

wherein, M is greater than 1, N is greater than 1, and each of the N radio frequency units with the same function is provided with a metal bump with an interconnection function;

among the N radio frequency units with the same function, a scribing groove is arranged between two adjacent radio frequency units, a metal lug with an isolation function is arranged in the scribing groove, N is larger than 1, and the scribing groove is parallel to the transmission direction of electromagnetic signals;

the radio frequency unit comprises any one of the following: a filter unit or an amplifier unit;

wherein one of the filter units or the amplifier units in the die is used for forming one receiving link in the module, the other of the filter units or the amplifier units in the die is used for forming the other receiving link in the module, and the metal bump with the isolation function is connected with the grounding pin through the substrate through hole so as to enable the die and the outside to form a grounding loop to reduce electromagnetic interference between the one receiving link and the other receiving link in the module;

6. The wafer is characterized by comprising X radio frequency units with the same function;

each of the X radio frequency units with the same function is provided with a metal bump with an interconnection function; wherein, X is greater than or equal to 2;

among the X radio frequency units with the same function, two adjacent radio frequency units are provided with scribing grooves, metal bumps with isolation functions are progressively manufactured in the scribing grooves, and the scribing grooves are parallel to the transmission direction of electromagnetic signals;

the wafer is used for obtaining a first crystal grain, the first crystal grain is used for manufacturing a module, the first crystal grain comprises N radio frequency units with the same function, and N is larger than 1; the module is used for realizing the radio frequency transmitting or receiving functions in different mobile systems; the module comprises a substrate, wherein a substrate through hole and a grounding pin are arranged in the substrate; the first crystal grain is arranged on the substrate;

Wherein one of the filter units or the amplifier units in the first die is used for forming one receiving link in the module, the other of the filter units or the amplifier units in the first die is used for forming the other receiving link in the module, and the metal bump with the isolation function is connected with the grounding pin through the substrate through hole so as to form a grounding loop between the first die and the outside ground, and reduce electromagnetic interference between the one receiving link and the other receiving link in the module;

7. A method for manufacturing a crystal grain, comprising:

providing a wafer; the wafer comprises X radio frequency units with the same function, wherein each radio frequency unit of the X radio frequency units with the same function is provided with a metal lug with an interconnection function, and X is more than or equal to 2, wherein in the radio frequency units with the same function, two adjacent radio frequency units are provided with scribing grooves, metal lugs with isolation functions are progressively manufactured in the scribing grooves, and the scribing grooves are scribing grooves parallel to the transmission direction of electromagnetic signals;

Cutting the wafer to obtain a first crystal grain; the first crystal grain comprises N radio frequency units with the same function, and N is larger than 1;

the first crystal grain is used for manufacturing a module; the module is used for realizing the radio frequency transmitting or receiving functions in different mobile systems; the module comprises a substrate, wherein a substrate through hole and a grounding pin are arranged in the substrate; the first crystal grain is arranged on the substrate;

8. A radio frequency system comprising an antenna and the module of any one of claims 1-4.