SG11201910106XA - Management system, method, and computer program for semiconductor fabrication apparatus - Google Patents
Management system, method, and computer program for semiconductor fabrication apparatusInfo
- Publication number
- SG11201910106XA SG11201910106XA SG11201910106XA SG11201910106XA SG 11201910106X A SG11201910106X A SG 11201910106XA SG 11201910106X A SG11201910106X A SG 11201910106XA SG 11201910106X A SG11201910106X A SG 11201910106XA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor fabrication
- fabrication apparatus
- component
- information
- manager
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004590 computer program Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000002131 composite material Substances 0.000 abstract 2
- 238000000605 extraction Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/174—Segmentation; Edge detection involving the use of two or more images
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31474—Icon display for quick access of detailed information
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32128—Gui graphical user interface
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Testing And Monitoring For Control Systems (AREA)
Abstract
In a semiconductor fabrication apparatus composed of a plurality of components, such as fluid control devices, a manager is to be enabled to identify components by intuition. Information on the identified component is to be provided to the manager in an easy-to-understand manner. In a system in which a manager terminal 3 and an information processor 2 are communicably configured via networks NW1 and NW2, the manager terminal 3 receives component information on a semiconductor fabrication apparatus 1 from the information processor 2. Upon the identification of the position of a component constituting the semiconductor fabrication apparatus 1 on the captured image of the semiconductor fabrication apparatus 1 using an identification processing unit 32, a compositing processing unit 33 creates a composite image in which component information is composited with the captured image at the position of the component identified, and an image display unit 34 displays the composite image. On the other hand, the information processor 2 makes reference to the component information storage unit 2A to extract the component information using an extraction processing unit 21, and transmits the component information to the manager terminal 3. FIG. 3 MANAGEMENT SYSTEM, METHOD, AND COMPUTER PROGRAM FOR SEMICONDUCTOR FABRICATION APPARATUS
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017108544 | 2017-05-31 | ||
PCT/JP2018/018668 WO2018221198A1 (en) | 2017-05-31 | 2018-05-15 | System, method and computer program for managing semiconductor manufacturing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201910106XA true SG11201910106XA (en) | 2019-11-28 |
Family
ID=64455473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201910106X SG11201910106XA (en) | 2017-05-31 | 2018-05-15 | Management system, method, and computer program for semiconductor fabrication apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US10998211B2 (en) |
JP (1) | JP7164883B2 (en) |
KR (1) | KR20190134801A (en) |
CN (1) | CN110914773A (en) |
SG (1) | SG11201910106XA (en) |
TW (1) | TWI680363B (en) |
WO (1) | WO2018221198A1 (en) |
Family Cites Families (41)
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JP2003343761A (en) | 2002-05-30 | 2003-12-03 | Idemitsu Kosan Co Ltd | Valve operation support system |
JP2006073841A (en) * | 2004-09-03 | 2006-03-16 | I-Pulse Co Ltd | Inspection device of mounted substrate |
JP2006258151A (en) | 2005-03-16 | 2006-09-28 | Hitachi Software Eng Co Ltd | Valve management support system |
JP4926817B2 (en) * | 2006-08-11 | 2012-05-09 | キヤノン株式会社 | Index arrangement information measuring apparatus and method |
CN102045484B (en) * | 2009-10-22 | 2013-10-16 | 罗姆股份有限公司 | Scanning device and scanning assisting device |
JP5812599B2 (en) * | 2010-02-25 | 2015-11-17 | キヤノン株式会社 | Information processing method and apparatus |
US20110309842A1 (en) * | 2010-06-16 | 2011-12-22 | Broadcom Corporation | Identifying Defective Semiconductor Components on a Wafer Using Thermal Imaging |
JP5739674B2 (en) * | 2010-09-27 | 2015-06-24 | 任天堂株式会社 | Information processing program, information processing apparatus, information processing system, and information processing method |
JP5126334B2 (en) * | 2010-10-13 | 2013-01-23 | コニカミノルタビジネステクノロジーズ株式会社 | Image processing system, image processing apparatus control method, image processing apparatus, portable terminal, information processing apparatus, and control program |
JP5799545B2 (en) * | 2010-12-07 | 2015-10-28 | キヤノンマーケティングジャパン株式会社 | File management device, file management system, control method, program |
JP5178860B2 (en) * | 2011-02-24 | 2013-04-10 | 任天堂株式会社 | Image recognition program, image recognition apparatus, image recognition system, and image recognition method |
JP5370398B2 (en) * | 2011-03-15 | 2013-12-18 | オムロン株式会社 | Image processing apparatus and image processing program |
US10242456B2 (en) * | 2011-06-23 | 2019-03-26 | Limitless Computing, Inc. | Digitally encoded marker-based augmented reality (AR) |
CN104272431B (en) * | 2012-07-03 | 2017-03-08 | 东京毅力科创株式会社 | The monitoring arrangement of manufacturing equipment and supervision method |
US10380469B2 (en) * | 2012-07-18 | 2019-08-13 | The Boeing Company | Method for tracking a device in a landmark-based reference system |
WO2014030256A1 (en) | 2012-08-24 | 2014-02-27 | 富士機械製造株式会社 | Electrical circuit fabrication line assistance system |
US9111383B2 (en) * | 2012-10-05 | 2015-08-18 | Elwha Llc | Systems and methods for obtaining and using augmentation data and for sharing usage data |
WO2014069247A1 (en) * | 2012-11-02 | 2014-05-08 | ソニー株式会社 | Image processing device, image processing method, and program |
JP6221027B2 (en) | 2012-12-21 | 2017-11-01 | 株式会社オサシ・テクノス | Instrument management system and program based on augmented reality technology |
CN103919525B (en) * | 2013-01-14 | 2016-12-28 | 荣晶生物科技股份有限公司 | The method of stitching image and camera system |
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JP6435099B2 (en) * | 2014-02-26 | 2018-12-05 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
EP3009833B1 (en) * | 2014-10-14 | 2020-12-02 | Airbus Defence And Space Gmbh | In-process error checking by means of augmented reality |
JP6424601B2 (en) * | 2014-12-10 | 2018-11-21 | 富士通株式会社 | Display control method, information processing program, and information processing apparatus |
JP6806049B2 (en) * | 2015-04-09 | 2021-01-06 | 日本電気株式会社 | Information processing equipment, information processing system, location notification method and program |
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US20160358383A1 (en) * | 2015-06-05 | 2016-12-08 | Steffen Gauglitz | Systems and methods for augmented reality-based remote collaboration |
US10192133B2 (en) * | 2015-06-22 | 2019-01-29 | Seiko Epson Corporation | Marker, method of detecting position and pose of marker, and computer program |
JP6498564B2 (en) | 2015-08-20 | 2019-04-10 | 日置電機株式会社 | Processing apparatus, substrate inspection apparatus, processing method, and substrate inspection method |
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WO2017116512A1 (en) * | 2015-12-28 | 2017-07-06 | Metritrack, Inc. | System and method for the coregistration of medical image data |
CN108604393B (en) * | 2016-03-04 | 2022-12-30 | 日铁系统集成株式会社 | Information processing system, information processing device, information processing method, and computer-readable storage medium |
US10649198B2 (en) * | 2016-03-11 | 2020-05-12 | Battelle Memorial Institute | Sample processing and analysis methods and apparatus |
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KR101892740B1 (en) * | 2016-10-11 | 2018-08-28 | 한국전자통신연구원 | Method for generating integral image marker and system for executing the method |
KR20180041890A (en) * | 2016-10-17 | 2018-04-25 | 삼성전자주식회사 | Method and apparatus for displaying virtual objects |
US20190358547A1 (en) * | 2016-11-14 | 2019-11-28 | Lightcraft Technology Llc | Spectator virtual reality system |
CA3050177A1 (en) * | 2017-03-10 | 2018-09-13 | Brainlab Ag | Medical augmented reality navigation |
-
2018
- 2018-05-15 WO PCT/JP2018/018668 patent/WO2018221198A1/en active Application Filing
- 2018-05-15 SG SG11201910106X patent/SG11201910106XA/en unknown
- 2018-05-15 US US16/615,398 patent/US10998211B2/en active Active
- 2018-05-15 KR KR1020197033983A patent/KR20190134801A/en not_active Application Discontinuation
- 2018-05-15 JP JP2019522089A patent/JP7164883B2/en active Active
- 2018-05-15 CN CN201880032768.3A patent/CN110914773A/en active Pending
- 2018-05-24 TW TW107117705A patent/TWI680363B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201910952A (en) | 2019-03-16 |
TWI680363B (en) | 2019-12-21 |
KR20190134801A (en) | 2019-12-04 |
WO2018221198A1 (en) | 2018-12-06 |
US20200185242A1 (en) | 2020-06-11 |
US10998211B2 (en) | 2021-05-04 |
JP7164883B2 (en) | 2022-11-02 |
JPWO2018221198A1 (en) | 2020-04-09 |
CN110914773A (en) | 2020-03-24 |
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