SG11201908799RA - Three-dimensional semiconductor fabrication - Google Patents
Three-dimensional semiconductor fabricationInfo
- Publication number
- SG11201908799RA SG11201908799RA SG11201908799RA SG11201908799RA SG 11201908799R A SG11201908799R A SG 11201908799RA SG 11201908799R A SG11201908799R A SG 11201908799RA SG 11201908799R A SG11201908799R A SG 11201908799RA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- pct
- applicant
- rule
- lehi
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
- 238000004886 process control Methods 0.000 abstract 1
- 238000004088 simulation Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/12—Etching of semiconducting materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00539—Wet etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Weting (AREA)
- Peptides Or Proteins (AREA)
Abstract
FIG120 k 100 =/,-- 130 148 FOCUSING LENS L26 102 114 18 COMPUTING DEVICE D ---- \", DATA STORE ,...,_ \ SIMULATION RESULTS PROCESSOR 136 \ __-•• MEMORY 138 PROCESS CONTROL COMPONENT 142 ETCH MODELING 158 COMPONENT PHYSICS MODEL 160 140 106 122 LASER 1561 150 TEMPERATURE CONTROLLER 152 109 162 104 110 124 . 146: 144 108 134 132 116 154 118 COMPOSITION CONTROLLER (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 04 October 2018 (04.10.2018) WIP0 I PCT mu °million °nolo HE mil 0111E11°0mm° oimIE (10) International Publication Number WO 2018/183867 Al (51) International Patent Classification: HO1L 21/3213 (2006.01) (21) International Application Number: PCT/US2018/025428 AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(ii)) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) (22) International Filing Date: 30 March 2018 (30.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/480,259 31 March 2017 (31.03.2017) US 62/618,205 17 January 2018 (17.01.2018) US (71) Applicant: NIELSON SCIENTIFIC, LLC [US/US]; 2778 N 600 E, Lehi, Utah 84043 (US). (72) Inventor: NIELSON, Gregory Nolan; 2778 N 600 E, Lehi, Utah 84043 (US). (74) Agent: MEDLEY, Michael J.; Medley, Behrens & Lewis, LLC, 6100 Rockside Woods Blvd., Independence, Ohio 44131 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, (54) Title: THREE-DIMENSIONAL SEMICONDUCTOR FABRICATION 1-1 N Cr) 00 1-1 © (57) : Various technologies are described herein pertaining to electrochemical etching of a semiconductor controlled by way C of a laser that emits light with an energy below a bandgap energy of the semiconductor. [Continued on next page] WO 2018/183867 Al MIDEDIMOMMIDEFIEOMEMIDERIEHMEMOIS Published: — with international search report (Art. 21(3))
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762480259P | 2017-03-31 | 2017-03-31 | |
US201862618205P | 2018-01-17 | 2018-01-17 | |
PCT/US2018/025428 WO2018183867A1 (en) | 2017-03-31 | 2018-03-30 | Three-dimensional semiconductor fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201908799RA true SG11201908799RA (en) | 2019-10-30 |
Family
ID=63677084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201908799R SG11201908799RA (en) | 2017-03-31 | 2018-03-30 | Three-dimensional semiconductor fabrication |
Country Status (8)
Country | Link |
---|---|
US (2) | US11421338B2 (en) |
EP (1) | EP3602613B1 (en) |
JP (2) | JP7311901B2 (en) |
KR (1) | KR102664174B1 (en) |
CN (1) | CN110800089B (en) |
IL (1) | IL269706A (en) |
SG (1) | SG11201908799RA (en) |
WO (1) | WO2018183867A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11421338B2 (en) | 2017-03-31 | 2022-08-23 | Nielson Scientific, Llc | Three-dimensional semiconductor fabrication |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200190452A1 (en) * | 2017-09-05 | 2020-06-18 | Nielson Scientific, Llc | Three-dimensional silicon scaffold for tissue engineering |
JP7422586B2 (en) * | 2020-03-30 | 2024-01-26 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3608604A1 (en) * | 1986-03-14 | 1987-09-17 | Siemens Ag | Patternable photoelectrochemical removal |
GB2203892A (en) | 1987-04-24 | 1988-10-26 | Philips Electronic Associated | A method of etching a semiconductor body |
US5081002A (en) | 1989-04-24 | 1992-01-14 | The Trustees Of Columbia University In The City Of New York | Method of localized photohemical etching of multilayered semiconductor body |
US5032896A (en) * | 1989-08-31 | 1991-07-16 | Hughes Aircraft Company | 3-D integrated circuit assembly employing discrete chips |
US5338416A (en) * | 1993-02-05 | 1994-08-16 | Massachusetts Institute Of Technology | Electrochemical etching process |
US5348627A (en) * | 1993-05-12 | 1994-09-20 | Georgia Tech Reserach Corporation | Process and system for the photoelectrochemical etching of silicon in an anhydrous environment |
JPH08221109A (en) | 1995-02-09 | 1996-08-30 | Meidensha Corp | Robot controller |
US5804090A (en) * | 1995-03-20 | 1998-09-08 | Nissan Motor Co., Ltd. | Process for etching semiconductors using a hydrazine and metal hydroxide-containing etching solution |
JP3461089B2 (en) * | 1996-08-22 | 2003-10-27 | 大日本印刷株式会社 | Etching simulation equipment |
GB9816168D0 (en) * | 1998-07-25 | 1998-09-23 | Secr Defence | Etching method |
CA2298492A1 (en) * | 1999-02-19 | 2000-08-19 | Hyun-Kuk Shin | Micro-lens, combination micro-lens and vertical cavity surface emitting laser, and methods for manufacturing the same |
WO2001091170A1 (en) * | 2000-05-24 | 2001-11-29 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for radiation-assisted electrochemical etching, and etched product |
WO2001091772A2 (en) | 2000-06-01 | 2001-12-06 | Theralife, Inc. | Compositions for treating eye discomfort containing herbals and/or nutritional supplements and/or minerals and/or vitamins |
JP2002026491A (en) | 2000-07-06 | 2002-01-25 | Seiko Epson Corp | Plating method of printed circuit board, packaging structure body, liquid crystal device, and method for manufacturing liquid crystal device |
JP2002314110A (en) * | 2001-02-07 | 2002-10-25 | Ebara Corp | Solar cell and its manufacturing method |
JP2004311955A (en) * | 2003-03-25 | 2004-11-04 | Sony Corp | Method for manufacturing very thin electro-optical display device |
JP2004310056A (en) * | 2003-03-25 | 2004-11-04 | Sony Corp | Method and apparatus for manufacturing ultra-thin electrooptical display device |
JP4622720B2 (en) * | 2004-07-21 | 2011-02-02 | 日亜化学工業株式会社 | Method for manufacturing nitride semiconductor wafer or nitride semiconductor device |
US7867907B2 (en) | 2006-10-17 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP5693074B2 (en) | 2010-07-26 | 2015-04-01 | 浜松ホトニクス株式会社 | Laser processing method |
US8987091B2 (en) * | 2011-12-23 | 2015-03-24 | Intel Corporation | III-N material structure for gate-recessed transistors |
KR20140140053A (en) * | 2012-02-26 | 2014-12-08 | 솔렉셀, 인크. | Systems and methods for laser splitting and device layer transfer |
AU2016224950B2 (en) * | 2015-02-24 | 2021-01-28 | The University Of Ottawa | Localizing nanopore fabrication on a membrane by laser illumination during controlled breakdown |
JP6303088B2 (en) * | 2016-02-10 | 2018-04-04 | 国立研究開発法人理化学研究所 | Laser beam shaping device, removal processing device, and annular phase element |
US11421338B2 (en) | 2017-03-31 | 2022-08-23 | Nielson Scientific, Llc | Three-dimensional semiconductor fabrication |
-
2018
- 2018-03-30 US US16/498,960 patent/US11421338B2/en active Active
- 2018-03-30 WO PCT/US2018/025428 patent/WO2018183867A1/en active Application Filing
- 2018-03-30 SG SG11201908799R patent/SG11201908799RA/en unknown
- 2018-03-30 CN CN201880023525.3A patent/CN110800089B/en active Active
- 2018-03-30 EP EP18776879.1A patent/EP3602613B1/en active Active
- 2018-03-30 KR KR1020197031187A patent/KR102664174B1/en active IP Right Grant
- 2018-03-30 JP JP2020502525A patent/JP7311901B2/en active Active
-
2019
- 2019-09-26 IL IL26970619A patent/IL269706A/en unknown
-
2022
- 2022-07-10 US US17/861,244 patent/US12031227B2/en active Active
-
2023
- 2023-04-11 JP JP2023064112A patent/JP2023089111A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11421338B2 (en) | 2017-03-31 | 2022-08-23 | Nielson Scientific, Llc | Three-dimensional semiconductor fabrication |
US12031227B2 (en) | 2017-03-31 | 2024-07-09 | Nielson Scientific, Llc | Three-dimensional semiconductor fabrication |
Also Published As
Publication number | Publication date |
---|---|
WO2018183867A1 (en) | 2018-10-04 |
JP2023089111A (en) | 2023-06-27 |
JP7311901B2 (en) | 2023-07-20 |
US11421338B2 (en) | 2022-08-23 |
EP3602613A4 (en) | 2021-01-13 |
EP3602613B1 (en) | 2024-05-01 |
CN110800089A (en) | 2020-02-14 |
EP3602613A1 (en) | 2020-02-05 |
EP3602613C0 (en) | 2024-05-01 |
CN110800089B (en) | 2024-03-08 |
IL269706A (en) | 2019-11-28 |
US20220349084A1 (en) | 2022-11-03 |
US20210104410A1 (en) | 2021-04-08 |
KR102664174B1 (en) | 2024-05-10 |
KR20190137107A (en) | 2019-12-10 |
US12031227B2 (en) | 2024-07-09 |
JP2020513165A (en) | 2020-04-30 |
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